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Trends in industrial computing
Digitimes trackes the latest trends in industrial computing applications, including IoT, Industry 4.0 and automation and robotics.
IN THE NEWS
Thursday 29 December 2022
Gudeng dismisses speculation about withdrawal from China
Taiwan-based EUV pod and reticle box supplier Gudeng Precision Industrial reportedly has stopped shipments to Chinese clients, sparking market speculation that it might withdraw from...
Monday 26 December 2022
TXOne eyes leadership in supply chain cybersecurity technology
Taiwan-based TXOne Networks, an industrial control system (ICS) and industrial IoT (IIoT) security startup jointly founded by Trend Micro and Moxa, has newly set up an OT (operational...
Friday 23 December 2022
Nordic Semiconductor showcases leading Bluetooth LE, Matter, low-power Wi-Fi, and cellular IoT technology at CES 2023
Nordic Semiconductor will bring its full portfolio of wireless IoT products to CES 2023 on booth 52039 at the Venetian Expo. Highlights on the booth will include the company's Matter...
Wednesday 21 December 2022
6G to enter commercialization in 2030, says DIGITIMES Research
The year 2030 will enter the era of 6G, which means that wherever you go, there will be full network coverage on the land, sea and air, and by that year there will be 97.2 billion...
Monday 12 December 2022
Arm Tech Symposium 2022 China highlights software-defined car trend
Arm Tech Symposium 2022 China, held in early December, focused on discussing the software-defined car trend and four topics that highlight vehicle development in the post-Moore's...
Thursday 1 December 2022
Tera Autotech upbeat about 2023 orders
Automation equipment manufacturer Tera Autotech expects customer orders in 2023 to be higher than 2022 levels, despite unfavorable macro conditions, said chairman Yi-Lung Lee.
Friday 25 November 2022
Silicon IP provider M31 gains from China IC self-sufficiency drive
Taiwan-based silicon IP provider M31 Technology has benefited significantly from semiconductor self-supply campaign in China, with the ratio of revenues contributed by Chinese clients...
Thursday 24 November 2022
AI-based EDA tools increasingly crucial for IC design process
With the increasing diversity of end-use applications, IC design houses are facing increasing challenges in product design, and how to shorten the time to market for new products...
Tuesday 22 November 2022
Rising VCM sales boost Audix gross margin in 3Q22
Taiwan-based Audix saw its gross margin grow to a 40-quarter high of nearly 27% in Q3 2022 from Q2's 18.92%, thanks to strong sales of voice coil motor (VCM) components used in handset...
Tuesday 15 November 2022
Nexcom optimistic about demand for automation, smart manufacturing
Industrial PC maker Nexcom International expects demand for automation and smart manufacturing to remain strong in 2023 despite macro headwinds challenging many industry sectors.
Monday 14 November 2022
IC distributors expanding deployments in non-consumer, WBG chip segments
IC distributors are aggressively expanding their deployments in non-consumer chips products and third-generation semiconductors like GaN and SiC devices that remain in stable demand...
Friday 11 November 2022
MIH proposes seamless EV information security framework
EVs will massively incorporate intelligent functions including autonomous driving in the future, and therefore information security associated with data transmission among diverse...
Monday 7 November 2022
MCU demand remains stable for automotive applications
MCU demand for PC and other consumer electronics applications is expected to see a larger fall in the fourth quarter than in the third, and only 32-bit MCUs for automotive and industrial...
Monday 7 November 2022
Winbond sees 3Q22 profit hit 6-quarter low
Winbond Electronics, a maker of specialty DRAM and flash memory, has reported net profits falling 48.2% sequentially to a six-quarter low of NT$2.67 billion (US$83.1 million) in the...
Wednesday 2 November 2022
3D IC packaging to develop faster under US trade sanctions against China, says AP Memory chair
For mature manufacturing process, 3D IC packaging is expected to become their alternative solution to advanced processes and will develop faster than expected under the latest US...