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Winbond to acquire land for R&D site near Hsinchu

Press release, January 2; Eric Mah, DIGITIMES Asia Tuesday 2 January 2007 0

The board of directors of Winbond Electronics on December 29 approved a plan to spend about NT$700 million (US$21.6 million) to acquire approximately 1500 ping (54,375 square feet) of commercial land close to the Hsinchu station of Taiwan's High-Speed...

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