Taipei, Wednesday, December 13, 2017 07:53 (GMT+8)
cloudy
Taipei
18°C
VIA unveils a new form factor smaller than Mini-ITX
Press release, March 3; Joseph Tsai, DIGITIMES [Tuesday 3 March 2009]

VIA Technologies has announced its latest board form factor for embedded system developers, the Em-ITX form factor. Offering embedded developers a compact, versatile and highly integrated board form factor, VIA's Em-ITX establishes a standard for ultra-slim embedded devices.

The Em-ITX form factor is a new open industry standard defined by VIA, and is 30% more compact than Mini-ITX, yet offers 200% more I/O real estate. At 12×17cm, the Em-ITX form factor includes unique dual I/O coastlines and an exclusive Em-IO expansion bus to bring flexibility and scalability, said VIA. Benefits also include reduced time-to-market cycles for developers and access to a scalable processor platform that includes the 64-bit VIA Nano processor.

Embedded boards based on the Em-ITX form factor could form a base for industrial automation, digital signage, kiosk and other applications requiring an ultra-slim embedded device, highlighted VIA.

The VIA developed Em-ITX form factor specification includes dual I/O coastlines: I/O inputs can be found on both 17cm edges of the board. This design reduces cable clutter facilitating more compact and robust designs while also boosting signal integrity and improving airflow, said VIA. A variety of connectors are available on these two I/O coastlines, including COM (RS-232/422/485), RJ45, DVI, VGA, LVDS, USB 2.0 and DC power signals.

The Em-ITX form factor utilizes the Em-IO expansion bus to integrate with stackable, customizable, expansion modules. The Em-IO expansion bus integrates the majority of popular bus signal technologies, including USB 2.0, GPIO, LPC, PCIe, IDE, IEEE 1394, SATA, PCI, DVI, HDMI, Gigabit Ethernet and Card Bus signals.

Products based on the Em-ITX form factor will be available early next month.

In other news, VIA recently announced net sales of NT$388.85 million (US$11.13 million) for February of 2009, an increase of 5.86% on month.

A technical drawing of Em-ITX board and expansion module

A technical drawing of Em-ITX board and expansion module
Photo: Company

Realtime news
  • SJ Semi signs purchase agreement with Advantest

    Before Going to Press | 10h 21min ago

  • China LED suppliers begin to slash prices

    Before Going to Press | 10h 22min ago

  • Parade November performance meets market expectations

    Before Going to Press | 10h 23min ago

  • FocalTech to ship 60 million TDDI chips in 2017

    Before Going to Press | 10h 24min ago

  • GET to raise NT$600 million via private placement

    Before Going to Press | 10h 24min ago

  • Taiwan market: Aruba bullish in local market

    Before Going to Press | 10h 25min ago

  • Tsinghua Unigroup to join Lite-On subsidiary in Suzhou

    Before Going to Press | 10h 25min ago

  • Win Semi to buy HBT production equipment from Avago

    Before Going to Press | 10h 28min ago

Pause
 | 
View more
UMC
China AMOLED panel capacity expansion forecast, 2016-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.