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Heterogeneous integration and system-level integration seen as 'next step' in advanced packaging era

Julian Ho, Taipei; Jerry Chen, DIGITIMES Asia Thursday 2 November 2023 0

Credit: DIGITIMES

With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.

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