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Disco plans investment for new semiconductor materials plant, responding to global demand surge

Chiang, Jen-Chieh, Taipei; Jingyue Hsiao, DIGITIMES Asia Tuesday 16 January 2024 0

Credit: AFP

According to Nikkei, Japan-based semiconductor equipment provider Disco is anticipated to invest over JPY40 billion (US$273.8 million) to build a plant in Kure, Hiroshima Prefecture, to produce materials used in the cutting and grinding semiconductor...

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