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TSMC ramping up CoWoS capacity

Monica Chen, Hsinchu; Rodney Chan, DIGITIMES Asia Friday 1 March 2024 0

Credit: DIGITIMES

TSMC has been increasing its monthly production capacity for CoWoS (chip-on-wafer-on-substrate) advanced packaging, allowing it to increase AI GPU output for Nvidia and AMD, which in turn is boosting server and graphics card shipments from Taiwanese...

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