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Samsung denies rumors about applying MR-MUF to improve HBM yield

Ollie Chang, Taipei; Judy Lin, DIGITIMES Asia Wednesday 13 March 2024 0

Credit: DIGITIMES

Refuting a Reuters report citing five people stating that Samsung Electronics will apply Mass Reflow Molded Underfill (MR-MUF) technology, which is the process used by SK Hynix, Samsung sent out an official statement that read, "Contrary to...

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