Taipei, Saturday, July 26, 2014 02:31 (GMT+8)
partly cloudy
Taipei
26°C
300mm wafer from UMC with 11 copper layers
Photo: Vyacheslav Sobolev, DigiTimes [May 4, 2006]

SemiTech Taipei 2006: UMC showcases a 300mm wafer with 11 copper layers, manufactured on a 65nm process using triple-gate oxide (TGO) technology

Analysis of China revised domestic semiconductor industry goals
DIGITIMES Marketing Services
2014 global mobile application processor market forecast