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Monday 31 March 2025
Cincoze launches 15.6-inch FHD panel PC and monitor for industrial and outdoor applications
Rugged embedded computer brand Cincoze has added a new 15.6-inch FHD display option for HMI applications in harsh environments to its Display Computing – CRYSTAL product line...
Friday 28 March 2025
TAcc+ leading Taiwan-UK space delegation to showcase achievements at Space-Comm Expo
People growingly rely on their phones for navigating via GPS, communicating via satellite and checking weather forecasts. All these services that make our life more intelligent and convenient are made possible by space technology breakthroughs.
Wednesday 19 March 2025
Chenbro showcases latest AI server chassis solutions at Nvidia GTC 2025
Chenbro makes its first appearance at Nvidia GTC 2025, displaying the Nvidia GB300 Grace Blackwell Ultra Superchip compute tray and a full range of AI server chassis solutions based on the Nvidia MGX architecture, including 1U, 2U, and 4U models...
Wednesday 19 March 2025
BIWIN Mini SSD: Innovative storage expansion solution for edge AI era
As edge AI applications experience rapid proliferation, intelligent terminal devices, such as ultra-thin laptops, tablets, and AI edge computing terminals, are facing exponentially growing demands for storage performance and capacity. However, conventional storage solutions are increasingly revealing their inherent shortcomings:
Wednesday 19 March 2025
SK Hynix ships world's first 12-layer HBM4 samples to customers
SK Hynix Inc. (or "the company") announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time in the world.
Tuesday 18 March 2025
Taiwan to hold hackathon aiming to build exemplary generative AI applications
To cope with the disruptive changes that generative AI is bringing across all sectors, companies today have soaring needs for AI talents with real-world experience, global vision and bilingual proficiency...
Thursday 13 March 2025
GUC announces successful launch of industry's first 32G UCIe silicon on TSMC 3nm and CoWoS technology
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving a data rate of 32 Gbps per lane, the highest speed defined in the UCIe specification...
Wednesday 12 March 2025
SK Hynix named as the world's most ethical companies honoree
SK Hynix Inc. (or "the company") announced today that it has received the 2025 World's Most Ethical Companies® recognition by Ethisphere*, a global leader in defining and advancing the standards of ethical business practices, marking the first case for a Korean semiconductor company to be named as an honoree.
Thursday 6 March 2025
DEEPX ramps up mass-production chip supply for the global market, bolstering tangible business expansion
AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.
Tuesday 4 March 2025
Darveen at Embedded World 2025: Showcasing industry-focused rugged computing solutions
Darveen Co., Ltd., a global provider specializing in rugged industrial computer solutions, is pleased to announce its participation in Embedded World 2025, one of the largest global platforms for the embedded community. The event will take place in Nuremberg, Germany, from March 11 to 13, 2025...