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Thursday 10 April 2025
Altair expands EDA footprint, offering diverse system-level verification and simulation tools
The application of artificial intelligence (AI) has emerged as a driving force behind global technological innovation. As AI adoption proliferates, the mastery of semiconductor chip technology becomes paramount for success. The escalating complexity and design costs of chips are fueling the rapid evolution of electronic design automation (EDA) and upstream chip design solutions...
Wednesday 9 April 2025
APD unveils next-generation GaN medical power supplies to highlight CMEF 2025
With the rapid expansion of the global medical devices market, the field of medical power supplies is undergoing technological innovations focusing on third-generation semiconductor materials. This year, at the China International Medical Equipment Fair (CMEF) from Apr 8 to 11, APD showcased a full range of medical power supplies, including its next-generation GaN medical power supplies.
Tuesday 8 April 2025
Macronix introduces all new ArmorBoot MX76 to meet demand for security and high performance in AI, smart healthcare, and automotive IoT markets
Macronix, a leading global non-volatile memory (NVM) integrated device manufacturer, has launched its all-new ArmorBoot MX76 series flash memory. The ArmorBoot MX76 is designed for rapid initialization of electronic devices in diverse application scenarios...
Monday 7 April 2025
Darveen RTC-I116 rugged tablet enhances performance for manufacturing and warehouse workers
Taipei, Taiwan, March 27, 2025 – As a global provider of rugged industrial computer solutions, Darveen recognizes rugged tablets as the ideal companion for manufacturing. From warehouses to shop floors, these devices enable workers to access key data anytime, significantly boosting operational efficiency...
Wednesday 2 April 2025
GUC announces tape-out of the world's first HBM4 IP on TSMC N3P
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented using TSMC's cutting-edge N3P process technology and CoWoS-R advanced packaging technology.
Tuesday 1 April 2025
Memory supply tightens: Why forecasts matter more than inventory
The memory market is undergoing a significant transformation as suppliers pivot from traditional inventory-based models to forecast-driven production.
Monday 31 March 2025
Cincoze launches 15.6-inch FHD panel PC and monitor for industrial and outdoor applications
Rugged embedded computer brand Cincoze has added a new 15.6-inch FHD display option for HMI applications in harsh environments to its Display Computing – CRYSTAL product line...
Friday 28 March 2025
TAcc+ leading Taiwan-UK space delegation to showcase achievements at Space-Comm Expo
People growingly rely on their phones for navigating via GPS, communicating via satellite and checking weather forecasts. All these services that make our life more intelligent and convenient are made possible by space technology breakthroughs.
Wednesday 19 March 2025
Chenbro showcases latest AI server chassis solutions at Nvidia GTC 2025
Chenbro makes its first appearance at Nvidia GTC 2025, displaying the Nvidia GB300 Grace Blackwell Ultra Superchip compute tray and a full range of AI server chassis solutions based on the Nvidia MGX architecture, including 1U, 2U, and 4U models...