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News tagged 14nm
  • Last update: Thursday 19 October 2017 [119 news items]

Will Mong-song Liang face another trade secrets lawsuit?

Oct 19, 12:49

Mong-song Liang, who had overseen advanced process R&D at TSMC and Samsung Foundry, has recently begun his new stint at another IC foundry, SMIC. In his new role, Liang is expected...

Intel readies Coffee Lake lineup

Oct 6, 14:23

Intel has released its Coffee Lake-based 14nm desktop processors including Core i7-8700K/8700, Core i5-8600K/8400 and Core i3-8350K/8100, as well as the corresponding Z370 chipsets...

Intel new 8th-generation desktop processors

Winbond to break ground on new 12-inch fab in mid-2018

Sep 27, 14:11

Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to break ground on a new 12-inch wafer plant at the Kaohsiung Science Park (KSP),...

Globalfoundries to roll out 12nm FinFET technology for high-performance devices

Sep 22, 10:30

Globalfoundries has announced plans to introduce a new 12nm leading-performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density...

Intel provides 10nm updates, plan for 10nm FPGA

Sep 20, 10:49

Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...

SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology

Sep 18, 11:08

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...

Samsung intros 11nm LPP process; 7nm LPP with EUV on schedule

Sep 12, 10:47

Samsung Electronics has added 11nm FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with a wider range of options for...

SPIL obtains packaging orders for AMD Vega 11 GPUs

Sep 8, 15:17

AMD will continue to contract Globalfoundries to manufacture its next-generation Vega GPUs, and will have Siliconware Precision Industries (SPIL) as its major packager for the chips,...

TSMC CoWoS eyeing bigger presence in supercomputer field

Digitimes Research: Taiwan top-3 foundries combined revenues to rise 13% in 3Q17

Sep 4, 14:14

Combined revenues of Taiwan's top-3 foundries - Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) - are...

China AI startup Cambricon receives new funding of US$100 million

Aug 24, 15:35

China-based AI chip startup Cambricon Technologies has newly raised US$100 million in series A round funding to support its development of advanced AI chips, which is expected to...

Asustek, Acer to roll out notebooks using Intel new CPUs starting September

Aug 23, 12:59

Leading notebook vendors, such as Taiwan's Asustek Computer and Acer, and many other international brands, will roll out their new 2-in-1 and ultra-thin notebook models utilizing...

China to phase in 14nm semiconductor process in 2018, says top tech master

Aug 22, 15:47

China is proceeding with systematic deployments in 14nm semiconductor fabrication equipment, process, packaging and materials, which will be fully industrialized in 2018. And the...

Ye Tianchun, director of Institute of Microelectronics, Chinese Academy of Science

Qualcomm to extend tie-up with TSMC, says executive

Aug 21, 13:50

Qualcomm has been working with Taiwan's semiconductor firms for years, including an almost 10-year collaboration with TSMC, said Sudeepto Roy, VP of engineering for Qualcomm Technology...

Qualcomm will extend its collaboration with TSMC to FinFET process

Dialog looking to extend partnership with Spreadtrum

Aug 18, 10:22

Dialog Semiconductor is looking to extend its partnership with Spreadtrum Communication, and does not rule out forming a joint venture with the China-based mobile SoC provider, said...

Christophe Chene, senior VP of Asia for Dialog

Globalfoundries demos 2.5D HBM solution

Aug 16, 09:33

Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...

Globalfoundries intros solution leveraging 2.5D packaging with low-latency

MediaTek under pressure to cut chip prices

Aug 15, 11:29

With Qualcomm lowering prices for its Snapdragon 450 chips to less than US$10.50, MediaTek is under pressure to cut prices for its upcoming Helio P23 series designed for mid-range...

MediaTek has lowered prices for its upcoming Helio P23 chips to secure orders

Synopsys launches complete HBM2 IP solution offering

Aug 8, 09:52

EDA vendor Synopsys has introduced its complete DesignWare high bandwidth memory-2 (known as HBM2) IP solution consisting of controller, PHY and verification IP, enabling designers...

Synopsys HBM2 PHY and VC verification IP available for 14nm and 7nm processes

UMC planning 28HPC, 22ULP processes

Jul 27, 09:03

United Microelectronics (UMC) is looking to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, which will become available in 2018. The foundry also plans...

UMC to expand its 28nm process offering

UMC expects flat 3Q17

Jul 26, 21:35

United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the third quarter of 2017. The guidance is lower than market watchers' estimates of...

MediaTek to transfer 28nm chip orders to UMC

Jul 25, 09:16

MediaTek plans to transfer part of its 28nm mobile chip orders, including those for the Amazon Echo Dot, to United Microelectronics (UMC) from Taiwan Semiconductor Manufacturing Company...

MediaTek

FD-SOI a promising technology: Q&A with Globalfoundries CEO Sanjay Jha

Jul 19, 10:37

Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...

Globalfoundries CEO

Qualcomm expanding mobile chip offering for mid-range smartphones

Jun 29, 10:37

Qualcomm has introduced its Snapdragon 450-series mobile chips, a new entry to the Snapdragon 400 mobile platform tier designed for mid-range smartphones and tablets. The Snapdragon...

SMIC mass producing 28nm HKMG chips

Jun 26, 20:45

Semiconductor Manufacturing International's (SMIC) 28nm HKMG process has entered its mass production stage, according to company CEO Haijun Zhao. SMIC will move forward making chips...

smic

TSMC secures 7nm chip orders from Qualcomm

Jun 21, 21:36

TSMC has regained chip orders from Qualcomm for baseband chips produced on its 7nm process, but not application processors, according to industry sources.

AMD launches Zen-based datacenter processors and new GPU accelerators for servers

Jun 21, 12:17

AMD has launched its EPYC 7000 series high-performance datacenter processors. AMD was joined by multiple customers and partners at the global launch event on June 20 in presenting...

AMD EPYC datacenter processor

Globalfoundries launches 7LP FinFET process

Jun 14, 20:56

Globalfoundries has announced the availability of its 7nm leading-performance (7LP) FinFET semiconductor technology, delivering a 40% generational performance boost to meet the needs...

Toppan welcomes partnership with China firms

Jun 13, 15:22

Toppan Printing welcomes the potential for China-based companies to become partners, according to the Japan-based photomask vendor. Toppan is looking to work closely with China-based...

Intel sees fierce competition in manufacturing process

Jun 13, 13:49

Intel is confident about chips made on its 14nm process, but is lagging behind competitors on the 10nm node. Its 10nm Cannonlake processors will not become available until the second...

MediaTek to enter mass production of 12nm mobile chips by end of 2017

Jun 1, 15:20

MediaTek is expected to start mass production of 12nm mobile chips manufactured by Taiwan Semiconductor Manufacturing Company around the end of 2017, according to industry sources...

AMD ramping shipments of Ryzen 7, Ryzen 5 CPUs

May 17, 15:22

Demand for AMD's Ryzen 7- and Ryzen 5-series CPU products has continued rising, which may allow the chipmaker to narrow its losses to below US$50 million for the second quarter of...

TSMC obtains 12nm chip orders from fabless firms

May 11, 11:59

Taiwan Semiconductor Manufacturing Company (TSMC) has secured 12nm chip orders from Nvidia, MediaTek, Silicon Motion Technology and HiSilicon for the fabless firms' different chip...

SMIC urges Taiwan chipmakers to partner with China-based peers

May 5, 11:24

The Taiwan government should encourage its local chipmakers to collaborate with their China-based peers to create a win-win for both sides' semiconductor industries, according to...

UMC to roll out 22nm process as early as 2018

Apr 28, 11:46

Foundry chipmaker UMC has disclosed plans to roll out 22nm process technology as early as 2018. UMC has started IP development for its 22nm process, and expects to introduce the node...

UMC planning 22nm process technology

UMC expects flat performance in 2Q17

Apr 27, 11:08

United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the second quarter of 2017, when the foundry chipmaker's capacity utilization rate...

AMEC aims to grow revenues to CNY2 billion in 2020

Apr 24, 11:28

Advanced Micro-Fabrication Equipment (AMEC) aims to grow its revenues to CNY2 billion (US$290.4 million) in 2020, and is striving to be among the world's top-5 semiconductor equipment...

AMEC CEO Gerald Yin
119 items [1/4]
  • Asustek+ZenFone+3+Zoom+smartphone

    Asustek ZenFone 3 Zoom smartphone

    Asustek Computer has announced ZenFone 3 Zoom, an ultra-thin 5.5-inch smartphone with a 5000mAh battery and a dual-camera system. The ZenFone 3 Zoom features dual-camera system consists...

    Photo: Company, Jan 23.

  • Samsung+14nm+chips+for+wearables

    Samsung 14nm chips for wearables

    Samsung Electronics has announced mass production of the Exynos 7 Dual 727 mobile application processor (AP) designed specifically for wearable devices with 14nm FinFET process technology...

    Photo: Company, Oct 18.

  • Samsung+14nm+Exynos+chips

    Samsung 14nm Exynos chips

    Samsung Electronics has begun mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14nm process technology for the budget smartphone...

    Photo: Company, Aug 31.

  • Intel+sixth%2Dgeneration+Core+processor

    Intel sixth-generation Core processor

    Intel has introduced the sixth-generation Core processor family for a range of device designs - from the ultra-mobile compute stick, to 2-in-1s and high-definition all-in-one desktops,...

    Photo: Company, Sep 3.

  • Samsung+Exynos+7+Octa

    Samsung Exynos 7 Octa

    Samsung Electronics has begun mass production of mobile application processors built using 14nm FinFET process technology. Samsung's 14nm FinFET process will be adopted by its Exynos...

    Photo: Company, Feb 24.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

23-Oct-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.