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News tagged 300mm
  • Last update: Wednesday 5 February 2014 [31 news items]

300mm capacity dominates but life remains for 200mm wafer fabs, says IC Insights

Feb 5, 10:48

Nearly all new fab upgrade and construction activity has to do with 300mm wafer processing, but there is still plenty of life remaining in 200mm fabs, according to IC Insights.

Spansion and XMC announce licensing agreement

Aug 2, 10:55

Spansion and China-based 300mm semiconductor foundry XMC have announced an agreement for XMC to license Spansion's floating gate NOR flash technology. The agreement expands the companies'...

Installed 300mm wafer capacity to rise through 2017, says IC Insights

Jul 4, 16:14

In terms of surface area shipped, 300mm wafers represented 56% of worldwide installed capacity in December 2012. Production using 300mm wafers is forecast to increase steadily and...

Five IC suppliers to hold one-third of 300mm wafer capacity in 2013, says IC Insights

Feb 20, 20:28

Semiconductor industry capital spending is becoming more concentrated, with a greater percentage of spending coming from a shrinking number of companies. IC industry capacity is also...

Samsung to build new 12-inch fab for logic ICs

Jun 8, 14:42

Samsung Electronics has unveiled plans to build a new fabrication line in Hwaseong, South Korea, to meet the growing demand for logic products.

STATS ChipPAC completes expansion of 300mm wafer bump and WLCSP operation in Taiwan

Nov 17, 14:13

STATS ChipPAC has completed the expansion of its 300mm wafer bump and wafer-level chip-scale packaging (WLCSP) in Taiwan, according to the chip packaging and test service provider.

STATS ChipPAC expands TSV offering

Apr 19, 10:38

STATS ChipPAC has expanded its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities, according to the company.

Only 10 participants in 300mm wafer capacity space, says IC Insights

Mar 7, 10:57

Semiconductor industry capital spending is becoming more concentrated, with a greater percentage of spending coming from a shrinking number of companies, according to IC Insights...

Record capex leads to 28% fab equipment growth in 2011, says SEMI

Mar 3, 14:45

SEMI has updated data on over 200 facilities, including LED fabs. Using a thorough bottoms-up approach (tracking all projects fab by fab), the data reveal a 28% increase year-over-year...

Intel announces new chip plant in Arizona

Feb 21, 10:07

Intel has announced plans to invest more than US$5 billion to build a new chip manufacturing facility at its site in Chandler, Arizona. Designated Fab 42, it will be built as a 300mm...

Tight capacity forces semiconductor production efficiencies in 2010, says Semico

Jan 26, 14:00

The semiconductor industry enjoyed over 30% revenue growth in 2010, with unit sales also rising an impressive 31%, according to Semico Research. But wafer demand, based on semiconductor...

STATS ChipPAC opens new plant for 300mm eWLB wafer manufacturing

Sep 15, 15:33

STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...

Silicon demand set to rebound robustly in 2010, says iSuppli

Apr 27, 09:24

Following a weak 2009, global demand for silicon used in semiconductor manufacturing is expected to rebound robustly in 2010, led by shipments of 300mm (12-inch) wafers, according...

STATS ChipPAC intros 300mm embedded WLB wafer manufacturing

Apr 13, 12:00

STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...

BCD platform technologies are rapidly changing the power IC landscape, says Petrov Group

Mar 3, 14:22

The emergence of state-of-the-art BCD (Bipolar-CMOS-DMOS) platform technologies is having a far reaching effect on the analog/mixed-signal IC landscape, the Petrov Group has commented...

Shanghai government to invest in new HHNEC-GSMC 12-inch fab

Jan 22, 11:00

The Shanghai municipal government will invest 4.5 billion yuan (US$658.7 million) in a new 12-inch (300mm) wafer fab to be built by a joint venture of Hua Hong NEC (HHNEC) and Grace...

Elpida and ProMOS ink partnership on DRAM

Nov 6, 10:28

Elpida Memory and ProMOS Technologies announced on November 6 the signing of a DRAM foundry agreement.

UMC ramping 45/40nm at Fab 12i

Oct 9, 10:33

United Microelectronics Corporation (UMC) has begun implementing a capacity expansion project for 45/40nm production at its Singapore-based 300mm (12-inch) wafer fab - Fab 12i, according...

TI opens 300mm analog fab in US

Oct 6, 14:46

Texas Instruments (TI) has announced the opening of its manufacturing facility in Richardson, Texas. The chipmaker said it expects to begin moving equipment into the facility in Oc...

Spansion says partnership with SMIC remains unchanged

Sep 2, 15:06

Spansion has claimed its foundry agreement with Semiconductor Manufacturing International Corporation (SMIC) is still valid, though the schedule to ramp 65nm production at SMIC's...

Spansion production line

UMC gearing up for 40nm

Jul 24, 15:02

United Microelectronics Corporation (UMC) has been working closely with customers, including FPGA specialist Xilinx, to volume produce 45/40nm products at its 300mm (12-inch) fabs,...

Winbond remains cautious about expansion

Jul 16, 14:45

Winbond Electronics, a Taiwan-based DRAM maker that has diversified its products to include niche memory and NOR flash, has said its capital spending for 2009 may be less than its...

Globalfoundries calls for renewed focus on 300mm

Jul 14, 15:20

The semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers, in its effort to meet the ever-increasing demands of consumer technology....

Winbond completes transition to 300mm fab production

Jul 8, 14:09

Taiwan's Winbond Electronics, which has shifted its focus from standard DRAM to niche memory and NOR flash, has recently completed its migration to 300mm wafer fab production, according...

Intel to produce on 65nm in China

Jun 24, 12:20

Intel's upcoming 12-inch fab in China will initially focus on 65nm production, according to Kirby Jefferson, general manager of the new fab (Fab 68). Intel is scheduled to commence...

Chip equipment market to begin recovery by October, says The Information Network

Jun 10, 14:36

The semiconductor equipment market will begin its recovery by October 2009, according to The Information Network.

Intel on track to commence operations at China fab in 2010

Jun 8, 14:56

Intel is scheduled to kick off operation at its 300mm fab in Dalian, China, in 2010, according to the company. The chip giant also said it is looking to integrate its assembly and...

TSMC sees delay in e-beam equipment delivery

May 18, 12:08

Taiwan Semiconductor Manufacturing Company (TSMC) has seen a delay in the delivery of 300mm multiple electron-beam (e-beam) maskless lithography equipment from Mapper Lithography...

Semiconductor equipment makers wary of 450mm development, says The Information Network

Apr 21, 10:01

The planned transition to 450mm diameter silicon wafers for semiconductor production will be disastrous for the equipment industry, The Information Network said.

FlipChip announces 300mm strategic partnership with SMIC

Mar 18, 09:36

FlipChip International (FCI), which specializes in flip-chip bumping and wafer level packaging, has recently announced a partnership alliance with Semiconductor Manufacturing International...

NAND flash market prepares for rush orders

Feb 19, 11:31

The NAND flash market is gearing up for an influx of rush orders, according to market sources. However, bit growth for the sector will still suffer a signficant drop in 2009, which...

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    Canon 202x205mm image sensor

    Canon has developed what it claims is the world's largest CMOS image sensor, with a chip size measuring 202x205mm. The newly-developed CMOS sensor is among the largest chips that...

    Photo: Company, Sep 10.

  • FormFactor+300mm+full%2Dwafer+test+solution+for+DRAM

    FormFactor 300mm full-wafer test solution for DRAM

    FormFactor has introduced its next-generation 300mm (12-inch) full-wafer-contact probe card for DRAM devices - the SmartMatrix 100 probe solution. Incorporating a proprietary probe...

    Photo: Company, Dec 11.

  • KLA%2DTencor+8900+inspection+system

    KLA-Tencor 8900 inspection system

    KLA-Tencor has extended its product offerings in the CMOS image sensor (CIS) market by announcing the 8900 defect inspection system. The new 8900 offers selectable illumination...

    Photo: Company, Oct 19.

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