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News tagged 3D-stacking
  • Last update: Tuesday 29 January 2013 [15 news items]

STATS ChipPAC, UMC unveil 3D IC developed under open ecosystem model

Jan 29, 22:11

STATS ChipPAC and United Microelectronics Corporation (UMC) have jointly announced the first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem...

STATS ChipPAC to expand operations in Korea

Nov 20, 13:42

STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...

Amkor licenses proprietary through-mold-via technology to Shinko

Apr 2, 10:22

Amkor Technology has announced that the company has granted Shinko Electric Industries a non-exclusive license to its proprietary through-mold-via (TMV) technology.

Chip equipment spending to decline following two years of growth, says Gartner

Dec 16, 15:53

Worldwide semiconductor capital equipment spending is expected to total US$51.7 billion in 2012, a 19.5% decline from projected 2011 spending of US$64.2 billion, according to Gartn...

Amkor, Globalfoundries team up for advanced assembly, test solutions

Aug 30, 11:08

Amkor Technology and Globalfoundries have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes, according to the companies...

Nanya, ITRI team up for 3D stacked DRAM

Jan 25, 14:57

Taiwan-based Nanya Technology has teamed up with government-backed Industrial Technology Research Institute (ITRI) to develop a through silicon via (TSV) technology for high-capacity...

ITRI sets up 3D IC experimental lab

Jul 1, 12:28

The Taiwan government-backed Industrial Technology Research Institute (ITRI) has announced the establishment of an experimental lab, which deploys 12-inch wafer through silicon via...

ITRI experimental lab for 3D IC technology

Elpida, PTI and UMC enter joint development deal for 3D-TSV technology

Jun 21, 16:55

Elpida Memory, Powertech Technology (PTI) and United Microelectronics Corporation (UMC) have jointly announced their entry into a 3-way cooperation to advance 3D IC integration technologies...

Major growth in TSV metrology/inspection equipment expected, says The Information Network

Apr 30, 10:42

The market for metrology/inspection equipment for 3D through silicon via (TSV) semiconductor packaging looms large, according to The Information Network. The desire for smaller, lighter...

Applied Materials, ITRI team up for 3D chip stack technology

Oct 15, 16:53

Applied Materials has announced its collaboration with the Taiwan government-backed Industrial Technology Research Institute (ITRI) to accelerate the development and commercialization...

Applied-ITRI collaboration on development of 3D IC technology

3D IC packaging to be mature within 3 years, says ASE chief officer

Oct 2, 17:10

Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset...

SoC and SiP

PTI purchase of Spansion backend facility in China to target non-memory products, say sources

Aug 25, 16:39

Powertech Technology (PTI) aims to turn the China plant it is buying from Spansion into its major production base for non-memory packaging and testing, covering logic ICs, SiP (system...

TSV development picking up momentum

Apr 7, 10:34

Unlike conventional SoC or SiP solutions that integrate ICs on a two-dimensional (2D) surface, using through silicon via (TSV) technology in a package that stacks ICs in a three-dimensional...

Taiwan to mass produce TSV by 2010

Oct 15, 17:06

Taiwan's Semiconductor Industry Promotion Office under the Ministry of Economic Affairs (MOEA) and Industrial Technology Research Institute (ITRI) recently gathered experts to discuss...

Cheng-Wen Wu

3D-stacking IC consortium established in Taiwan

Jul 24, 15:44

Driven by growing demand for strong IC design integration, Taiwan's Industrial Technology Research Institute (ITRI) recently established a consortium for advanced stacked-system technology...

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