Last update: Tuesday 29 January 2013 [15 news items]
STATS ChipPAC, UMC unveil 3D IC developed under open ecosystem model
Jan 29, 22:11
STATS ChipPAC and United Microelectronics Corporation (UMC) have jointly announced the first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem...
STATS ChipPAC to expand operations in Korea
Nov 20, 13:42
STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...
Amkor licenses proprietary through-mold-via technology to Shinko
Apr 2, 10:22
Amkor Technology has announced that the company has granted Shinko Electric Industries a non-exclusive license to its proprietary through-mold-via (TMV) technology.
Chip equipment spending to decline following two years of growth, says Gartner
Dec 16, 15:53
Worldwide semiconductor capital equipment spending is expected to total US$51.7 billion in 2012, a 19.5% decline from projected 2011 spending of US$64.2 billion, according to Gartn...
Amkor, Globalfoundries team up for advanced assembly, test solutions
Aug 30, 11:08
Amkor Technology and Globalfoundries have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes, according to the companies...
Nanya, ITRI team up for 3D stacked DRAM
Jan 25, 14:57
Taiwan-based Nanya Technology has teamed up with government-backed Industrial Technology Research Institute (ITRI) to develop a through silicon via (TSV) technology for high-capacity...
ITRI sets up 3D IC experimental lab
Jul 1, 12:28
The Taiwan government-backed Industrial Technology Research Institute (ITRI) has announced the establishment of an experimental lab, which deploys 12-inch wafer through silicon via...
Elpida, PTI and UMC enter joint development deal for 3D-TSV technology
Jun 21, 16:55
Elpida Memory, Powertech Technology (PTI) and United Microelectronics Corporation (UMC) have jointly announced their entry into a 3-way cooperation to advance 3D IC integration technologies...
Major growth in TSV metrology/inspection equipment expected, says The Information Network
Apr 30, 10:42
The market for metrology/inspection equipment for 3D through silicon via (TSV) semiconductor packaging looms large, according to The Information Network. The desire for smaller, lighter...
Applied Materials, ITRI team up for 3D chip stack technology
Oct 15, 16:53
Applied Materials has announced its collaboration with the Taiwan government-backed Industrial Technology Research Institute (ITRI) to accelerate the development and commercialization...
3D IC packaging to be mature within 3 years, says ASE chief officer
Oct 2, 17:10
Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset...
PTI purchase of Spansion backend facility in China to target non-memory products, say sources
Aug 25, 16:39
Powertech Technology (PTI) aims to turn the China plant it is buying from Spansion into its major production base for non-memory packaging and testing, covering logic ICs, SiP (system...
TSV development picking up momentum
Apr 7, 10:34
Unlike conventional SoC or SiP solutions that integrate ICs on a two-dimensional (2D) surface, using through silicon via (TSV) technology in a package that stacks ICs in a three-dimensional...
Taiwan to mass produce TSV by 2010
Oct 15, 17:06
Taiwan's Semiconductor Industry Promotion Office under the Ministry of Economic Affairs (MOEA) and Industrial Technology Research Institute (ITRI) recently gathered experts to discuss...
3D-stacking IC consortium established in Taiwan
Jul 24, 15:44
Driven by growing demand for strong IC design integration, Taiwan's Industrial Technology Research Institute (ITRI) recently established a consortium for advanced stacked-system technology...
ACX sees earnings up over 60% sequentially in 1Q13
Bits + chips | 8h 1min ago
Ilitek to post revenues of over NT$900 million in May
Bits + chips | 8h 15min ago
Sharp to produce 3 types of IGZO LCD panels for notebooks
Displays | 8h 27min ago
3M announces new development of quantum dot enhancement film
Displays | 9h 13min ago
NLT demonstrates latest display technologies, including projective capacitive touch panel technology
Displays | 9h 39min ago
AGC to release new self-adhesive glass for optical bonding used in electronic products
Displays | 9h 51min ago
eMagin enters electronic viewfinder market with OLED microdisplay
Displays | 9h 55min ago
New Vision Display exhibits PMVA color display based on Corning Willow Glass
Displays | 9h 56min ago
Lextar expected to see 2Q13 gross margin rise to 13-14%
LED | 9h 59min ago
Samsung to launch complete line up of notebooks in 2H13
IT + CE | 10h 41min ago
Taiwan panel industry output value worth US$7.86 billion in 1Q13, says IEK
Displays | 11h 41min ago
Sharp announces new Ultra HD TVs
Before Going to Press | 8h 27min ago
Nanjing Z-Com developing 4G small cells for China market
Before Going to Press | 8h 35min ago
Shipment proportions of 8- and 10-megapixel lens modules on the rise, say Taiwan makers
Before Going to Press | 8h 56min ago
Telecom operators in China expected to stop placing orders for 3.5-inch smartphones by July 2013
Before Going to Press | 9h 6min ago
Taiwan connector makers worried about competition from China-based makers
Before Going to Press | 9h 17min ago
Taiwan FPCB makers to face renewed competition from rivals in Japan
Before Going to Press | 9h 18min ago
China-based ARM-architecture IC designers to attend 2013 Computex Taipei
Before Going to Press | 9h 19min ago
Taiwan market: Sony to launch Xperia Tablet Z
Before Going to Press | 9h 51min ago
Monitor panel pricing expected to remain stable in May
Before Going to Press | 10h 54min ago
CSOT successfully produces 32-inch Oxide TFT LCD module
Before Going to Press | 10h 54min ago
Windows 8 expected to take up 5-8% of global tablet shipments in 2013, say Taiwan makers
Before Going to Press | 11h 50min ago
- AMD falls to 4th rank MPU supplier in 2012, says IC Insights
- Revenues for drivers in LED general lighting applications to triple, says IMS Research
- Supply chain to begin volume shipments of new Xbox console orders in 3Q13
- MediaTek 2Q13 sales likely to beat guidance
- Digitimes Research: Taiwan LCD driver IC shipments rise 22% in 1Q13
- Taiwan panel makers lower pricing for Ultra HD TV panels
- Innolux expected to ship 1 million TOD units in 2013
- China market: Third-party e-payment services generate CNY1.2 trillion in 1Q13 total trade value, says Analysys
- China market: Online advertising valued at CNY18 billion in 1Q13, says Analysys
- Touch screen IC, LED driver IC suppliers to post strong performance in May
- AUO publishes 65-inch Full HD OLED panel technology paper at SID Display Week
- Taiwan networking device makers see decreasing profit-to-R&D spending ratio
- Win Semi expects to post double-digit revenue growth in 2013
- LED maker Epistar expects more revenues from lighting applications in 3Q13
- TSMC presence in advance process market remains strong
- Chicony seeks growth from non-notebook product lines
- Taiwan makers expected to benefit from Lenovo targeting smartphones in 2013
- LED firms to lower prices through improved technology
- Commentary: High-end LED lighting in demand
- Digitimes Research: Europe solar trade tariffs may slow down market growth
- BenQ Materials expects performance to improve in 2Q13
- TV panel pricing expected to further drop in May, says WitsView
- Demand for large-size driver ICs to boom in 2H13, say backend firms
- TPK expected to see decline in touch screen notebook market share during 2Q13
- Taiwan attracts January-April foreign direct investment of over US$1.5 billion
- Releases
- White papers
- Bulletin
- EverFocus launches ECOR960 X1 16CH with better image quality and more affordable price
- Leadtek to Show Total Cloud Solutions at Computex Taipei 2013
- Clientron to exhibit its latest Zero/Thin Client and POS solutions along with the full product line at Computex Taipei 2013
- DIGIEVER partnership with EverFocus for better professional network surveillance solutions
- Advantech Introduces New 18" and 21" Widescreen Multitouch Panel PCs
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Chilisin at 2012 electronics Munich A5/159 & 260
- Chilisin sunken-type molded power inductor for MXM Graphic application
21-May-2013 markets closed
| Last | Change |
| TAIEX (TSE) | 8383.05 | +6.00 | +0.07% |
| TSE electronic | 316.85 | +0.06 | +0.02% |
| GTSM (OTC) | 120.38 | +0.64 | +0.53% |
| OTC electronic | 144.61 | +0.55 | +0.38% |
- Weak eurozone growth hits euro (May 15) - The Financial Times
- German factory orders rise for second month (May 7) - Bloomberg
- Eurozone retail sales fall for second consecutive month (May 6) - BBC News
- China economy to stay commodity-oriented, says JPMorgan (April 16) - Bloomberg
- S Korea in US$15.3 billion stimulus bid to spur economic growth (April 16) - BBC News
- Gold hit by sharpest tumble in 30 years (April 16) - CNN
- FBI probes Boston 'terror' blasts (April 16) - BBC News
- China GDP growth slows to 7.7% (April 14) - Wall Street Journal
Photo: Company, Apr 30.
Photo: Company, Apr 16.
Photo: Company, Apr 12.
Photo: Company, Apr 10.
Photo: Company, Apr 10.
2013 Taiwan International Lighting Show: Edison Opto's cafe booth
Photo: Jackie Chang, DIGITIMES, Apr 8.
2013 Taiwan International Lighting Show: Delta LED light bulbs
Photo: Jackie Chang, DIGITIMES, Apr 8.
Photo: Jackie Chang, DIGITIMES, Apr 8.
Photo: Company, Apr 8.
2013 Taiwan Internationbal Lighting Show: Epistar applications for agricultural lighting
Photo: Jackie Chang, DIGITIMES, Mar 29.
2013 Taiwan International Lighting Show: Everlight residential LED lighting
Photo: Jackie Chang, DIGITIMES, Mar 29.
2013 Taiwan International Lighting Show: Edison Opto LED strip lamp
Photo: Jackie Chang, DIGITIMES, Mar 29.
Opportunity lies for MEMS energy harvesting: Q&A with Holst Centre general manager Bert Gyselinckx
Digitimes recently interviewed Bert Gyselinckx, general manager of the Holst Centre in Eindhoven, to...
Returning with stronger competitiveness: Q&A with Lu Li-Cheng, Chaintech chairman
Chaintech, a motherboard/graphics card maker, which quit the market once and returned recently, has...
MEMS-enabled energy harvesting: Q&A with MIG executive director Karen Lightman
Digitimes recently spoke with Karen Lightman, the executive director of MEMS Industry Group (MIG),...
Complete mobile platform solutions: Q&A with Broadcom executive VP Robert Rango
In a relentless competition against rivals including Qualcomm, Nvidia and Media in the smartphone chipset...
- Smartphone and tablet industry: The view from Taiwan - May 2012
Taiwan-based companies have a long and successful history of involvement in the supply chain for mobile devices, which for the purposes of this article consist...
- Taiwan motherboard industry overview - May 2012
The year 2011 saw the motherboard industry reverse its trend of declining shipments year-on-year, to post a slight 0.2% growth. This upturn in fortunes was expected...
- Notebook market overview - Jun 2011
The notebook industry in 2010 experienced several major events that significantly changed the industry's ecosystem for the year and the industry is also believed...
- LCD TV overview - Jun 2011
Growth of the global LCD TV market was not as strong as expected in 2010 as the market continued to feel the aftershocks of the economic recession that had hit...
- 2H 2012 global TFT panel market forecast
Digitimes Research predicts there will be a total of 389 million large-sized TFT LCD panels shipped in 2H12, with 195 million in the third quarter and 194 million in the fourth quarter - with the total representing a 7.6% increase over the first half of this year.
- Trends and shipment forecast for 2H 2012 smartphone market
Smartphone shipments in 2010 and 2011 both enjoyed growth of more than 60%. Growth will decelerate in 2012 due to the high base, as well as a slowdown in consumer spending in Western Europe.
- Trends in Asia LED chip manufacturing industry
Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.