Taipei, Tuesday, September 23, 2014 12:44 (GMT+8)
mostly cloudy
Taipei
31°C
News tagged 3D-stacking
  • Last update: Tuesday 29 January 2013 [15 news items]

STATS ChipPAC, UMC unveil 3D IC developed under open ecosystem model

Jan 29, 22:11

STATS ChipPAC and United Microelectronics Corporation (UMC) have jointly announced the first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem...

STATS ChipPAC to expand operations in Korea

Nov 20, 13:42

STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...

Amkor licenses proprietary through-mold-via technology to Shinko

Apr 2, 10:22

Amkor Technology has announced that the company has granted Shinko Electric Industries a non-exclusive license to its proprietary through-mold-via (TMV) technology.

Chip equipment spending to decline following two years of growth, says Gartner

Dec 16, 15:53

Worldwide semiconductor capital equipment spending is expected to total US$51.7 billion in 2012, a 19.5% decline from projected 2011 spending of US$64.2 billion, according to Gartn...

Amkor, Globalfoundries team up for advanced assembly, test solutions

Aug 30, 11:08

Amkor Technology and Globalfoundries have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes, according to the companies...

Nanya, ITRI team up for 3D stacked DRAM

Jan 25, 14:57

Taiwan-based Nanya Technology has teamed up with government-backed Industrial Technology Research Institute (ITRI) to develop a through silicon via (TSV) technology for high-capacity...

ITRI sets up 3D IC experimental lab

Jul 1, 12:28

The Taiwan government-backed Industrial Technology Research Institute (ITRI) has announced the establishment of an experimental lab, which deploys 12-inch wafer through silicon via...

ITRI experimental lab for 3D IC technology

Elpida, PTI and UMC enter joint development deal for 3D-TSV technology

Jun 21, 16:55

Elpida Memory, Powertech Technology (PTI) and United Microelectronics Corporation (UMC) have jointly announced their entry into a 3-way cooperation to advance 3D IC integration technologies...

Major growth in TSV metrology/inspection equipment expected, says The Information Network

Apr 30, 10:42

The market for metrology/inspection equipment for 3D through silicon via (TSV) semiconductor packaging looms large, according to The Information Network. The desire for smaller, lighter...

Applied Materials, ITRI team up for 3D chip stack technology

Oct 15, 16:53

Applied Materials has announced its collaboration with the Taiwan government-backed Industrial Technology Research Institute (ITRI) to accelerate the development and commercialization...

Applied-ITRI collaboration on development of 3D IC technology

3D IC packaging to be mature within 3 years, says ASE chief officer

Oct 2, 17:10

Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset...

SoC and SiP

PTI purchase of Spansion backend facility in China to target non-memory products, say sources

Aug 25, 16:39

Powertech Technology (PTI) aims to turn the China plant it is buying from Spansion into its major production base for non-memory packaging and testing, covering logic ICs, SiP (system...

TSV development picking up momentum

Apr 7, 10:34

Unlike conventional SoC or SiP solutions that integrate ICs on a two-dimensional (2D) surface, using through silicon via (TSV) technology in a package that stacks ICs in a three-dimensional...

Taiwan to mass produce TSV by 2010

Oct 15, 17:06

Taiwan's Semiconductor Industry Promotion Office under the Ministry of Economic Affairs (MOEA) and Industrial Technology Research Institute (ITRI) recently gathered experts to discuss...

Cheng-Wen Wu

3D-stacking IC consortium established in Taiwan

Jul 24, 15:44

Driven by growing demand for strong IC design integration, Taiwan's Industrial Technology Research Institute (ITRI) recently established a consortium for advanced stacked-system technology...

Realtime news
  • Xian SinoChip reportedly uses Powerchip foundry services

    Bits + chips | 17min ago

  • Notebook demand undermined by new Apple devices

    IT + CE | 28min ago

  • TSMC Solar president reportedly to resign

    Green energy | 1h 57min ago

  • Taiwan August export order value slightly up on month, says MOEA

    Bits + chips | 2h 2min ago

  • Sony Mobile to focus on high-end smartphones, will decrease ODM orders, say Taiwan makers

    Mobile + telecom | Sep 22, 22:43

  • Taiwan market: Meizu likely to launch smartphone MX4

    Mobile + telecom | Sep 22, 22:40

  • Tablet panel pricing for 7-inch units remains flat in mid-September

    Displays | Sep 22, 22:39

  • Digitimes Research: Japan TV vendors see their proportion of 50-inch and above size Ultra HD TV sales drop

    Displays | Sep 22, 22:35

  • Great Wall plans to start fund raising for solar investments, says report

    Before Going to Press | Sep 22, 22:26

  • Argument between China vendors shows weakening of China smartphone industry, says report

    Before Going to Press | Sep 22, 21:31

  • Tablet panel pricing for 7-inch units remains flat in mid-September

    Before Going to Press | Sep 22, 21:07

  • Digitimes Research: TV vendors see their proportion of 50-inch and above size Ultra HD TV sales drop

    Before Going to Press | Sep 22, 21:06

  • Digitimes Research: Taiwan makers continue to focus on production of a-Si panels for use in the high-end smartphone panel segment

    Before Going to Press | Sep 22, 21:06

  • LCD monitor pricing increases in September

    Before Going to Press | Sep 22, 21:02

  • Taiwan market: Microsoft to launch Xbox One

    Before Going to Press | Sep 22, 20:59

  • Digitimes Research: Alibaba faced with operational difficulties

    Before Going to Press | Sep 22, 20:58

  • Digitimes Research: Apple uses iPad, iPhone models extend music business model started by iPod

    Before Going to Press | Sep 22, 20:54

  • LG to announce new smartphone with in-house AP, says report

    Before Going to Press | Sep 22, 20:52

Pause
 | 
View more
DIGITIMES Research Tracker Services
Media news email alerts

23-Sep-2014 markets closed

 LastChange

TAIEX (TSE)9134.65-105.80-1.14% 

TSE electronic357.11-5.36-1.48% 

GTSM (OTC)140.75-0.77-0.54% 

OTC electronic178.23-1.14-0.64% 

Greater China touch panel shipment forecast through 2015
  • 2014 global high brightness LED market, trends and shipment forecast

    For the global LED lighting market, the market size will reach US$25.82 billion in 2014 or a market penetration rate of 23.4%. This is attributable to exponential shipment growth for light bulbs, tubes, and directional lamps.

  • Greater China touch panel shipment forecast through 2015

    This Special Report provides forecasts through 2015 for Greater China touch panel shipments with breakdowns based on technology (glass, film, resistive), application (smartphone, NB and tablet) and by firm.

  • 2014 global tablet demand forecast

    This report analyzes the main players, their strategies and shipments forecasts for 2014, as well as other factors contributing to either growth or decline in various segments within the tablet market, with a particular focus on Apple, Google, Samsung, and Microsoft, along with whitebox vendors.