The three primary high-performance computing (HPC) chip suppliers, Intel, AMD, and Nvidia, will likely see their sales strengthen quarter by quarter in the second half of 2023, buoyed...
Uncertain demand recovery, along with the escalating trade dispute between China and the US, has resulted in a deluge of layoffs that shows no signs of letting up, according to industry...
The updated chip export control policy by the Biden Administration was unveiled less than a week ago. Recent reports in Chinese media suggest that AMD is preparing for layoffs in...
The tightened chip trade ban newly imposed by the US has cast a substantial shadow over major Chinese AI chip makers, potentially blocking their access to advanced chip manufacturing...
Phison Electronics, a specialist in NAND flash device controllers, is set to enter mass production of PCIe 5.0 retimer ICs in the first quarter of 2024, anticipating a surge in server...
In the rapidly evolving semiconductor industry, the emergence of CXL (Compute Express Link) as an interconnect specification has captured the spotlight. Samsung Electronics and SK...
Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor,...
Backend companies are positive about demand for Sony's new slimmed-down PlayStation 5 (PS5), which will hit the shelves in mid-November, according to industry sources.
Huawei unconventionally releasing its Mate 60 Pro 5G smartphone in late August witout prior notice garnered global attention, but during the subsequent official product launch event...
Previously, at the Code Conference held in California, AMD CEO Lisa Su discussed topics covering the AI industry, expansion of domestic semiconductor production in the US, Huawei's...
The demand for high bandwidth memory (HBM) is poised to experience explosive growth starting in 2024, fueled by its incorporation into servers hosting large language models like ChatGPT...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...