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News tagged Amkor
  • Last update: Friday 3 May 2013 [24 news items]

Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner

May 3, 15:13

The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.

Renesas, J-Devices sign MoU on transfer of backend facilities

Jan 31, 16:44

Renesas Electronics and J-Devices have signed a memorandum of understanding regarding the transfer of three semiconductor backend production facilities operated by Renesas and its...

Major IC packagers step up 2012 capex

Aug 6, 15:41

Advanced Semiconductor Engineering (ASE), Amkor Technology and Siliconware Precision Industries (SPIL) – the world's leading packaging and testing houses – have all set...

ASE to expand operations in Korea

Jun 25, 14:54

In view of the growing semiconductor industry in Korea, Advanced Semiconductor Engineering (ASE) is looking to expand its local factory site located in Paju, Gyeonggi Province, with...

Amkor licenses proprietary through-mold-via technology to Shinko

Apr 2, 10:22

Amkor Technology has announced that the company has granted Shinko Electric Industries a non-exclusive license to its proprietary through-mold-via (TMV) technology.

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

Toshiba puts on hold sale of Malaysian operation

Nov 17, 15:41

Toshiba and Amkor Technology have both agreed to postpone discussions regarding the previously-announced proposed acquisition by Amkor of Toshiba's semiconductor assembly operations...

ASE, Amkor expanding to compete for IDM orders

Oct 7, 01:25

In view of increased outsourcing demand by IDM companies, IC packagers Advanced Semiconductor Engineering (ASE) and Amkor Technology has been expanding their operations to vie for...

Amkor, Globalfoundries team up for advanced assembly, test solutions

Aug 30, 11:08

Amkor Technology and Globalfoundries have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes, according to the companies...

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

Copper pillar to be mainstream FC packaging technology in 2012

Jun 3, 15:43

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...

Greatek denies rumor of Amkor acquisition

Stockwatch - Nov 25, 01:10

Taiwan's Greatek Electronics, a packaging and testing house specializing in consumer ICs, has denied local media reports indicating that it will be acquired by Amkor Technology of...

Amkor to boost 1Q10 capex

Feb 12, 15:00

Amkor Technology has said it plans to allocate a capex of US$100-125 million for the first quarter of 2010, a significant rise compared to US$69 million spent a year ago. The figure...

Amkor raises 4Q09 revenue guidance; Taiwan rivals expect growth

Dec 23, 14:18

Amkor Technology has announced it expects revenues for the fourth quarter to grow by around 6% sequentially, attributing the better outlook to higher-than-expected customer demand...

SPIL says 2010 capex to double

Oct 29, 11:57

Siliconware Precision Industries (SPIL) has set its capex budget for 2010 at NT$10 billion (US$307.7 million), doubling from NT$5.3 billion allocated for 2009, according to company...

SPIL chairman Bough Lin

ASE ramping copper wire bonding output

Oct 1, 14:18

Advanced Semiconductor Engineering (ASE) has been ramping up its output utilizing a copper wire bonding process, with shipments of such ICs reaching over 50 million units in the past...

ASE, SPIL to expand high-end process capacity

Aug 3, 17:09

Advanced Semiconductor Engineering (ASE) plans to increase wire-bond and bumping capacity, and Siliconware Precision Industries (SPIL) will expand its flip-chip (FC) ball-grid array...

Top backend houses to see revenues grow in 3Q09

Aug 3, 12:14

Amkor Technology is expected to see the strongest revenue growth among top packaging and testing houses in th third quarter, followed by Advanced Semiconductor Engineering (ASE),...

IC packaging firms ASE and SPIL gain shifted orders

Newswatch - Apr 23, 16:58

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have recently seen more orders shifted from Amkor Technology, STATS ChipPAC Taiwan Semiconductor...

ASE production line

Integrated handheld solutions driving demand for wafer-level packaging, says ASE

Apr 13, 16:00

Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...

ASE 1Q revenue drop expected to narrow from original forecast

Newswatch - Mar 27, 17:13

With Amkor Technology recently revising up its gross margin outlook for the first quarter and indicating that its revenues will fall into the avorable end of the range of the company's...

Amkor narrows 1Q guidance

Mar 26, 12:27

Amkor Technology, a US-based IC packaging and testing firm, has revised upward gross margins for the first quarter of 2009 (ending March 31, 2009) but still held its previous revenues...

Amkor likely to lower sales estimate for 4Q08

Newswatch - Dec 10, 12:34

In response to a weakening outlook, Amkor Technology may soon announce a downgraded revenue estimate for the fourth quarter of 2008, market watchers speculated. Its major competitor...

Intel, Qualcomm, Amkor, Advantest join up to improve IC testing efficiency

Oct 29, 12:48

Major players from the semiconductor and test community, including Advantest, Amkor, Infineon, Intel, LTX-Credence, Qualcomm, Roos Instruments, Teradyne, and Verigy, announced that...

Realtime news
  • Lite-On IT to start production of LED light bulbs in 3Q13

    LED | 7h 5min ago

  • Pegatron expects 10% growth in 2Q13 shipments

    IT + CE | 7h 7min ago

  • Windows RT facing pressure from being isolated

    IT + CE | 7h 12min ago

  • Winbond looks to rising SDRAM prices in 2H13

    Bits + chips | 7h 34min ago

  • Winbond, Macronix shipping NOR flash chips for Xbox One and PS4

    Bits + chips | 7h 35min ago

  • Large-size panel shipments grow 4% in May, says WitsView

    Displays | 8h 32min ago

  • LED business revenues to exceed NT$20 billion in 2013, says Lite-On Group chairman

    LED | 8h 42min ago

  • Blue filter glass in short supply due to white-box smartphone demand

    Displays | 8h 48min ago

  • GSEO sees profits in 2012

    Before Going to Press | 7h 28min ago

  • Acer positions Gateway and Packard Bell as mid-range/entry-level brands

    Before Going to Press | 7h 46min ago

  • IC distributor WPG to see quarterly revenues exceed NT$100 billion in 2Q13

    Before Going to Press | 8h 50min ago

  • Formosa Epitaxy may see 3Q13 revenues grow 20-30% sequentially, says company chairman

    Before Going to Press | 9h 16min ago

  • Innolux expects slowdown in TV panel shipments

    Before Going to Press | 10h 13min ago

  • HTC to continue supplying HTC Butterfly after launch of HTC Butterfly S

    Before Going to Press | 10h 21min ago

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Smartphone industry and market, 2013 forecast

19-Jun-2013 markets closed

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TAIEX (TSE)8007.39-3.63-0.05% 

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Trends in China LED chip and packaging sector
  • 2H 2012 global TFT panel market forecast

    Digitimes Research predicts there will be a total of 389 million large-sized TFT LCD panels shipped in 2H12, with 195 million in the third quarter and 194 million in the fourth quarter - with the total representing a 7.6% increase over the first half of this year.

  • Trends and shipment forecast for 2H 2012 smartphone market

    Smartphone shipments in 2010 and 2011 both enjoyed growth of more than 60%. Growth will decelerate in 2012 due to the high base, as well as a slowdown in consumer spending in Western Europe.

  • Trends in Asia LED chip manufacturing industry

    Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.