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News tagged Amkor
  • Last update: Wednesday 3 September 2014 [30 news items]

Demand of 3D ICs may not take off for 3 years, says Amkor Technology

Sep 3, 15:52

Demand for 3D IC parts may not begin to take off until three years due to concerns of high production costs, according to Mike Liang, president of Amkor Technology Taiwan.

Mike Liang, president of Amkor Technology Taiwan

Amkor, STATS ChipPAC and ASE to share backend orders for Apple A8 chip, say sources

Jan 27, 14:55

Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken...

IC backend service firms to ramp up bumping, WL-CSP capacities in 2014, say sources

Dec 31, 11:26

Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...

Amkor, Globalfoundries and Open-Silicon partner to develop SoC on 2.5D interposer

Nov 25, 10:21

Amkor Technology, Globalfoundries and Open-Silicon have jointly announced the successful demonstration of a functional SoC featuring two 28nm logic chips with embedded ARM processors,...

Amkor completes acquisition of Toshiba packaging unit in Malaysia

Aug 1, 14:50

IC assembly and test service provider Amkor Technology has completed its acquisition of Toshiba's semiconductor packaging operation in Malaysia, according to the two companies.

High-end packaging next battlefield for IC assembly and test services providers, says Amkor executive

Jul 9, 15:53

Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...

Kevin Yu, Amkor sales director for Greater China

Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner

May 3, 15:13

The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.

Renesas, J-Devices sign MoU on transfer of backend facilities

Jan 31, 16:44

Renesas Electronics and J-Devices have signed a memorandum of understanding regarding the transfer of three semiconductor backend production facilities operated by Renesas and its...

Major IC packagers step up 2012 capex

Aug 6, 15:41

Advanced Semiconductor Engineering (ASE), Amkor Technology and Siliconware Precision Industries (SPIL) – the world's leading packaging and testing houses – have all set...

ASE to expand operations in Korea

Jun 25, 14:54

In view of the growing semiconductor industry in Korea, Advanced Semiconductor Engineering (ASE) is looking to expand its local factory site located in Paju, Gyeonggi Province, with...

Amkor licenses proprietary through-mold-via technology to Shinko

Apr 2, 10:22

Amkor Technology has announced that the company has granted Shinko Electric Industries a non-exclusive license to its proprietary through-mold-via (TMV) technology.

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

Toshiba puts on hold sale of Malaysian operation

Nov 17, 15:41

Toshiba and Amkor Technology have both agreed to postpone discussions regarding the previously-announced proposed acquisition by Amkor of Toshiba's semiconductor assembly operations...

ASE, Amkor expanding to compete for IDM orders

Oct 7, 01:25

In view of increased outsourcing demand by IDM companies, IC packagers Advanced Semiconductor Engineering (ASE) and Amkor Technology has been expanding their operations to vie for...

Amkor, Globalfoundries team up for advanced assembly, test solutions

Aug 30, 11:08

Amkor Technology and Globalfoundries have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes, according to the companies...

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

Copper pillar to be mainstream FC packaging technology in 2012

Jun 3, 15:43

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...

Greatek denies rumor of Amkor acquisition

Stockwatch - Nov 25, 01:10

Taiwan's Greatek Electronics, a packaging and testing house specializing in consumer ICs, has denied local media reports indicating that it will be acquired by Amkor Technology of...

Amkor to boost 1Q10 capex

Feb 12, 15:00

Amkor Technology has said it plans to allocate a capex of US$100-125 million for the first quarter of 2010, a significant rise compared to US$69 million spent a year ago. The figure...

Amkor raises 4Q09 revenue guidance; Taiwan rivals expect growth

Dec 23, 14:18

Amkor Technology has announced it expects revenues for the fourth quarter to grow by around 6% sequentially, attributing the better outlook to higher-than-expected customer demand...

SPIL says 2010 capex to double

Oct 29, 11:57

Siliconware Precision Industries (SPIL) has set its capex budget for 2010 at NT$10 billion (US$307.7 million), doubling from NT$5.3 billion allocated for 2009, according to company...

SPIL chairman Bough Lin

ASE ramping copper wire bonding output

Oct 1, 14:18

Advanced Semiconductor Engineering (ASE) has been ramping up its output utilizing a copper wire bonding process, with shipments of such ICs reaching over 50 million units in the past...

ASE, SPIL to expand high-end process capacity

Aug 3, 17:09

Advanced Semiconductor Engineering (ASE) plans to increase wire-bond and bumping capacity, and Siliconware Precision Industries (SPIL) will expand its flip-chip (FC) ball-grid array...

Top backend houses to see revenues grow in 3Q09

Aug 3, 12:14

Amkor Technology is expected to see the strongest revenue growth among top packaging and testing houses in th third quarter, followed by Advanced Semiconductor Engineering (ASE),...

IC packaging firms ASE and SPIL gain shifted orders

Newswatch - Apr 23, 16:58

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have recently seen more orders shifted from Amkor Technology, STATS ChipPAC Taiwan Semiconductor...

ASE production line

Integrated handheld solutions driving demand for wafer-level packaging, says ASE

Apr 13, 16:00

Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...

ASE 1Q revenue drop expected to narrow from original forecast

Newswatch - Mar 27, 17:13

With Amkor Technology recently revising up its gross margin outlook for the first quarter and indicating that its revenues will fall into the avorable end of the range of the company's...

Amkor narrows 1Q guidance

Mar 26, 12:27

Amkor Technology, a US-based IC packaging and testing firm, has revised upward gross margins for the first quarter of 2009 (ending March 31, 2009) but still held its previous revenues...

Amkor likely to lower sales estimate for 4Q08

Newswatch - Dec 10, 12:34

In response to a weakening outlook, Amkor Technology may soon announce a downgraded revenue estimate for the fourth quarter of 2008, market watchers speculated. Its major competitor...

Intel, Qualcomm, Amkor, Advantest join up to improve IC testing efficiency

Oct 29, 12:48

Major players from the semiconductor and test community, including Advantest, Amkor, Infineon, Intel, LTX-Credence, Qualcomm, Roos Instruments, Teradyne, and Verigy, announced that...

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