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News tagged capacity
  • Last update: Tuesday 27 June 2017 [1642 news items]

Sumco says new capacity to arrive in 2019

May 15, 21:59

Sumco expects its additional new capacity to come online in 2019 at the earliest, according to the Japan-based silicon wafer vendor, adding that it will enhance and optimize its existing...

Jarllytec nets NT$1.57 per share for 1Q17

May 15, 12:39

Notebook and LCD monitor hinge maker Jarllytec has reported first-quarter consolidated revenues of NT$1.32 billion (US$43.4 million), gross margin 24.47%, net operating profit NT$143.3...

TSMC board approves US$1.27 billion for advanced technology capacity expansion

May 10, 10:57

The board of directrors of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of US$1.269 billion for the purpose of upgrading and expanding capacity...

VIS seeking 8-inch fab equipment from memory chipmakers

May 9, 20:43

Specialty IC foundry Vanguard International Semiconductor (VIS) is looking to expand its 8-inch fabs, and has approached several memory makers to buy their second-hand equipment,...

Catcher sees weak 1Q17 and April; expects growing performance in upcoming months

May 8, 22:53

Chassis maker Catcher Technology reported its financial results for the first quarter with consolidated revenues at NT$14.58 billion (US$483.29 million), down 39.29% sequentially...

Semiconductor wafer-level manufacturing equipment revenues up 11% in 2016, says Gartner

May 3, 11:13

Worldwide semiconductor wafer-level manufacturing equipment (WFE) revenues totaled US$37.4 billion in 2016, an 11.3% increase from 2015, according to final results by Gartner. The...

Winbond planning new 12-inch fab

May 2, 14:16

Specialty DRAM and NOR flash memory maker Winbond Electronics is planning a new 12-inch wafer plant which will be located in Tainan, southern Taiwan or Singapore.

Win Semi expects to post 13-17% revenue growth in 2Q17

May 2, 11:34

GaAs IC foundry Win Semiconductors expects to post a 13-17% sequential increase in consolidated revenues for the second quarter of 2017, with gross margin set to be better than the...

UMC to roll out 22nm process as early as 2018

Apr 28, 11:46

Foundry chipmaker UMC has disclosed plans to roll out 22nm process technology as early as 2018. UMC has started IP development for its 22nm process, and expects to introduce the node...

UMC planning 22nm process technology

Nanya to ramp 20m process output

Apr 27, 12:05

Nanya Technology will start making 20nm chips in small volume in the third quarter, and will expand output to 30,000 wafer starts per month by the fourth quarter of 2017, according...

Nanya president Pei-Ing Lee expects DRAM prices to continue growth

UMC expects flat performance in 2Q17

Apr 27, 11:08

United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the second quarter of 2017, when the foundry chipmaker's capacity utilization rate...

Ardentec breaks ground for new plant in Nanjing

Apr 25, 15:05

Taiwan-based Ardentec, which specializes in testing services for logic and memory chips, has recently broken ground for a new plant in Nanjing, China where Taiwan Semiconductor Manufacturing...

Copper foil maker Co-Tech positive about 2017 outlook

Apr 25, 11:52

Co-Tech Copper Foil has expressed optimism about its performance during 2017 citing robust copper foil demand.

Silicon wafer suppliers seeking long-term contracts

Apr 25, 11:18

Silicon wafer suppliers have advised their semiconductor customers to sign long-term contracts amid tight supply, according to industry sources.

Powerchip chairman expects long-term DRAM shortage

Apr 20, 22:20

The supply of DRAM memory is likely to stay tight for a substantial period of time, according to Frank Huang, chairman for Taiwan-based pure-play foundry Powerchip Technology.

Epistar capacity at full utilization

Apr 13, 11:12

LED epitaxial wafer and chip maker Epistar has fully utilized its production capacity since March 2017 and has obtained orders for blue-light LED chips with total ordered volume 30%...

RiTdisplay to further expand PMOLED capacity

Apr 12, 21:44

PMOLED panel maker RiTdisplay has expanded monthly production capacity from 15,000 glass substrates originally to 18,000 units, and will further expand monthly capacity by 40% to...

Everlight to expand LED packaging capacity

Apr 5, 11:28

Everlight Electronics has disclosed it will expand its annual LED packaging capacity from 4.5 billion chips currently to 5.5 billion, with most of the additional capacity to be used...

AUO expanding capacity for 65-inch TV panels

Mar 31, 10:02

AU Optronics (AUO) expects large growth in global demand for 65-inch LCD TV panels in 2017 and is expanding monthly production capacity at an 8.5G factory from 220,000-230,000 glass...

VIS mulling fab tools purchases

Stockwatch - Mar 31, 09:58

Vanguard International Semiconductor (VIS) is considering acquiring production equipment from its fellow foundry companies, according to the Taiwan-based 8-inch IC foundry.

Greatek building high-end packaging capacity

Mar 28, 16:05

Logic IC packaging firm Greatek Electronics will start production for bumping and wafer-level CSP in July 2017 which will further buoy its sales performance for the year, according...

China aims to hike proportion of distributed PV systems

Mar 28, 15:58

The China government aims to increase the proportion of total PV installation capacity for distributed (rooftop) PV systems mainly through higher feed-in tariff rates than those for...

Foxconn to hike Sharp TV panel capacity in Japan, says IHS Markit

Mar 24, 16:04

Foxconn Electronics, after becoming the largest shareholder of Sharp, aims to increase global sales of Sharp-produced Aquos-branded LCD TVs to 10-12 million units in 2017 and will...

MOSFET chip supply to fall short of demand in 2H17

Mar 20, 15:33

The global supply of MOSFET chips is set to fall short of demand in the second half of 2017 as a result of a growing number of MOSFETs for new CPU platforms coupled with sluggish...

HLMC 12-inch fab running at full capacity, says company VP

Mar 15, 15:41

China-based 12-inch wafer foundry Shanghai Huali Microelectronics (HLMC) has seen its Fab 1 run at full capacity with order visibility extended to the second half of 2017, according...

HLMC VP Jack Shu

China 12-inch fab capacity set to boom

Mar 14, 12:20

With major China-based chipmakers set to build new 12-inch fabs, the overall 12-inch fab capacity in China is expected to peak over the next two to three years.

HannsTouch Solution to expand touch sensor capacity, says paper

Newswatch - Mar 13, 10:56

Touch sensor maker HannsTouch Solution, due to growing demand for touch sensors used in AMOLED panels, will invest NT$1.8 billion (US$58.3 million) to expand production capacity from...

Tyntek to expand IR LED capacity

Mar 6, 11:04

LED chip maker Tyntek, viewing that production capacity for infrared (IR) LED chips is about 10% short of demand, will expand production capacity for the product line by 10-15%, with...

Tyntek chairman Bosco Foo

Industrial robot makers expanding capacity

Feb 24, 11:07

Worldwide robot makers have been expanding their capacity recently with Germany-based Kuka cooperating with the China-based Midea Group to expand its capacity in Europe and China...

Demand for robots gradually increasing

Taiwan maintains largest share of global IC wafer fab capacity, says IC Insights

Feb 24, 11:07

Taiwan led all regions/countries in wafer capacity with 21.3% share, a slight decrease from 21.7% in 2015 when the country first became the global wafer capacity leader, according...

AUO undaunted by China competition, says chairman

Feb 22, 11:24

TFT-LCD panel maker AU Optronics (AUO) is not worried by China-based competitors' government-supported fast expansion of production capacity because the Taiwan-based firm's competitiveness...

AUO chairman and CEO Paul Peng

China adds PV installation capacity of 34.54GWp in 2016, says CPIA

Feb 20, 13:29

A total PV installation capacity of 34.54GWp in power-generating stations and distributed systems was completed around China in 2016, accounting for 47% of the global total, according...

Eight-inch fabs operating at full capacity

Feb 18, 11:08

Eight-inch wafer fabs in China and Taiwan are running at full capacity driven by brisk demand for smartphone-use ICs including fingerprint-recognition sensors, LCD driver ICs and...

AUO to expand capacity at 8.5G factory

Feb 15, 15:56

AU Optronics (AUO) has set aside a capital expenditure budget of NT$55.0 billion (US$1.77 billion) for 2017, NT$10.0-15.0 billion of which will be used to expand monthly production...

Oppo expanding production capacity in China, India to ramp up shipments in 2017

Feb 14, 12:26

China-based smartphone vendor Oppo has continued expanding its production capacity in China and plans to build up production lines in India in line with its plan to further ramp up...

1642 items [2/47]
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  • Samsung+PM1633a+SSD

    Samsung PM1633a SSD

    Samsung Electronics has announced the PM1633a, a 15.36 terabyte (TB) drive. First revealed at the 2015 Flash Memory Summit in August, the 15.36TB SSD is based on a 12Gb/s Serial...

    Photo: Company, Mar 14.

  • Samsung+PRO+Plus+128GB+microSD+cards

    Samsung PRO Plus 128GB microSD cards

    Samsung Electronics has unveiled its PRO Plus 128GB microSD card series, which is built with company's MLC NAND flash solution. With the introduction of its new 128GB microSD card,...

    Photo: Company, Dec 23.

  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • Samsung+12Gb+LPDDR4+DRAM

    Samsung 12Gb LPDDR4 DRAM

    Samsung Electronics has announced that it is mass producing 12Gb LPDDR4 (low power, double data rate 4) mobile DRAM chips based on its 20nm process technology. The new LPDDR4 is...

    Photo: Company, Sep 18.

  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

WCIT
Wireless broadband developments in Southeast Asia markets

27-Jun-2017 markets closed

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Analysis of China revised domestic semiconductor industry goals
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