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News tagged ChipMOS
  • Last update: Monday 17 November 2014 [97 news items]

ChipMOS posts revenue and profit growth in 3Q14

Nov 17, 10:59

ChipMOS Technologies Taiwan has reported growth in both revenues and profits for the third quarter of 2014. The IC backend house expects fourth-quarter sales to register flat growth...

ChipMOS Taiwan, Thailin to merge

Nov 13, 10:06

ChipMOS Technologies (Bermuda) announced on November 12 that its board of directors has approved a plan to merge its subsidiaries ChipMOS Taiwan and Thailin Semiconductor. The board...

ChipMOS looks to flat performance in 4Q14

Nov 10, 16:01

Packaging and testing house ChipMOS Technologies is expected to see its sales stay flat in the fourth quarter of 2014 , according to industry sources.

Micron reportedly in talks with PTI for setting up IC packaging/testing firm

Sep 24, 10:34

Micron Technology reportedly has held back plans to set up a joint IC packaging/testing company in China with Advanced Semiconductor Engineering (ASE) and instead may build a backend...

ChipMOS to take a 19% share of JMC Electronics

Aug 14, 10:33

LCD driver IC backend service company ChipMOS Technologies will take up a 19% stake of COF (chip on film) substrate provider JMC Electronics, a subsidiary of Chang Wah Electromaterials,...

ProMOS idle 12-inch fab is up for grabs

Aug 11, 12:19

A number of semiconductor firms, including Taiwan Semiconductor Manufacturing Company (TSMC), Micron Technology, Globalfoundries and Toshiba, are likely to participate in an open...

ChipMOS lands 15nm MLC NAND flash backend orders from Toshiba, says paper

Newswatch - Jul 18, 15:03

IC testing and packaging company ChipMOS Technologies has landed backend orders for 15nm MLC NAND flash chips from Toshiba, with volume production to begin in the third quarter of...

ASE, ChipMOS stepping into MEMS packaging sector

Newswatch - Mar 28, 16:00

IC backend service companies Advanced Semiconductor Engineering (ASE) and ChipMOS Technologies have been strengthening their deployments in the MEMS packaging sector, according to...

ChipMOS to debut on TSE in April

Mar 26, 15:39

IC backend service company ChipMOS Technologies plans to debut on the Taiwan Stock Exchange (TSE) in April with an initial price ranging NT$25-30 (US$0.82-0.98). The company posted...

Micron to release more commodity DRAM packaging orders to Taiwan backend service suppliers

Mar 18, 21:37

Micron Technology reportedly plans to release more backend packaging orders for its commodity DRAM chips to Taiwan-based IC testing and packaging companies starting the first half...

ChipMOS to land more large-size LCD driver IC packaging orders in 2014

Mar 14, 16:23

IC backend service company ChipMOS Technologies is expected to land more packaging orders for large-size LCD driver ICs supporting Ultra HD displays amid increasing penetration, according...

ChipMOS net profits nearly double in 2013

Newswatch - Mar 12, 15:52

IC backend service company ChipMOS Technologies has announced net profits of NT$2.32 billion (US$76.58 million) for 2013, increasing 99.6% from a year earlier. The earnings translated...

ChipMOS to nearly halve capex for 2014

Dec 19, 22:04

Packaging and testing firm ChipMOS Technologies plans to allocate NT$1.8 billion (US$60.2 million) for its capex in 2014, down from NT$3.5 billion in 2013.

Transformation: Q&A with ChipMOS chairman and CEO SJ Cheng

Nov 20, 15:54

ChipMOS Technologies is among very few firms that have transformed themselves successfully and are no longer influenced by the volatile memory market. Once known as a packaging and...

ChipMOS chairman and CEO SJ Cheng

ChipMOS to enjoy mid-to-high single digit sales growth in 3Q13

Oct 1, 22:08

IC backend services company ChipMOS Technologies is expected to see its revenues grow by a mid-to-high single digit rate in the third quarter of 2013 buoyed by strong demand from...

ChipMOS and Thailin land backend orders for fingerprint sensors, says report

Newswatch - Sep 3, 12:16

Packaging and testing company ChipMOS Technologies and its subsidiary Thailin Semiconductor, which provides testing services for memory ICs, logic ICs and mixed-signal ICs, have teamed...

ChipMOS to expand capacity for LCD driver ICs, says chairman

Jun 24, 15:52

Packaging and testing firm ChipMOS Technologies plans to expand 12-inch wafer bumping and testing capacity for LCD driver ICs, according to company chairman and CEO SJ Cheng. Overall...

Demand for large-size driver ICs to boom in 2H13, say backend firms

May 21, 14:47

Packaging and testing firms Chipbond Technology and ChipMOS Technologies both expect orders for large-size LCD driver ICs to pull in during the second half of 2013 on booming demand...

ChipMOS capex for 2013 to reach NT$2.5-2.8 billion

May 20, 16:23

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, expects its capex for 2013 to total NT$2.5-2.8 billion (US$83.6-93.6 million)...

chipmos chairman SJ Cheng

ChipMOS subsidiary begins trading on Taiwan emerging stock board

Apr 22, 15:39

ChipMOS Taiwan, a subsidiary of semiconductor assembly and test services provider ChipMOS Technologies, on April 19 started trading on the Emerging Stock Board of the Taiwan Stock...

ChipMOS sees orders for NAND flash, driver ICs pick up

Apr 18, 21:18

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, has seen orders for NAND flash memory and small-size panel driver ICs pick...

ChipMOS subsidiary approved for listing on Taiwan stock market

Apr 16, 13:52

The Taiwan Stock Exchange (TSE) has approved the listing application of ChipMOS Taiwan, a subsidiary of semiconductor assembly and test services provider ChipMOS Technologies.

Himax reportedly lands LCoS solution orders for Google Glass

Mar 7, 14:39

Himax Technologies reportedly has landed orders for LCoS (liquid crystal on silicon) solutions from Google for its Google Glass devices, and shipments of LCoS solutions are expected...

Chipbond, ChipMOS 2013 capex to stay flat

Jan 22, 19:58

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies will have their capex for 2013 stay unchanged at the prior year's level.

ChipMOS to focus 2013 capex on LCD driver IC testing capacity

Dec 24, 09:49

Taiwan-based IC packaging/testing service provider ChipMOS Technologies plans to set aside NT$2.2-2.5 billion (US$75.5-85.8 million) for its 2013 capex budget and use 50% of the amount...

ChipMOS announces new share buyback program

Aug 21, 13:58

ChipMOS Technologies has announced plans to effect a new US$10 million share repurchase program in compliance with Rule 10b5-1 and Rule 10b-18 under the Securities Exchange Act of...

ChipMOS expects 4-8% growth in 3Q12 sales

Aug 20, 15:46

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, expects to post sales growth of 4-8% sequentially in the third quarter of...

Thailin 2Q12 sales up 18%

Jul 6, 01:45

Orders from Japan-based AKM Semiconductor have boosted sales at Thailin Semiconductor, which saw a 17.7% sequential increase in the second quarter of 2012.

Most backend firms give positive 3Q12 outlook

Jul 4, 01:25

With shipments from upstream chipmakers rising, most Taiwan-based packaging and testing houses are expected to post sequential growth in third-quarter sales.

Spansion, ChipMOS extend partnership

Jun 26, 01:55

Packaging and testing firm ChipMOS Technologies (Bermuda) has announced that subsidiary ChipMOS Taiwan and Spansion have extended their ongoing agreement through April 2014.

Chipbond, ChipMOS 2Q12 sales to grow 10%

Jun 25, 15:45

Second-quarter sales at Chipbond Technology and ChipMOS Technologies, two major driver IC packaging and testing houses, are set to register 10% sequential growth driven by brisk demand...

ChipMOS expects sales growth in 2Q12

May 29, 01:30

LCD driver IC packaging and testing firm ChipMOS Technologies expect second-quarter sales to increase 7-12% sequentially with gross margin up about 0.8pp to 7%, thanks to a pick-up...

Chipbond, ChipMOS 2Q12 sales expected to grow

May 7, 15:41

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales register single-digit growth sequentially thanks...

Rising demand for small-size driver ICs to boost revenues for Chipbond, ChipMOS

Apr 17, 14:55

LCD driver IC packaging and testing firms Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales rise driven by growing demand for small-size...

ChipMOS expanding LCD driver IC packaging/testing capacity

Apr 16, 11:31

ChipMOS Technologies, A Taiwan-based provider of IC packaging and testing services, is expanding its 12-inch-wafer gold bumping capacity for packaging and testing LCD driver ICs,...

97 items [1/3]
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