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NEWS TAGGED COF
Wednesday 17 January 2018
ChipMOS lands orders from new clients for gold bumping services
Taiwan-based IC packager ChipMOS is expected to see its revenue growth significantly driven by the combination of its gold bumping with COF packaging services in 2018, as the company...
Thursday 21 December 2017
COF packaging in growing demand
With COF (chip on film) package technology increasingly emerging as a mainstream packaging method for driver ICs for smartphone-use LCD and OLED panels, Taiwan players in the IC packaging...
Monday 18 December 2017
Chipbond seeking to cement China market share, says chairman
Taiwan-based LCD driver IC packaging and testing service provider Chipbond Technology's latest strategic investment deployments in China are mainly designed to consolidate its market...
Wednesday 19 July 2017
Chipbond reportedly to sell partial stake in China subsidiary to BOE
Speculation has circulated in the industry that Taiwan-based Chipbond Technology plans to sell part of its stake in its China-based subsidiary Chipmore Technology to BOE Technology...
Tuesday 20 June 2017
Digitimes Research: Panel makers in China, Taiwan urged to develop in-cell TDDI panels with COF solutions
The new production lines installed or added at the 6G LTPS TFT LCD plants of Taiwan-based AU Optronics (AUO), Innolux and China-based Tianma Micro-electronics and China Star Optoelectronics...
Monday 19 June 2017
Chipbond to see revenues peak in 3Q17
Chipbond Technology, a backend house specializing in LCD driver ICs, is expected to see its third-quarter revenues peak for 2017 driven by a pull-in of orders from Japan-based clients,...
Tuesday 30 May 2017
JMC optimistic about full-screen OLED phone demand
JMC Electronics, an affiliate of Chang Wah Electromaterials (CWE) specializing in the manufacture of chip-on-film (COF) substrates, has expressed optimism about demand for smartphones...
Monday 29 August 2016
Former Simpal executives probed over alleged trade secrets theft
Prosecutors on August 26 raided former Simpal Electronics' offices in Kaohsiung and two former Simpal executives' homes in a probe into suspected theft of business secrets.
Thursday 14 May 2015
JMC to expand production capacity for COF tape
JMC Electronics, an affiliate of Chang Wah Electromaterials (CWE) specializing in the manufacture of chip-on-film (COF) substrates, will launch a new COF tape production line in the...
Thursday 11 December 2014
JMC Electronics to apply for TSE listing
JMC Electronics plans to apply for listing on the Taiwan Stock Exchange (TSE) in 2016, with an initial public offering (IPO) set to be introduced in 2015.
Friday 28 November 2014
COF tape supply likely to fall short
As the number of suppliers decreases, global supply of chip-on-film (COF) tapes has shrunk significantly, according to industry sources. Supply may fall short in 2015, as demand for...
Wednesday 18 December 2013
Chipbond facing increasing competition from rivals in Korea
Korea-based Nepes and LB Semcon, providers of LCD driver IC packaging and testing services, have recently cut their quotes by nearly 30% putting Chipbond Technology under pressure,...
Thursday 2 May 2013
Chipbond to buy COF substrate supplier
Chipbond Technology has said it will acquire Simpal Electronics, a Taiwan-based COF substrate supplier, through a share swap.
Monday 26 December 2011
Firms to phase out COF substrate business
With LCD panel demand for large-size applications such as TVs remaining dull, Mitsui Kinzoku and Sumitomo Electronics Taiwan (SET) are looking to withdraw from the standard chip-on-film...
Tuesday 13 December 2011
Ultrabook demand to trigger birth of thinner CCMs in 2012
The thickness of compact camera modules (CCM), to satisfy demand of ultrabooks have a thickness of only 0.7- to 0.8-inch, is expected to shrink down from a standard size of 3-4mm...