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NEWS TAGGED COG
Thursday 21 December 2017
COF packaging in growing demand
With COF (chip on film) package technology increasingly emerging as a mainstream packaging method for driver ICs for smartphone-use LCD and OLED panels, Taiwan players in the IC packaging...
Friday 24 November 2017
ChipMOS Shanghai to grab backend orders for China homegrown 3D NAND chips
ChipMOS Technologies (Shanghai), of which Tsinghua Unigroup is a major stakeholder, is expected to secure backend orders for 3D NAND flash chips developed by Yangtze River Storage...
Wednesday 19 July 2017
Chipbond reportedly to sell partial stake in China subsidiary to BOE
Speculation has circulated in the industry that Taiwan-based Chipbond Technology plans to sell part of its stake in its China-based subsidiary Chipmore Technology to BOE Technology...
Monday 23 May 2011
Improved demand for LCD panels to boost Chipbond 2Q11 performance
The market of large-size LCD panels have been improving recently. LCD driver IC packaging and testing firm Chipbond Technology has stated the possibility of a better second quarter...
Thursday 20 January 2011
Chipbond responds to media reports on 1Q11 sales
Chipbond Technology has posted a filing with the Taiwan Stock Exchange (TSE) stating it has not issued revenues guidance for the first quarter of 2011.
Friday 24 September 2010
Chipbond likely to miss revenue guidance for 3Q10
Chipbond Technology will likely see revenues for the third quarter of 2010 remain flat on quarter, missing its guidance of 5-10% growth, according to market watchers. The driver-IC...
Monday 9 August 2010
Chipbond posts strong 2Q10 results; gives cautious outlook
Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...
Wednesday 23 June 2010
Driver IC packager Chipbond at almost full capacity on strong demand ahead of holiday season
Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers...
Friday 23 April 2010
Chipbond sees profits in 1Q10
LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...
Thursday 1 April 2010
Chipbond completes merger with peer IST
LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...
Monday 28 December 2009
Chipbond-IST merger set to complete in June 2010
LCD driver IC packaging house International Semiconductor Technology (IST) has announced that its board of directors on December 25 approved a deal to merge with Chipbond Technology,...
Wednesday 12 August 2009
IC material distributor Niching Industrial to enjoy sales growth through 4Q09
Niching Industrial is expected to post sequential revenue growth of 10-15% sequentially in the third and fourth quarters of 2009, according to market watchers. The semiconductor material...
Tuesday 30 June 2009
Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu
Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...
Monday 22 June 2009
Japan IDMs outsourcing IC backend production to Chipbond
Renesas Technology is closing production lines and plans to release bump and chip on glass (COG) orders to Chipbond Technology, while NEC Electronics already started releasing chip...
Thursday 18 June 2009
Niching Industrial begins to deliver COF tape emboss spacers
Taiwan-based semiconductor material supplier Niching Industrial has begun small volume shipments of emboss spacers for chip on film (COF) tape winding. Japan-based Actech is currently...