Taipei, Friday, September 22, 2017 23:23 (GMT+8)
partly cloudy
Taipei
30°C
News tagged FinFET
  • Last update: Friday 22 September 2017 [105 news items]

Tokyo Electron optimistic about etching equipment demand for 3D NAND, FinFET

Sep 22, 10:32

Etching equipment demand for the manufacture of 3D NAND flash memory and FinFET chips is expected to grow in 2018 and 2019, according to Tokyo Electron, which expects its share of...

Tokyo Electron eyeing larger share of global etching equipment market

Globalfoundries to roll out 12nm FinFET technology for high-performance devices

Sep 22, 10:30

Globalfoundries has announced plans to introduce a new 12nm leading-performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density...

Synopsys tapes out DesignWare, Interface IP for TSMC 7nm FinFET process

Sep 20, 13:33

Synopsys has announced the successful tape-out of a broad portfolio of DesignWare Foundation and Interface PHY IP for TSMC's 7nm process technology, including logic libraries, embedded...

Intel provides 10nm updates, plan for 10nm FPGA

Sep 20, 10:49

Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...

IC packager ASE reportedly enters Amazon supply chain

Sep 15, 11:04

Advanced Semiconductor Engineering (ASE) has cut into the supply chain for Amazon's datacenter construction set to begin between 2017 and 2018, by providing 2.5D IC packaging services...

SEMICON Taiwan 2017: KLA-Tencor showcasing reticle blank inspection tools

Sep 13, 14:44

At the ongoing SEMICON Taiwan 2017, KLA-Tencor is showcasing its new FlashScan reticle blank inspection product line which represents the company's entry into the dedicated reticle...

TSMC starts equipment move-in at Nanjing plant

Sep 13, 14:21

TSMC on September 12 held a ceremony to mark the start of equipment move-in at its new 12-inch wafer plant in Nanjing, China.

TSMC chairman Morris Chang at the ceremony to mark the start of equipment move-in at the company's

Samsung intros 11nm LPP process; 7nm LPP with EUV on schedule

Sep 12, 10:47

Samsung Electronics has added 11nm FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with a wider range of options for...

Xilinx, ARM, Cadence and TSMC collaborating on CCIX test chip

Sep 12, 10:36

Xilinx, ARM, Cadence Design Systems and TSMC have announced a collaboration to build the first CCIX (cache coherent interconnect for accelerators) test chip in TSMC 7nm FinFET process...

SPIL obtains packaging orders for AMD Vega 11 GPUs

Sep 8, 15:17

AMD will continue to contract Globalfoundries to manufacture its next-generation Vega GPUs, and will have Siliconware Precision Industries (SPIL) as its major packager for the chips,...

TSMC CoWoS eyeing bigger presence in supercomputer field

Qualcomm Snapdragon 835 chip powers Samsung Galaxy Note8

Aug 24, 11:02

Qualcomm has announced that its premium mobile platform is powering Samsung's latest flagship smartphone for select regions. The Samsung Galaxy Note8 is powered by the Qualcomm Snapdragon...

China could enhance its position in post-Moore's Law era, says former TSMC COO

Aug 23, 14:04

China's semiconductor industry could have a chance of strengthening its position in the post-Moore's Law era, according to Shang-yi Chiang, former executive VP and co-chief operating...

Chiang

Qualcomm to extend tie-up with TSMC, says executive

Aug 21, 13:50

Qualcomm has been working with Taiwan's semiconductor firms for years, including an almost 10-year collaboration with TSMC, said Sudeepto Roy, VP of engineering for Qualcomm Technology...

Qualcomm will extend its collaboration with TSMC to FinFET process

HiSilicon among top-5 customers of TSMC

Aug 16, 12:09

With volume production for its Kirin 970-series chips kicking off, HiSilicon Technologies has become one of Taiwan Semiconductor Manufacturing Company's (TSMC) top-5 customers, according...

TSMC enters volume production for HiSilicon Kirin 970 processor

Globalfoundries demos 2.5D HBM solution

Aug 16, 09:33

Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...

Globalfoundries intros solution leveraging 2.5D packaging with low-latency

TSMC 12nm FinFET process ready for volume production in 4Q17, says report

Aug 14, 15:57

Taiwan Semiconductor Manufacturing Company (TSMC) will enter volume production of chips built using its 12nm FinFET process in the fourth quarter of 2017, according to a recent Chinese-language...

MediaTek to transfer 28nm chip orders to UMC

Jul 25, 09:16

MediaTek plans to transfer part of its 28nm mobile chip orders, including those for the Amazon Echo Dot, to United Microelectronics (UMC) from Taiwan Semiconductor Manufacturing Company...

MediaTek

TSMC InFO packaging brings more competitiveness to its 7nm process technology

Jul 20, 11:45

Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness...

Upcoming Meizu Pro 7 series reportedly to utilize MediaTek chips

Jul 19, 21:24

Meizu is scheduled to introduce its new Pro 7 and Pro 7 Plus smartphone series on July 26. The Pro 7 model is expected to feature MediaTek's 16nm Helio P25 SoC chip while the Pro...

FD-SOI a promising technology: Q&A with Globalfoundries CEO Sanjay Jha

Jul 19, 10:37

Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...

Globalfoundries CEO

Globalfoundries CEO predicts a golden decade for semiconductors

Jul 3, 15:04

The semiconductor industry will enter a golden age in the next decade, driven by robust chip and memory demand for ultra-large data centers and artificial intelligence (AI) applications,...

Globalfoundries CEO Sanjay Jha

Credo partnering with Foxconn to deliver 10M 100G active copper cable solutions

Jul 3, 13:48

Credo Semiconductor, a developer of serializer-deserializer (SerDes) circuits, technology and IP cores, and Foxconn Interconnect Technology, a supplier of interconnect solutions,...

Qualcomm expanding mobile chip offering for mid-range smartphones

Jun 29, 10:37

Qualcomm has introduced its Snapdragon 450-series mobile chips, a new entry to the Snapdragon 400 mobile platform tier designed for mid-range smartphones and tablets. The Snapdragon...

7nm foundry market to heat up in 2018

Jun 16, 16:03

IC foundries are gearing up for mass production of 7nm chips in 2018, as well as production for 7nm process technology using extreme ultraviolet (EUV), according to market observers...

Globalfoundries launches 7LP FinFET process

Jun 14, 20:56

Globalfoundries has announced the availability of its 7nm leading-performance (7LP) FinFET semiconductor technology, delivering a 40% generational performance boost to meet the needs...

IBM, Globalfoundries and Samsung build new transistor for 5nm technology

Jun 5, 22:20

IBM on June 5 announced that the company and its research alliance partners Globalfoundries and Samsung, and equipment suppliers have developed an industry-first process to build...

MediaTek to enter mass production of 12nm mobile chips by end of 2017

Jun 1, 15:20

MediaTek is expected to start mass production of 12nm mobile chips manufactured by Taiwan Semiconductor Manufacturing Company around the end of 2017, according to industry sources...

TSMC to start equipment move-in at Nanjing plant in September

May 30, 15:51

Taiwan Semiconductor Manufacturing Company's (TSMC) new 12-inch plant in Nanjing, China will be ready for equipment move-in in September 2017, according to the Taiwan-based foundry...

TSMC installed capacity for 2017 to rise 10%

SMIC urges Taiwan chipmakers to partner with China-based peers

May 5, 11:24

The Taiwan government should encourage its local chipmakers to collaborate with their China-based peers to create a win-win for both sides' semiconductor industries, according to...

Ardentec breaks ground for new plant in Nanjing

Apr 25, 15:05

Taiwan-based Ardentec, which specializes in testing services for logic and memory chips, has recently broken ground for a new plant in Nanjing, China where Taiwan Semiconductor Manufacturing...

TSMC talks about its next growth drivers

Apr 25, 11:40

Taiwan Semiconductor Manufacturing Company (TSMC) is seeing robust growth in demand from the mobile computing, automotive electronics, IoT and high-performance computing sectors,...

Samsung completes qualification of 2nd-gen 10nm process technology

Apr 21, 13:57

Samsung Electronics has announced that its second-generation 10nm FinFET process technology, 10LPP (Low Power Plus), has been qualified and is ready for production. With further enhancement...

Samsung on track for 10nm FinFET process production ramp-up

Mar 16, 14:06

Samsung Electronics has announced its production ramp-up of the 10nm FinFET process technology is on track with steady high yield to meet customer needs on schedule.

China foundries planning FD-SOI process technology

Feb 17, 14:31

China-based IC foundries, such as Shanghai Huali Microelectronics (HLMC), are evaluating plans to offer FD-SOI process technology since they are less competitive in the mainstream...

eMemory NeoFuse IP verified for TSMC 16nm FinFET compact process

Feb 9, 10:28

Taiwan-based eMemory has announced the availability of NeoFuse technology qualified for TSMC's 16nm FinFET compact (16FFC) process. Customers have already embedded the NeoFuse IP...

105 items [1/3]
  • Samsung+14nm+chips+for+wearables

    Samsung 14nm chips for wearables

    Samsung Electronics has announced mass production of the Exynos 7 Dual 727 mobile application processor (AP) designed specifically for wearable devices with 14nm FinFET process technology...

    Photo: Company, Oct 18.

  • Samsung+14nm+Exynos+chips

    Samsung 14nm Exynos chips

    Samsung Electronics has begun mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14nm process technology for the budget smartphone...

    Photo: Company, Aug 31.

  • Samsung+Exynos+7+Octa

    Samsung Exynos 7 Octa

    Samsung Electronics has begun mass production of mobile application processors built using 14nm FinFET process technology. Samsung's 14nm FinFET process will be adopted by its Exynos...

    Photo: Company, Feb 24.

Global notebook shipment forecast, 2017 and beyond
China AMOLED panel capacity expansion forecast, 2016-2020

22-Sep-2017 markets closed

 LastChange

TAIEX (TSE)10449.68-128.76-1.22% 

TSE electronic443.63-7.25-1.61% 

GTSM (OTC)142.14-1.61-1.12% 

OTC electronic210.57-2.68-1.26% 

Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.