Driver IC packaging and testing companies Chipbond Technology and International Semiconductor Technology (IST) are likely to enjoy revenue growth of more than 80% sequentially in...
Taiwan-based LCD driver IC packaging and testing houses are expected to see their fabs running at full capacity by the end of the second quarter, as more Japan-based IDMs have begun...
Driver IC packaging and testing companies Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) have seen their recently capacity...
Most packaging and testing houses, including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL), saw significant increases in sales in February, thanks...
Packaging and testing house International Semiconductor Technology's (IST's) November sales were NT$193 million (US$5.78 million), representing a 34% sequential decline, the company's...
Driver IC packaging and testing houses Chipbond Technology, International Semiconductor Technology (IST), and ChipMOS Technologies will see their utilization rates drop to 55-60%...
Packaging and testing house International Semiconductor Technology (IST) has seen its utilization rate drop significantly because of weak demand from driver IC clients. The company...
Chipbond Technology and International Semiconductor Technology (IST) are preparing to increase gold bumping quotes for the second consecutive quarter in the third quarter in order...
