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News tagged Lingsen
  • Last update: Monday 5 June 2017 [12 news items]

Robust NOR flash demand to boost 3Q17 performance at backend firms

Jun 5, 10:22

Taiwan-based backend service companies including ChipMOS Technologies, Walton Advanced Engineering and Lingsen Precision Industries are expected to post brisk revenue results for...

ChipMOS 1Q17 revenues slip 2%

Apr 11, 10:27

ChipMOS Technologies, a backend house targeting the LCD driver IC and memory chip sectors, saw its first-quarter revenues slip about 2% sequentially and outperform its estimate of...

Backend firms Walton, Lingsen seeing brisk NOR flash demand

Apr 5, 15:10

Taiwan-based backend service companies Lingsen Precision Industries and Walton Advanced Engineering have both landed orders for NOR flash memory from Macronix International and Winbond...

Tong Hsing, Lingsen see MEMS driving 2014 growth

Mar 4, 13:45

Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, expects robust growth in sales generated from its...

Lingsen, KYEC new production capacity to come online in 2Q14

Mar 3, 21:52

MEMS backend service companies Lingsen Precision Industries and King Yuan Electronics (KYEC) both will have their new production capacity ready for commercial production in the second...

IC testing firm Lingsen to see 5% revenue drop in 3Q12, but MEMS lines still growing

Aug 20, 15:57

IC packaging and testing company Lingsen Precision Industries is expected to see its revenues drop within a range of 5% in the third quarter of 2012 due to a correction in testing...

Greatek, Lingsen 2Q12 sales to grow

Jun 19, 14:24

Second-tier Taiwan-based IC packaging and testing companies Greatek Electronics and Lingsen Precision Industries expect to post sequential revenue growth of 20% and more than 30%,...

Lingsen Precision, Greatek to expand capacity

May 30, 01:10

Lingsen Precision Industries and Greatek Electronics, two Taiwan-based providers of IC packaging/testing services, have set aside capex budgets of NT$800 million (US$27.1 million)...

Second-tier packaging and testing firms post sales growth in 1Q12

Apr 11, 14:16

Revenues at Taiwan's second-tier packaging-and-testing houses Giga Solution, Greatek Electronics, Lingsen Precision Industries and Thailin Semiconductor all registered single-digit...

IC packager Lingsen shares up on increased InvenSense orders, says report

Newswatch - Apr 7, 14:34

InvenSense, which supplies MEMS gyroscopes for the Nintendo 3DS, is expected to increase its orders to backend partner Lingsen Precision Industries due to strong demand for the recently-launched...

Second-tier IC packagers lower quotes to woo orders from IC designers

Jan 20, 12:07

Second-tier IC packaging and testing companies have lowered their quotes by 5-10% on average recently in order to attract more orders from IC design houses who have been switching...

Akustica adds Epson and Lingsen to its CMOS MEMS supply chain

Dec 10, 11:12

CMOS MEMS microphone maker Akustica has announced that it has qualified Seiko Epson and Taiwan-based Lingsen Precision Industries (LPI) as its foundry and assembly partners, respectively...

Realtime news
  • Lite-On Technology starts construction of operational center in southern Taiwan

    IT + CE | 12min ago

  • TSEC scraps JV plan for new PV module plant

    Green energy | 20min ago

  • UltraChip, INT Tech form joint venture to develop AMOLED driver ICs

    Bits + chips | 30min ago

  • ReneSolar to be delisted from NYSE

    Green energy | 33min ago

  • China Electric Mfg expects global LED lighting penetration to exceed 40% in 2017

    LED | 37min ago

  • Robots to enhance, not replace humans in most jobs, says ARM survey

    IT + CE | 47min ago

  • Qualcomm expanding mobile chip offering for mid-range smartphones

    Bits + chips | 1h 12min ago

  • CMOS image sensor sales to reach another record high in 2017, says IC Insights

    Bits + chips | Jun 28, 22:22

  • Imec looking to deepen partnerships with China-based chipmakers

    Bits + chips | Jun 28, 22:17

  • Qualcomm announces advanced fingerprint scanning and authentication technology

    Bits + chips | Jun 28, 22:13

  • Powerchip opens JV fab in China

    Bits + chips | Jun 28, 22:11

  • Powerchip eyeing orders from Illumina

    Before Going to Press | Jun 28, 21:29

  • MWC Asia 2017: Lenovo showcases next-generation Moto Z2 smartphone

    Before Going to Press | Jun 28, 21:12

  • Laster Tech expects LED automotive lighting module shipments to jump 100%

    Before Going to Press | Jun 28, 21:09

  • MWC Asia 2017 opens, highlighting 5G technology

    Before Going to Press | Jun 28, 20:42

  • Taiwan market: Microsoft launches Surface Pro

    Before Going to Press | Jun 28, 20:07

  • China likely to become largest 5G market by 2025, says GSMA executive

    Before Going to Press | Jun 28, 19:56

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Intel strategies in the mobile device market

29-Jun-2017 09:45 (GMT+8)

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Analysis of China revised domestic semiconductor industry goals
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