Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer specializing in mask solutions and wafer handling tools, has expressed optimism that its...
With TSMC and Samsung Electronics stepping up the development of their sub-5nm process technologies, ASML will continue to see strong extreme ultraviolet (EUV) lithography equipment...
China's SMIC is struggling to obtain crucial EUV lithography equipment for the development of its sub-7nm process technologies, and will be seeking a dialogue with ASML with the help...
Entegris has announced it has agreed to settle patent litigation and disputes with Gudeng Precision related to reticle pod technology for both conventional and EUV lithography. The...
Samsung Electronics is reportedly looking to advance its partnership with EUV fab tool vendor ASML, aiming to accelerate the development of its advanced 5nm and 3nm foundry process...
The development of China's homegrown semiconductor industry is taking shape, according to Charles Kau, who has just resigned as executive VP of global operations for Tsinghua Unigr...
With Semiconductor Manufacturing International (SMIC) at risk of being blacklisted by the US government, concerns are growing about whether China-based memory chipmakers ChangXin...
TSMC is expected to cumulatively purchase about 55 sets of EUV lithography equipment by the end of 2021, as the foundry is stepping up its EUV process manufacturing development, according...
TSMC has marked the manufacture of the one-billionth good die on the foundry's 7nm technology, which means one billion functional, defect-free 7nm chips.
China's Huawei reportedly is looking to build its own 45nm chip fabrication lines without US technology this year, which industry sources believe is "mission impossible."
KLA has announced the eSL10 e-beam patterned-wafer defect inspection system, which is designed to accelerate time-to-market for high-performance logic and memory chips, including...
China's state-backed SMIC has stepped up the development of its FinFET process technology, disclosing plans to roll out its FinFET N+1 and N+2 processes without implementing EUV li...
Gudeng Precision Industrial, a member of TSMC Grand Alliance and Taiwan's first semiconductor equipment maker allowed to join SEMI in setting next-generation equipment standards after...
Whenever Moore's Law has seemingly reached its physical limits, there have been always new tech innovations emerging to break the limits, with EUV process and advanced packaging technology...
