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Monday 21 June 2010
Elpida, PTI and UMC enter joint development deal for 3D-TSV technology
Elpida Memory, Powertech Technology (PTI) and United Microelectronics Corporation (UMC) have jointly announced their entry into a 3-way cooperation to advance 3D IC integration technologies...
Monday 24 May 2010
Samsung to strengthen foundry business
Industry sources believe that Samsung Electronics is seeking to boost its system LSI operations in addition to its ambition in the memory segment. The leader in DRAM and NAND flash...
Thursday 20 May 2010
Foundry production for driver and PWM ICs to remain tight in 2H10, says VIS chairman
Foundry production for LCD driver and power management ICs will continue to lag behind demand in the second half of 2010, especially for the 0.18-micron process, according to Chang...
Friday 7 May 2010
PTI sees MCP, SiP contributions grow in 1Q10 revenues
Memory backend supplier Powertech Technology (PTI) managed to push the revenue ratios of its non-memory MCP (multi-chip package) and SiP (system-in-package) services to 11% and 9%,...
Monday 12 April 2010
VIS 1Q10 revenues up 14% on quarter
Vanguard International Semiconductor (VIS), which specializes in analog/mixed-signal and logic ICs, saw March revenues grow 7% sequentially to NT$1.25 billion (US$40 million). Revenues...
Monday 1 February 2010
VIS to see growth in 1Q10 shipments and utilization rates, but drop in ASPs
Specialty IC foundry Vanguard International Semiconductor (VIS) has estimated wafer shipments and capacity utilization rates for the first quarter to grow from the fourth quarter...
Friday 29 January 2010
Wafer testing house Ardentec to buy new plant to ramp capacity in 2010
The board of directors of wafer testing house Ardentec has decided to buy a new plant as a means to ramp up its capacity, which in turn is likely to push its capex budget for 2010...
Wednesday 27 January 2010
PTI targets top-4 spot in global IC backend market
Powertech Technology (PTI) aims to become the number-four IC packaging and testing house worldwide in three years, chairman DK Tsai said at the company's annual banquet on January...
Monday 11 January 2010
Winbond consolidated revenues up in 2009
Memory maker Winbond Electronics, which has moved to turn its focus away from commodity DRAM, saw revenues from its core business decrease 10.5% in 2009. But consolidated revenues...
Tuesday 5 January 2010
Testing houses Ardentec, UTAC enter MediaTek supply chain
MediaTek has recently added two testing partners, Ardentec and UTAC Taiwan, and given them small-volume orders to help diversify risk, according to industry sources.
Wednesday 30 December 2009
SMIC Wuhan fab to expand foundry services
Wuhan Xinxin Semiconductor Manufacturing, a 12-inch fab managed by Semiconductor Manufacturing International Corporation (SMIC), has revealed plans to expand from memory chip manufacturing...
Tuesday 22 December 2009
Nuvoton expands 32-bit MCU lines
Nuvoton Technology, the logic IC subsidiary of Winbond Electronics, has licensed ARM's Cortex-M0 processor for its 32-bit microcontroller units (MCUs). It plans to introduce a series...
Tuesday 6 October 2009
IMEC sets major step towards 3D integration of DRAM on logic
Leuven, Belgium - September 30, 2009 - IMEC and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D...
Friday 2 October 2009
KYEC expects revenue growth in 4Q09
IC testing house King Yuan Electronics Company (KYEC) expects revenues in the fourth quarter to see sequential growth, better than the original forecast of a flat performance, according...
Tuesday 29 September 2009
IC testing house Sigurd signs new customer; EPS to grow in 2010
Sigurd Microelectronics has obtained orders for testing ICs used in consumer electronics, handsets and PCs from a US-based IDM, becoming the vendor's sole testing partner in Taiwan,...