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News tagged low-power
  • Last update: Friday 10 November 2017 [73 news items]

Andes Technology joins Globalfoundries FD-SOI ecosystem

Nov 10, 16:21

Processor IP provider Andes Technology has teamed up with Globalfoundries to provide low-power solutions for the foundry's 22nm FD-SOI process technology to jointly deepen their deployment...

Andes Technology president Frankwell JM Lin (center)

ACTT complete IoT solutions available on SMIC 55nm eFlash platform

Oct 13, 10:54

Semiconductor Manufacturing International (SMIC) and Chengdu Analog Circuit Technology (ACTT) have jointly announced the availability of ACTT's analog IP solutions on SMIC's 55nm...

AMD to launch 12nm Ryzen in February 2018, says mobo makers

Sep 27, 14:28

AMD has informed its partners that it plans to launch in February 2018 an upgrade version of its Ryzen series processors built using a 12nm low-power (12LP) process at Globalfoundries,...

AMD reportedly ready to launch 12nm Ryzen processors

Samsung ready to mass produce MRAM chips using 28nm FD-SOI process

Sep 26, 11:32

Samsung Foundry will soon be ready to enter mass production of magnetoresistive random-access memory (MRAM) chips built using 28nm fully depleted silicon-on-insulator (FD-SOI) process...

QuickLogic offers eFPGA technology on SMIC 40nm low leakage process

Sep 13, 14:45

Semiconductor Manufacturing International (SMIC) and QuickLogic have announced the availability of QuickLogic's ArcticPro embedded FPGA (eFPGA) technology on SMIC's 40nm low leakage...

Qualcomm, Himax jointly develop 3D depth sensing solution

Aug 30, 19:04

Qualcomm and Himax Technologies have jointly announced a collaboration to accelerate the development and commercialization of a high-resolution, low-power active 3D depth sensing...

Qualcomm Snapdragon 835 chip powers Samsung Galaxy Note8

Aug 24, 11:02

Qualcomm has announced that its premium mobile platform is powering Samsung's latest flagship smartphone for select regions. The Samsung Galaxy Note8 is powered by the Qualcomm Snapdragon...

Dialog looking to extend partnership with Spreadtrum

Aug 18, 10:22

Dialog Semiconductor is looking to extend its partnership with Spreadtrum Communication, and does not rule out forming a joint venture with the China-based mobile SoC provider, said...

Christophe Chene, senior VP of Asia for Dialog

Globalfoundries and VeriSilicon to enable single-chip solution for next-gen IoT networks

Jul 17, 14:03

Globalfoundries and VeriSilicon have announced a collaboration to deliver a single-chip IoT solution for next-generation Low Power Wide Area (LPWA) networks. Leveraging GF's 22FDX...

Faraday unveils 28HPC USB 3.1 PHY and 40LP Type-C PHY with PD controller

Jul 14, 14:01

Faraday Technology, a Taiwan-based ASIC design service and IP provider, has announced the availability of its USB 3.1 PHY on UMC 28HPC process, as well as the silicon-verified USB...

Wireless charging demand promising: Q&A with Dialog CEO Jalal Bagherli

Jul 6, 11:58

As a global leader in providing rapid charging solutions, Dialog Semiconductor has demonstrated its prowess in power management for smartphones and other applications. But the market...

Dialog CEO Jalai Bagherli

MediaTek unveils NB-IoT SoC, partnership with China Mobile

Jun 29, 15:04

MediaTek has unveiled its first narrow band Internet of Things (NB-IoT) system-on-chip (SoC), the MT2625, and announced a collaboration with China Mobile to build what the companies...

Samsung mass producing Exynos-branded IoT solution

Jun 22, 22:13

Samsung Electronics has announced the start of mass production of its first Exynos-branded IoT solution, the Exynos i T200.

Faraday MFP ASIC shipments rise at CAGR of 38%

Jun 22, 21:20

Faraday Technology has announced that its MFP (Multi-Function Printer) ASIC solutions have surpassed 50 design wins since its introduction 10 years ago, and the MFP ASIC shipment...

Handset IC sales to top total personal computing in 2017, says IC Insights

Jun 20, 14:21

The ongoing slump in shipments of standard PCs along with the drop-off in tablets are setting the stage for handset IC sales to finally surpass IC revenues in total personal computing...

Global Unichip rolls out HBM2 total solution

Jun 19, 19:38

Global Unichip has successful taped out a 16nm, second-generation high bandwidth memory (HBM) PHY and controller with verified interposer design and CoWoS package. The ultra-high...

MediaTek to hire 1,000 staff in 2017, says co-CEO

Jun 19, 14:19

MediaTek will recruit an additional 1,000 employees in 2017, said newly-appointed co-CEO Rick Tsai at the company's general shareholders meeting recently.

MediaTek co-CEOs

Packaging can extend physical limits of semiconductors, says TSMC chair

Jun 12, 15:41

Moore's Law will reach its physical limits in 8-10 years, but the development of advanced packaging technology will help extend innovations, according to Morris Chang, chairman of...

TSMC chairman Morris Chang

PTI optimistic about memory-dominated packaging

Jun 2, 10:30

The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...

MediaTek launches next-gen Wi-Fi chipset portfolio for IoT

Jun 1, 15:21

MediaTek has announced its next-generation Wi-Fi chipset portfolio for connected smart home, office and other IoT applications. The MediaTek MT7686, MT7682, and MT5932 will deliver...

DRAM market to remain oligopoly over next 3 years, says Nanya president

Jun 1, 15:21

The global DRAM market will remain an oligopoly of three large firms over the next three years, according to Pei-Ing Lee, president for Taiwan-based Nanya Technology.

Nanya president Pei-Ing Lee expects global DRAM industry to remain an oligopoly over the next 3 year

TSMC talks about its next growth drivers

Apr 25, 11:40

Taiwan Semiconductor Manufacturing Company (TSMC) is seeing robust growth in demand from the mobile computing, automotive electronics, IoT and high-performance computing sectors,...

Specialty DRAM prices to rise, says AP Memory

Apr 24, 11:33

AP Memory Technology has disclosed plans to raise its specialty DRAM (SRAM) prices. The memory design house also expressed optimism about demand for IoT applications that will offset...

Samsung completes qualification of 2nd-gen 10nm process technology

Apr 21, 13:57

Samsung Electronics has announced that its second-generation 10nm FinFET process technology, 10LPP (Low Power Plus), has been qualified and is ready for production. With further enhancement...

RDA chip shipments for IoT applications top 1 million units

Apr 20, 14:21

RDA Microelectronics has seen cumulative shipments of its chip solutions for IoT applications top one million units, according to the China-based chip provider.

RDA CEO Shuran Wei

Actility and Ginko to push LPWA network in China

Mar 2, 11:32

France-based low-power wide-area (LPWA) network player Actility will partner with Ginko Ventures to establish a joint venture, ThingPark China, in China to accelerate the expansion...

Mobile satellite communications provider Inmarsat announces low-power global IoT network

Feb 9, 15:43

Inmarsat and Actility have announced a LoRaWAN&-based network that has the potential to allow customers and partners to cost-effectively bring to market IoT solutions that can...

SMIC, Synopsys deliver 28nm HKMG low-power reference flow

Jun 13, 11:03

Semiconductor Manufacturing International (SMIC) and Synopsys have announced immediate availability of their joint 28nm RTL-to-GDSII reference design flow. Developed through deep...

TSMC rolls out low-cost version of 16nm FinFET

Oct 15, 10:33

TSMC has quietly rolled out a compact, low-power version of its 16nm FinFET fabrication process - 16nm FinFET Compact (16FFC). With the availability of three series of its 16nm FinFET...

Taiwan companies with SoC expertise can focus on low-power technologies for IoT, says ARM executive

Jun 4, 14:06

Taiwan-based IC companies should utilize their expertise in SoC technology to focus on the development of low-power technologies, which would enable them to seize opportunities in...

Ian Drew, CMO and EVP of Marketing for ARM

M31 teams up with Imagination

May 28, 11:37

Silicon IP provider M31 Technology has announced a collaboration with Imagination Technologies. The companies will focus on low-power technologies for the IoT, wearables and other...

Imagination announces low-power wireless IP for wearable and IoT

Apr 16, 15:57

Imagination Technologies has announced the first members of its Ensigma Whisper flexible connectivity IP family, designed specifically to enable the integration of ultra-low power...

M31 offers low-voltage and low-power physical IP solutions for TSMC 55ULP targeting IoT

Apr 2, 10:39

M31 Technology has announced the availability of its low-voltage and low-power physical IP solutions on TSMC 55nm ultra-low power process technology. The platform provides system-on-a-chip...

Delta Electronics lands orders for distributed, low-power inverters form Japan, say papers

Newswatch - Dec 23, 11:48

Taiwan-based power supply and energy management solution provider Delta Electronics has obtained orders for 750-800 20KW distributed inverters for use in a 15MWp PV power-generating...

QuickLogic introduces low-power sensor hub solution

Oct 17, 12:28

QuickLogic has unveiled its ArcticLink 3 S1, an ultra-low power platform for managing sensors of mobile devices. The S1 platform integrates sensor management and fusion, optimizes...

73 items [1/3]
  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • SK+Hynix+6Gb+LPDDR3

    SK Hynix 6Gb LPDDR3

    SK Hynix has developed 6Gb low-power DDR3 (LPDDR3) using 20nm-class process technology. This product is a high-performance mobile memory solution that features low power consumption...

    Photo: Company, Nov 1.

  • Intel+Bay+Trail%2Dbased+Atom+Z3000+series+processor

    Intel Bay Trail-based Atom Z3000 series processor

    Intel has launched its latest family of low-power systems-on-a-chip (SoC), codenamed Bay Trail, for tablets, 2-in-1s and other mobile devices. It will be available to consumers...

    Photo: Company, Sep 24.

  • MSI+MS%2D9A29+embedded+system

    MSI MS-9A29 embedded system

    MSI has released a new embedded system to the market. The newly launched MS-9A29 is an ultra compact size fanless embedded system with low-power Intel Atom processor, offering a solution...

    Photo: Company, Aug 19.

  • SK+Hynix+8Gb+LPDDR3

    SK Hynix 8Gb LPDDR3

    SK Hynix has developed 8-gigabit LPDDR3 memory using 20nm-class process technology. The chips are targeted at mobile devices that are high-speed, high-density and low-power consumption...

    Photo: Company, Jul 15.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.