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News tagged mobile
  • Last update: Wednesday 13 December 2017 [1453 news items]

Qualcomm, MediaTek yet to advance to 7nm node

Dec 13, 14:48

Qualcomm has decided to continue adopting Samsung's 10nm process for fabricating its newly released Snapdragon 845 chipset for smartphones, instead of advancing to 7nm process node...

Digitimes Research: Mobile operators looking for alternatives from unlicensed spectrum technology

Dec 12, 15:07

With the popularity of the LTE-Advanced (LTE-A) networks growing at a pace slower than expected in part due to the difficulty in securing sufficient spectrum resources, a growing...

Qualcomm Snapdragon 845 introduces new architectures for AI, immersion

Dec 7, 14:07

Qualcomm Technologies has introduced the new Qualcomm Snapdragon 845 mobile platform designed for immersive multimedia experiences including eXtended reality (XR), on-device artificial...

Qualcomm launches next-generation Snapdragon Mobile Platform

Dec 6, 14:52

Qualcomm has announced its next-generation flagship mobile technology, the Snapdragon 845 Mobile Platform. The full unveiling of all the Snapdragon 845 Mobile Platform features and...

Toshiba Memory unveils 2TB NVMe SSD

Nov 30, 12:28

Toshiba Memory has enhanced its line-up of client SSDs with the launch of premium models in its XG5-P series. The new NVM Express (NVMe) client SSDs improve on the performance of...

Toshiba Memory NVMe client SSD premium model XG5-P series

China October mobile user base grows to 1.403 billion, says MIIT

Nov 27, 10:51

China logged 1.403 billion subscribers to mobile communication services as of October 2017, increasing 0.64% sequentially and 6.49% on year, with 139.63 million (9.95%) of them being...

Global mobile DRAM revenues to surge in 4Q17, says DRAMeXchange

Nov 24, 10:41

Average prices for mobile DRAM chips are expected to rise 10-15% sequentially in the fourth quarter of 2017, when the industry will enjoy a higher sequential increase in output value...

Standalone VR HMDs to enjoy growing popularity in China

Nov 17, 13:37

With the ecosystem of standalone virtual reality (VR) head-mounted displays (HMDs) and PC-bundled VR HMDs gradually becoming more complete, demand for the two types of devices are...

VR HMD shipments to reach 7.8 million units in 2017 in China

Austria chipmaker ams partners with China firm to develop 3D sensing camera solutions

Nov 17, 13:17

Austria-based ams and China-based Ningbo Sunny Opotech, an optical image system solution provider, have announced a collaboration to jointly develop and market 3D sensing camera solutions...

Next-gen iPad Pro to feature 7nm A11X chip, says report

Nov 16, 15:29

Speculation circulated recently in the chipmaking industry that Taiwan Semiconductor Manufacturing Company (TSMC) is gearing up for 7nm chip production for Apple's in-house designed...

HiSilicon selects Cadence Tensilica Vision P6 DSP for Kirin 970

Nov 15, 13:52

Cadence Design Systems has announced that HiSilicon, a global fabless semiconductor and IC design company, has selected the Cadence Tensilica Vision P6 DSP for its 10nm Kirin 970...

AI may reshape Taiwan role in global tech sector, says Google Taiwan chief

Nov 13, 10:40

As the world is moving into the AI First era from the Mobile First one, AI (artificial intelligence) development will be of great importance to Taiwan and likely to reshape its role...

Google Taiwan managing director LF Chien

Spreadtrum chips adopted by Accent for smartphones sold in North Africa

Nov 9, 10:46

Spreadtrum Communications, a China-based fabless chipmaker specializing in mobile SoCs, has announced its solutions have been selected by Accent, an IT brand based in Morocco, for...

TSMC 3nm fab construction to kick off in 2020, chairman says

Nov 6, 13:47

Taiwan Semiconductor Manufacturing Company (TSMC) founder and chairman Morris Chang said at a recent company event that the pure-play foundry will start constructing its advanced...

TSMC chairman Morris Chang

Lead time for MOSFET chips extends

Oct 30, 12:16

Major MOSFET suppliers have extended delivery lead times to 13-18 weeks from 8-12 weeks as the supply of MOSFET chips has become tighter on rising demand for electric cars, according...

Silicon Motion SSD solutions sales hike 50% in 3Q17

Oct 30, 11:08

NAND flash device controller supplier Silicon Motion Technology saw sales of its enterprise and industrial SSD solutions increase approximately 50% sequentially in the third quarter,...

Innolux reports net profits NT$880 million for 3Q17

Oct 27, 15:51

Innolux has registered consolidated revenues of NT$79.5 billion (US$2.61 billion) for the third quarter with operating margin 20.3%, operating profits NT$10.9 billion, net profits...

Innolux registered profits for 3Q17

Backend houses expect rising memory demand for servers and datacenters

Oct 26, 10:42

IC backend houses have expressed optimism about memory demand for servers and datacenter applications, which require high-bandwidth and high-density memory devices. The memory demand...

China September mobile communication user base grows to 1.395 billion

Oct 25, 15:19

There were 1.395 billion subscribers of mobile communication services in China as of September 2017, increasing 0.91% sequentially and 5.95% on year, with 141.73 million (10.16%)...

White-box notebook makers displaying ultra-thin, 2-in-1 devices in Hong Kong trade fair

Oct 20, 16:11

China-based white-box notebook players are showcasing their new ultra-thin notebooks and 2-in-1 devices at the ongoing Global Sources Mobile Electronics trade show in Hong Kong.

White-box notebooks are one of the spotlights at Global Sources Mobile Electronics

Asia Pacific Telecom gearing up for 5G network deployments

Oct 20, 16:03

Asia Pacific Telecom (APT) is actively proceeding with deployments of 5G mobile communications infrastructure, with a spate of tests and certifications of network technologies scheduled...

APT chairman Lu Fang-ming

TSMC raises IC market forecasts for 2017

Oct 20, 14:52

Taiwan Semiconductor Manufacturing Company (TSMC) has revised upward its forecasts for global foundry and overall IC market outlook for 2017 to a 7% and 16% growth, respectively,...

TSMC 7nm process ready for mass production in 1H18

White-box smartphone players adopting new innovations to enhance competitiveness

Oct 20, 11:22

Facing fierce competitions from first-tier vendors, white-box smartphone vendors have been incorporating the latest technologies such as all-screen high-resolution displays, fingerprint...

TSMC 3Q17 profits slip

Oct 19, 15:27

Taiwan Semiconductor Manufacturing Company (TSMC) has reported net profits of NT$89.93 billion (US$2.97 billion) on consolidated revenues of NT$252.11 billion for the third quarter...

TSMC saw profits drop on year in 3Q17

MediaTek to post slight decrease in 4Q17 revenues

Oct 19, 11:37

MediaTek is expected to post a slight sequential decrease in consolidated revenues for the fourth quarter of 2017, with gross margin to stay flat, according to industry sources.

Samsung completes qualification of 8LPP process

Oct 19, 11:21

Samsung Electronics' 8nm FinFET process technology, the 8LPP (Low Power Plus), has been qualified and is ready for production, according to the company.

Qualcomm announced 5G data connection on 5G modem chipset for mobile devices

Oct 18, 16:01

Qualcomm has announced that its subsidiary, Qualcomm Technologies, has successfully achieved a 5G data connection on a 5G modem chipset for mobile devices. The 5G data connection...

ZTEWelink wins NB-IoT module orders from China Telecom

Oct 18, 13:55

China-based ZTEWelink Technology has won a bid to supply a total of 500,000 NB-IoT modules to China Telecom at CNY36 (US$5.47) per unit, according to industry sources.

Samsung striving for OLED panel orders from China

Oct 17, 11:59

Samsung Display is striving for OLED panel orders from China-based mobile device vendors, but will be facing competition from its China-based rivals such as BOE Technology and Tianma...

Mitac to spin off mobile communication product business

Oct 16, 16:11

Mitac Holdings has announced subsidiary Mitac International will spin off its mobile communication product business group, which will be transferred to a new entity with a capital...

Mitac to spin off IoT affiliate for flexibility

KYEC obtains key backend orders from MediaTek

Oct 16, 13:24

Testing house King Yuan Electronics (KYEC) has obtained orders for MediaTek's major products for 2018, including 12nm mobile SoCs, and chips solutions for voice assistant devices...

Mobile DRAM prices to rise 10-15% in 4Q17, says DRAMeXchange

Oct 13, 10:49

Average prices for mobile (LPDDR) DRAM products are expected to rise 10-15% sequentially in the fourth quarter of 2017, according to DRAMeXchange. Major suppliers have intentionally...

Qualcomm faces antitrust fine in Taiwan

Oct 12, 11:40

Taiwan's Fair Trade Commission (FTC) has concluded an investigation into wireless chipmaker Qualcomm, finding that certain of the company's business practices are in violation of...

Qualcomm says it will appeal the FTC ruling

Win Semiconductors reportedly enters iPhone X supply chain

Oct 6, 13:59

Win Semiconductors, one of Taiwan's top-3 GaAs PA (power amplifier) suppliers, has reported consolidated revenues of NT$4.395 billion (US$144.58 million) in the third quarter of 2017,...

Taiwan market: Sony Mobile launches mid-tier Xperia XA1 Plus

Oct 3, 11:00

Sony Mobile Communications has launched its new mid-tier model, Xperia XA1 Plus, in the Taiwan market, priced at NT$11,900 (US$392) unlocked.

Sony Mobile launches Xperia XA1 Plus
1453 items [1/42]
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  • Samsung+eUFS+solution+for+auto+apps

    Samsung eUFS solution for auto apps

    Samsung Electronics has introduced the industry's first embedded Universal Flash Storage (eUFS) solution for use in next-generation automotive applications. Consisting of 128GB and...

    Photo: Company, Oct 13.

  • Rose+Pink+Edition+of+Samsung+Galaxy+S8%2B

    Rose Pink Edition of Samsung Galaxy S8+

    Samsung Electronics has released its sixth color edition of the Galaxy S8+ 64GB model: Rose Pink. Starting June 30, the Rose Pink version of the smartphone will be available in select...

    Photo: Company, Jul 4.

  • Asustek+ZenFone+AR+smartphone

    Asustek ZenFone AR smartphone

    Asustek Computer has announced ZenFone AR, a smartphone that represents an advance in mobile virtual reality (VR) and augmented reality (AR) technologies. The vendor said it is the...

    Photo: Company, Jan 23.

  • Samsung+14nm+chips+for+wearables

    Samsung 14nm chips for wearables

    Samsung Electronics has announced mass production of the Exynos 7 Dual 727 mobile application processor (AP) designed specifically for wearable devices with 14nm FinFET process technology...

    Photo: Company, Oct 18.

  • Samsung+14nm+Exynos+chips

    Samsung 14nm Exynos chips

    Samsung Electronics has begun mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14nm process technology for the budget smartphone...

    Photo: Company, Aug 31.

Global notebook shipment forecast, 2017 and beyond
China AMOLED panel capacity expansion forecast, 2016-2020

18-Dec-2017 markets closed

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OTC electronic220.91+0.49+0.22% 

Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.