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News tagged packaging and testing
  • Last update: Wednesday 10 December 2014 [696 news items]

SPIL posts record revenues for October

Nov 6, 12:09

Siliconware Precision Industries (SPIL) saw its October consolidated revenues climb to an all-time high of NT$6.55 billion (US$222.7 million) for October 2013, representing growth...

PTI 3Q13 results miss expectations, cautious about 4Q

Nov 1, 13:51

Packaging and testing house Powertech Technology (PTI) has announced net profits of NT$604 million (US$20.59 million) on consolidated revenues of NT$9.35 billion for the third quarter...

SPIL posts strong earnings in 3Q13

Oct 31, 21:57

Siliconware Precision Industries (SPIL) has reported net profits of NT$2.18 billion (US$74.21 million) for the third quarter of 2013, up 25.5% on quarter and 41.1% on year. Third-quarter...

ASE looks to 6-8% sequential revenue growth in 4Q13

Oct 30, 22:13

IC backend service company Advanced Semiconductor Engineering (ASE) expects its revenues to grow 6-8% sequentially in the fourth quarter of 2013, but will also see its gross margin...

ASE reportedly to buy Panasonic IC backend plants

Newswatch - Oct 28, 21:24

Taiwan-based Advanced Semiconductor Engineering's (ASE) is likely to take over Panasonic's IC backend sites overseas, according to a recent Chinese-language Commercial Times...

PTI, Walton post mixed 3Q13 results

Oct 15, 15:56

Memory IC backend service specialist Powertech Technology (PTI) saw its third-quarter revenues register an about 1% sequential decrease, while fellow firm Walton Advanced Engineering...

ASE September sales rise, SPIL flat

Oct 9, 16:04

Advanced Semiconductor Engineering (ASE) saw September sales of its core IC ATM (assembly test and material) business grow 4.1% on month, while fellow firm Siliconware Precision Industries...

Chipbond board approves plan for NT$4 billion loan

Stockwatch - Sep 24, 15:39

The board of directors of Chipbond Technology, a Taiwan-based backend house specializing in LCD driver ICs, has approved a plan to apply for a syndicated loan of NT$4 billion (US$135.4...

Global 2013 semiconductor manufacturing equipment spending to fall 8.5%, says Gartner

Sep 23, 14:38

Worldwide semiconductor manufacturing equipment spending is projected to total US$34.6 billion in 2013, down 8.5% from 2012 spending of US$37.8 billion, according to Gartner.

SPIL 3Q13 revenues to stay flat or drop slightly in September

Sep 17, 22:13

Siliconware Precision Industries (SPIL) is expected to see its sales for September stay flat or drop slightly from August before bouncing up in the first half of October buoyed by...

WAE expects revenue proportion for specialty DRAM to rise to 80% by end of 2013

Sep 17, 11:38

Taiwan-based memory packaging and testing service provider Walton Advanced Engineering (WAE) saw specialty DRAM packaging/testing services account for 74% of its second-quarter 2013...

ASE August sales up 7%

Sep 10, 11:21

IC packager Advanced Semiconductor Engineering (ASE) has announced August consolidated revenues of NT$18.83 billion (US$635.2 million), increasing 7.4% sequentially and hitting the...

SPIL posts record August sales

Sep 9, 14:30

Consolidated revenues at IC packager Siliconware Precision Industries (SPIL) grew 6.2% on month and 15.3% on year to an all time high of NT$6.51 billion (US$219.1 million) in August...

ASE expands into MEMS market

Sep 6, 10:29

Packaging and testing firm Advanced Semiconductor Engineering (ASE) has expanded into the MEMS field, providing backend services for MEMS pressure sensors and microphones, according...

ASE claims to have 15% market share in SiP sector

Sep 4, 15:59

Out of every 6-7 system-in-package (SiP) devices, one is produced by Advanced Semiconductor Engineering (ASE), according to Ho-Ming Tong, company chief R&D officer. With its complete...

Chip carrier packaging grows on widespread adoption of QFN package, says IC Insights

Sep 4, 12:32

Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. While much attention with regard to IC packaging is on 3D stacking...

ChipMOS and Thailin land backend orders for fingerprint sensors, says report

Newswatch - Sep 3, 12:16

Packaging and testing company ChipMOS Technologies and its subsidiary Thailin Semiconductor, which provides testing services for memory ICs, logic ICs and mixed-signal ICs, have teamed...

ASE to land growing backend orders for Apple devices, says report

Newswatch - Aug 29, 15:56

IC packaging and testing house Advanced Semiconductor Engineering (ASE) is expected to secure backend orders for fingerprint sensors, application processors and Wi-Fi modules for...

PTI lands backend orders from MediaTek, say reports

Newswatch - Aug 23, 15:56

IC backend service company Powertech Technology (PTI) has grabbed orders for handset chips from MediaTek, with shipments scheduled to kick off in the fourth quarter of 2013, a Chinese-language...

ASE, SPIL August sales to rise

Aug 22, 20:45

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to report 3-5% sequential increases in August revenues, thanks to brisk...

IC backend services firms to see revenues peak in 3Q13

Aug 21, 09:54

IC backend services companies, including King Yuan Electronics (KYEC), Sigurd Microelectronics, STATS ChipPAC Taiwan Semiconductor and Ardentec, are expected to see their revenues...

Taiwan 3Q13 IC backend production value to register slight growth, says IEK

Aug 16, 16:13

The production value of Taiwan's IC packaging and testing industry sectors will register sequential growth of 4.6% and 4.3%, respectively, in the third quarter of 2013, according...

Chipbond sales to grow up to 5% sequentially in 3Q13

Aug 14, 21:46

LCD driver IC backend service company Chipbond Technology is expected to see its revenues grow moderately within a range of 5% sequentially in the third quarter of 2013 as demand...

Walton looks to non-PC DRAM for 2H13 growth

Aug 9, 10:45

Packaging and testing firm Walton Advanced Engineering expects rising demand for mobile DRAM and other niche-market memory chips to drive company growth in the second half of 2013.

Walton president Yu Hong-chi

ASE, SPIL July sales up

Aug 8, 16:12

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported increases in July consolidated revenues from the previous month of...

Sigurd pre-tax profits soar in 2Q13

Aug 2, 10:04

Taiwan-based testing company Sigurd Microelectronics has announced second-quarter 2013 revenues increased 13.2% sequentially to NT$1.37 billion (US$45.3 million) with pre-tax profits...

SPIL optimistic about communications IC market in 2H13

Aug 1, 15:54

Siliconware Precision Industries (SPIL) chairman Bough Lin has expressed optimism that demand for communications ICs will be strong in the second half of 2013 on the back of brisk...

SPIL chairman Bough Lin

Chipbond 3Q13 revenues may fall short of expectations

Jul 19, 15:45

A recent slowdown in demand for small- to medium-size LCD driver ICs, as well as slow adoption of Ultra HD TV sets, might have a negative impact on the sales performance of packaging...

ASE to raise additional capital through issuing new shares, bonds

Jul 16, 13:45

Taiwan-based Advanced Semiconductor Engineering (ASE) has announced plans to issue new shares and unsecured corporate bonds overseas. Proceeds from the share and bond issues will...

STATS ChipPAC Taiwan 2Q13 sales up over 15%

Jul 12, 12:03

Wafer probing service provider STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, saw its second-quarter sales increase more than 15% sequentially...

PTI 2Q13 sales rise 2.6%

Jul 11, 16:00

Powertech Technology (PTI), which provides packaging and testing services for mainly memory ICs, saw its second-quarter sales increase 2.6% sequentially.

High-end packaging next battlefield for IC assembly and test services providers, says Amkor executive

Jul 9, 15:53

Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...

Kevin Yu, Amkor sales director for Greater China

ASE IC backend biz posts record revenues in 2Q13

Jul 8, 22:04

Sales of Advanced Semiconductor Engineering's (ASE) core ATM (assembly test and material) business reported net sales of NT$36.3 billion (US$1.22 billion) for the second quarter of...

Smartphones to buoy SPIL, KYEC revenues in 3Q13

Jul 8, 16:13

IC demand for mobile devices particularly smartphones is expected to drive revenue growth at packaging and testing houses Siliconware Precision Industries (SPIL) and King Yuan Electronics...

SPIL chairman Bough Lin indicated previously that upcoming flagship phones and games consoles would

ASE, SPIL 3Q13 sales to be affected by slower sales of Galaxy S4

Jul 3, 21:59

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to see their sales for the third quarter of 2013 affected by reduced orders from...

696 items [3/20]
Wireless broadband developments in Southeast Asia markets
Analysis of China revised domestic semiconductor industry goals

19-Dec-2014 markets closed

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