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News tagged SEAJ
  • Last update: Tuesday 10 September 2013 [43 news items]

Global 2Q13 semiconductor equipment billings and bookings drop on year

Sep 10, 12:36

Worldwide semiconductor manufacturing equipment billings and bookings showed on-year decreases of 27% and 5%, respectively, in the second quarter of 2013, according to data collected...

US fab-tool book-to-bill stays above parity, says SEMI

May 23, 21:44

The book-to-bill ratio for the North America semiconductor equipment industry stayed above parity for the fourth consecutive month in April 2013, according to industry association...

SEMI, SEAJ book-to-bill ratios almost flat in February 2013

Mar 22, 15:13

Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.17 in February 2013, compared to 1.18 in January, according to the Semiconductor Equipment...

Japan chip gear ratio rises above parity in December 2012, says SEAJ

Jan 24, 11:13

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.23 on a three-month average basis in December 2012, up from 0.89 the month before, according...

SEMI, SEAJ book-to-bill ratios rise

Dec 20, 11:04

North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.79 in November 2012, up from 0.75 in October, ending seven straight months of sequential...

Japan October 2012 chip gear book-to-bill ratio at 0.70, says SEAJ

Nov 19, 22:39

Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 0.70 in October 2012, up from 0.65 in September, according to data gathered by Semiconductor Equipment...

SEMI, SEAJ book-to-bill ratios continue slide

Oct 19, 16:41

Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 0.65 in September 2012, hitting the lowest level since May 2009, according to the Semiconductor...

Japan February 2012 chip-gear orders down 5.7%, says SEAJ

Mar 20, 14:28

Japan-based manufacturers of semiconductor equipment posted JPY99.8 billion (US$1.2 billion) in orders in February 2012 (three-month average basis), down 5.7% from a year earlier,...

Japan chip gear book-to-bill ratio at 1.06 in January 2012, says SEAJ

Feb 20, 11:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.06 in January 2012, down from 1.20 in December but up from 0.99 a year earlier, according to...

Japan fab tool book-to-bill climbs above parity

Jan 31, 15:10

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.20 in December 2011, above parity for the first time in 10 months, according to figures from...

Japan fab tool book-to-bill nears 1.0, says SEAJ

Dec 20, 14:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for November 2011, up from 0.83 in October, according to new figures from the Semiconductor...

Japan chip gear book-to-bill ratio rises in October, says SEAJ

Nov 21, 16:22

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.83 for October 2011, up from 0.75 in September, according to new figures from the Semiconductor...

Japan fab-tool book-to-bill slips to 0.75 in September, says SEAJ

Oct 20, 11:59

Japan-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September, declining for the third month in a row.

Japan fab-tool book-to-bill continues slide in August, says SEAJ

Sep 21, 15:48

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.76 in August 2011, compared to 0.84 in July and 0.96 in June, according to new figures from the...

Chip equipment book-to-bill lower in July 2011

Aug 19, 10:30

North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.86 in July, down from 0.94 in June, according to SEMI. Meanwhile, data gathered by the...

Japan May chip-gear orders up 4% on-month, says SEAJ

Jun 24, 13:49

Japan-based manufacturers of semiconductor equipment posted JPY119.15 billion (US$1.48 billion) in orders in May 2011 (three-month average basis), up 4.4% from the revised level of...

Japan fab-tool book-to-bill back above parity in February 2011, says SEAJ

Mar 24, 01:00

Japan-based manufacturers of semiconductor equipment posted JPY105.79 billion (US$1.31 billion) in orders in February 2011 (three-month average basis) and a book-to-bill ratio of...

Chip equipment sales reach record growth in 2010, says SEMI

Mar 11, 14:21

Worldwide sales of semiconductor manufacturing equipment totaled US$39.54 billion in 2010, representing a record year-over-year increase of 148%, according to SEMI.

Japan fab tool book-to-bill slips below parity in January 2011

Feb 18, 15:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.99 in January 2011, down from 1.07 in December and the lowest since May 2009, according to the...

SEMI, SEAJ book-to-bill ratios slip in December 2010

Jan 21, 14:06

North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.90 in December, down from 0.97 in November, according to SEMI. Meanwhile, data gathered...

Chip gear billings and bookings rise in 3Q10, says SEMI

Dec 15, 16:21

Chip manufacturing equipment billings and bookings worldwide enjoyed both sequential and on-year growth in the third quarter of 2010, according to SEMI.

Japan chip gear book-to-bill continues to slide on-month

Nov 22, 13:41

The book-to-bill ratio for Japan-based semiconductor equipment manufacturers slipped to 1.12 in October 2010 from 1.14 in the prior month, according to the Semiconductor Equipment...

Japan September 2010 fab tool book-to-bill slips to 1.14, says SEAJ

Oct 21, 14:35

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.14 in September 2010, down from 1.38 in August, according to new figures from the Semiconductor...

Japan August chip-gear orders up slightly on-month, says SEAJ

Sep 21, 14:12

Japan-based manufacturers of semiconductor equipment posted 127.47 billion yen (US$1.49 billion) in orders in August 2010 (three-month average basis), up 1.7% from the revised level...

Chip equipment billings climb 22% in 2Q10, says SEMI

Sep 9, 17:05

Worldwide semiconductor manufacturing equipment billings reached US$9.11 billion in the second quarter of 2010, according to SEMI. The billings figure is 22% higher than that in the...

Japan chip gear book-to-bill climbs to 1.53 in July 2010, says SEAJ

Aug 19, 11:51

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.53 in July 2010, compared to 1.40 in the prior month, according to the Semiconductor Equipment...

Chip gear book-to-bill ratios climb in June 2010

Jul 21, 11:52

Japan's semiconductor production equipment manufacturers have reported a book-to-bill ratio of 1.40 for June, up from 1.13 in May, according to the Semiconductor Equipment Association...

SEMI, SEAJ book-to-bill ratios stay strong in May 2010

Jun 21, 10:37

Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.13 in May 2010, up from 1.07 in April, according to the Semiconductor Equipment Association...

Japan chip gear book-to-bill slips to 1.07 in April 2010, says SEAJ

May 24, 16:39

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.07 in April 2010, compared to 1.17 in the prior month, according to the Semiconductor Equipment...

Japan chip gear book-to-bill ratio at 1.17 in March 2010, says SEAJ

Apr 20, 11:12

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.17 in March 2010, down from 1.34 in February but up significantly from the record level of 0.30...

Chip-gear book-to-bill almost flat in February 2010

Mar 21, 15:34

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.22 in February 2010 compared to 1.23 in January, according to SEMI.

Global semiconductor equipment sales down 46% in 2009, says SEMI

Mar 11, 17:06

Worldwide sales of semiconductor manufacturing equipment totaled US$15.92 billion in 2009, representing a 46% decline compared to US$29.52 billion posted in 2008, according to SEMI...

Japan chip equipment book-to-bill reaches 1.30 in December 2009, says SEAJ

Jan 21, 17:07

Japan-based semiconductor equipment manufacturers posted about 77.39 billion yen (US$844 million) in orders in December 2009 and a book-to-bill ratio of 1.30, according to Semiconductor...

Japan chip-gear sales to grow 38% in FY 2010, says SEAJ

Jan 13, 14:18

Sales of Japan-made semiconductor and flat-panel display (FPD) equipment are forecast to reach 1.12 trillion yen (US$12.3 billion) in fiscal year 2010, up 37.7% from 813 billion yen...

Japan chip gear book-to-bill slips to 1.18 in November 2009

Dec 18, 14:09

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.18 in November 2009 compared to the prior month's level of 1.28, according to Semiconductor Equipment...

43 items [1/2]
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