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News tagged SiP
  • Last update: Tuesday 2 September 2014 [33 news items]

Semicon Taiwan 2014: Focus on new processing, packaging technologies

Sep 2, 22:13

Semicon Taiwan 2014 will kick off in Taipei from September 3-5, with this year's theme focusing on advanced wafer processes, next-generation memory technologies, 3D ICs and SiP packaging...

USI reportedly lands SiP module orders for iWatch devices

Jul 23, 13:49

Universal Scientific Industrial (USI), an affiliated company of Advanced Semiconductor Engineering (ASE), reportedly has landed SiP module orders from Apple for its iWatch wearable...

Chip packager ASE expects 1Q14 shipments to drop 12-15%

Feb 10, 14:03

Advanced Semiconductor Engineering (ASE), the world's largest chip packaging and testing company, expects its first-quarter shipments to decrease 12-15% sequentially due to seasonal...

ASE CFO Joseph Tung

SiP market has room to expand, says ASE

Nov 15, 14:03

SiP (system-in-package) currently accounts for 5-10% of the overall production value of the IC packaging sector, according to Tien Wu, COO for Advanced Semiconductor Engineering (ASE)...

ASE posts record consolidated revenues for October 2013

Nov 8, 16:03

Consolidated revenues at Advanced Semiconductor Engineering (ASE) climbed to an all-time high of NT$20.76 billion (US$707 million) in October 2013, representing growth of 17.7% on...

ChipSiP unveils SiP Smart Glass solution

Oct 14, 21:07

ChipSiP Technology, which provides turnkey system-in-package (SiP) solutions, has launched what the company claims is the world's first HD resolution near-eye display on the Android...

ASE IC backend unit to post sales drop in 4Q13

Oct 3, 10:40

Sales of Advanced Semiconductor Engineering's (ASE) core IC ATM (assembly test and material) business is likely to post a sequential decrease in the fourth quarter of 2013, due to...

ASE claims to have 15% market share in SiP sector

Sep 4, 15:59

Out of every 6-7 system-in-package (SiP) devices, one is produced by Advanced Semiconductor Engineering (ASE), according to Ho-Ming Tong, company chief R&D officer. With its complete...

ASE to land growing backend orders for Apple devices, says report

Newswatch - Aug 29, 15:56

IC packaging and testing house Advanced Semiconductor Engineering (ASE) is expected to secure backend orders for fingerprint sensors, application processors and Wi-Fi modules for...

AzureWave expects growing demand for WLAN SiP modules

Jan 4, 14:54

AzureWave Technologies, a Taiwan-based provider of wireless networking and image processing solutions, expects demand for WLAN SiP (system in package) modules to increase in 2013,...

MediaTek takes 10% stake in SiP module maker AcSiP, says paper

Newswatch - Oct 16, 15:44

MediaTek has taken up a 10.2% stake in wireless SiP module maker AcSiP Technology through a private placement, according to a Chinese-language Economic Daily News (EDN)...

AcSiP Technology to start production of wireless SiP modules used in tablet PCs

Jul 17, 15:13

AcSiP Technology, a Taiwan-based maker of wireless SiP (system in package) modules used in smartphones, has developed modules for tablet PCs and other terminal devices and will begin...

Use of COB for WLAN-enabled smartphones rebounding, says AzureWave

Jun 6, 15:08

COB (chip on board) used to be the mainstream solution for WLAN chips in smartphones, but has been replaced by SiP (system in package) for two years. However, the adoption of COB...

AzureWave sees growing shipments of Wi-Fi SiP modules due to Xiaomi smartphones

Apr 12, 12:05

AzureWave Technologies, a Taiwan-based provider of wireless networking and image processing solutions, has seen increasing shipments of Wi-Fi SiP (system in package) modules built...

AcSiP Technology aims to ship 40 million WLAN SiP modules in 2012

Jan 5, 01:10

Taiwan-based wireless SiP (system in package) solution provider AcSiP Technology, viewing that fast increasing shipments of entry- to mid-level smartphones in China will bring about...

SPIL turning focus to SiP packaging, IDM orders

Jun 23, 01:30

Siliconware Precision Industries (SPIL) is stepping up the development of system-in-package (SiP) specifically for use in handsets, and has been more actively expanding its IDM client...

AzureWave debuts on TSE

May 4, 14:10

Taiwan-based wireless module maker AzureWave Technologies on May 3 debuted its shares on the Taiwan Stock Exchange (TSE), opening at NT$35 (US$1.22) and closing at NT$35.70.

AcSiP expects huge growth in 2011 shipments of SiP modules

Apr 19, 11:20

AcSiP Technology, which makes wireless communication SiP (system in package) modules for use in handsets and e-book readers, expects to ship 10-15 million units in 2011, up from 2.6...

ChipSiP partners with Zoran for PoP packaging

Jun 15, 11:58

Taiwan-based SiP solution provider ChipSiP Technology and Zoran have announced that they have collaborated to produce a new slim package solution for the compact digital camera market...

ChipSiP Technology to begin volume production of RF SiP products in 3Q10

Jun 4, 14:06

ChipSiP Technology, a Taiwan-based SiP (system-in-package) solution provider, has come out with a series of RF SiP (antennas on chip) solutions for increasing applications in smartphones,...

Wi-Fi SiP solutions from ChipSiP

PTI sees MCP, SiP contributions grow in 1Q10 revenues

May 7, 10:29

Memory backend supplier Powertech Technology (PTI) managed to push the revenue ratios of its non-memory MCP (multi-chip package) and SiP (system-in-package) services to 11% and 9%,...

AcSiP Technology to ramp Wi-Fi SiP module output in 1Q10

Jan 28, 14:04

AcSiP Technology, a SiP module subsidiary of NAND flash device backend service company Aptos Technology, is expected to ramp up its output of Wi-Fi SiP modules for handsets to 300,000...

PTI targets top-4 spot in global IC backend market

Jan 27, 14:00

Powertech Technology (PTI) aims to become the number-four IC packaging and testing house worldwide in three years, chairman DK Tsai said at the company's annual banquet on January...

PTI chairman DK Tsai

ASE to buy up shares in USI, targeting SiP applications

Nov 18, 11:12

Advanced Semiconductor Engineering (ASE) is seeking to acquire all of the outstanding shares of Universal Scientific Industrial (USI) for NT$21 (US$0.65) per share, with the total...

SiP module from ASE

3D IC packaging to be mature within 3 years, says ASE chief officer

Oct 2, 17:10

Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset...

SoC and SiP

PTI purchase of Spansion backend facility in China to target non-memory products, say sources

Aug 25, 16:39

Powertech Technology (PTI) aims to turn the China plant it is buying from Spansion into its major production base for non-memory packaging and testing, covering logic ICs, SiP (system...

Global Unichip SiP solution validated by TSMC

Jul 28, 15:25

Global Unichip has announced that its SiP design solution has passed the validation process of Taiwan Semiconductor Manufacturing Company (TSMC).

Global Unichip president Lai

Giga Solution and Global Unichip launch RF SiP test solution for mobile TV tuner mass production

Mar 24, 17:11

Giga Solution, a test service corporation focusing on RFIC/SiP/SoC test area, and Global Unichip, a fabless ASIC and SoC design service provider, have announced the jointly developed...

SiP getting popular in Wi-Fi chip packaging, says paper

Newswatch - Jan 12, 16:32

Atheros Communications, Ralink Technology, Broadcom and Marvell are forging closer relationships with Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries...

TSMC reportedly invests in Accton subsidiary, eyeing SiP-module market

Nov 18, 15:27

Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly invested in Taiwan-based Aiconn, a subsidiary of network-equipment maker Accton Technology, via the foundry's venture...

ACX shipments of handset-use LTCC wireless SiP modules gaining momentum

Oct 15, 12:32

Advanced Ceramic X (ACX), a Taiwan-based manufacturer of multilayer ceramic devices and LTCC (low-temperature co-fired ceramic) modules, has said that its shipments of LTCC wireless...

Shrink of IC designs blurring sector segmentation

Jun 19, 16:19

As the complexity of ICs grow along with a design geometry shrink, upstream and downstream industry players are extending their presences beyond their core businesses. Executives...

Memory market shows signs of a rebound

Jun 6, 01:10

Demand in the memory market is showing signs of a rebound, with IC substrate supplier Kinsus Interconnect Technology and PCB maker Tripod Technology saying June-orders from the flash...

  • Samsung+Secu%2DNFC+chip+

    Samsung Secu-NFC chip

    Samsung Electronics has announced its new system-in-package (SIP) near field communications (NFC) chip, the SENHRN1. The new Secu-NFC chip combines a NFC controller and a secure element...

    Photo: Company, Nov 17.

  • Epicom+WCDMA%2FHSDPA+3G+PAs

    Epicom WCDMA/HSDPA 3G PAs

    Taiwan-based Epic Communications (Epicom) has announced a series of WCDMA/HSDPA power amplifiers (PA) for 3G portable devices and mobile phones. Provided in 3x3mm packages, the new...

    Photo: Company, Jan 26.

  • Sequans+SQN1280+all%2Din%2Done+WiMAX+SiP

    Sequans SQN1280 all-in-one WiMAX SiP

    Sequans has unveiled its latest Mobile WiMAX solution, the SQN1280, an all-in-one WiMAX system-in-package (SiP) for makers of handsets, tablets, USB sticks, portable hotspots, M2M...

    Photo: Company, Oct 25.

  • Samsung+and+Radvision+develop+HD+video+conference+multimedia+LCD+monitor

    Samsung and Radvision develop HD video conference multimedia LCD monitor

    Radvision and Samsung Electronics America have unveiled the VC240, a 24-inch monitor which integrates all the components required for HD desktop video conferencing. The VC240 is...

    Photo: Company, Jun 25.

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