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News tagged SiP
  • Last update: Tuesday 24 October 2017 [80 news items]

PTI expects another quarter of record revenues in 4Q17

Oct 24, 13:51

Robust demand for flash memory chips will buoy further sales performance at Powertech Technology (PTI) in the fourth quarter of 2017, said the memory backend specialist at an October...

Smartphones and other mobile devices continue to boost memory chip demand

Upstream suppliers to enjoy rising revenues from AirPods and Apple Watches in 4Q17

Oct 2, 15:05

Quanta Computer, Inventec as well as the ASE group's Universal Scientific Industrial (USI) and the Foxconn group's Shunsin Technology and Luxshare-ICT, are expected to see strong...

ShunSin obtains orders for fingerprint sensor modules from China

Oct 2, 10:21

ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, has obtained new orders...

AMD Vega graphics cards in shortages

Aug 25, 11:10

AMD's new Radeon RX Vega series graphics cards, which have become available since August 15, are currently seeing tight supply in the retail channel reportedly due to an insufficient...

AMD Vega GPUs in shortages

SPIL to invest US$25 million in China

Aug 15, 10:27

Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...

PTI optimistic about 3Q17

Jul 25, 21:46

Memory backend specialist Powertech Technology (PTI) expects its sales to peak in the third quarter, and remains optimistic about the outlook for the fourth quarter.

MediaTek IoT chips expand presence in China bicycle-sharing market

Jul 12, 13:30

Specializing in smartphone SoC chips, MediaTek has been aggressively developing its highly-integrated SoC offerings for wearable and IoT applications. With its IoT solutions, MediaTek...

MediaTek IoT chips are making inroads in China bicycle-sharing market

Tongfu Microelectronics to set up advanced IC backend plant in Xiamen, says report

Jun 27, 21:05

China-based Tongfu Microelectronics has struck a deal with the Xiamen Haicang District government to set up a manufacturing base for advanced packaging and testing services locally...

SMIC mass producing 28nm HKMG chips

Jun 26, 20:45

Semiconductor Manufacturing International's (SMIC) 28nm HKMG process has entered its mass production stage, according to company CEO Haijun Zhao. SMIC will move forward making chips...

smic

ShunSin posts EPS of NT$9.12 for 2016

Mar 9, 22:28

ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, has announced net profits...

SiP module supplier ShunSin to roll out more fingerprint sensor, telematics modules in 2017

Newswatch - Feb 16, 14:17

ShunSin Technology, a subsidiary of Foxconn Electronics specializing in assembly and test of system-in-package (SiP) modules, plans to focus more on fingerprint sensor and telematics...

ASE obtains ISO 26262 for its Kaohsiung site

Dec 27, 21:48

Advanced Semiconductor Engineering (ASE) has obtained the ISO 26262 certification from TUV Nord for its Kaohsiung, southern Taiwan facility, according to the packaging and testing...

ShunSin nets NT$6.72 per share for 1Q-3Q16

Nov 8, 10:59

ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, has announced net profits...

ASE reports flat 3Q16 revenues

Stockwatch - Oct 11, 11:06

Advanced Semiconductor Engineering (ASE) saw its consolidated revenues dip 0.1% from a year earlier in the third quarter of 2016, while sales generated from its core IC ATM (assembly...

ASE breaks ground for new factory building in Kaohsiung

Oct 7, 10:37

Advanced Semiconductor Engineering (ASE), a provider of semiconductor assembly and test services, has announced that it has held a groundbreaking ceremony at the site of its K24 building...

Foxconn could expand SiP business with Sharp chip unit

Sep 27, 10:14

Foxconn Electronics (Hon Hai Precision Industry) is in the process of integrating Sharp into its group, including Sharp's chip unit, which is a difficult part to combine with. Nevertheless,...

ASE a major SiP backend provider for Apple, say sources

Sep 20, 00:44

Advanced Semiconductor Engineering (ASE), through its Shanghai-based subsidiary Universal Scientific Industrial (USI), has obtained SiP (system-in-package) backend orders for Wi-Fi,...

ASE optimistic about SiP, demand for mid- and high-end smartphones

Sep 7, 15:04

Chip demand for mid- and high-end smartphones is set to be higher than expected in 2016, while demand for SiP (system-in-package) remains robust, according to Advanced Semiconductor...

ASE COO Tien Wu

ShunSin posts profit growth in 2Q16

Aug 16, 19:42

ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and testing system-in-package (SiP) modules, saw its net profits surge...

ASE posts flat 2Q16 revenues

Jul 8, 10:11

Advanced Semiconductor Engineering (ASE) saw its consolidated revenues increase only 0.4% sequentially in the second quarter of 2016, while sales generated from its core IC ATM (assembly...

ASE seeing better sales in 2H16

Jun 28, 13:53

Advanced Semiconductor Engineering (ASE) expects to post sequential revenue growth through the fourth quarter of 2016, according to company COO Tien Wu. Revenues for the second half...

ASE COO Tien Wu

Computex 2016: ASE to showcase SiP, MEMS and sensor solutions for smart living applications

May 31, 11:30

Advanced Semiconductor Engineering (ASE) has announced that it will showcase system-in-package (SiP), MEMS and sensor technologies through live demonstrations of smart living and...

ASE posts decreased April revenues

May 9, 16:12

Consolidated revenues at Advanced Semiconductor Engineering (ASE), which consist of sales generated by EMS subsidiary Universal Scientific Industrial (USI), fell 14.1% sequentially...

Invensas signs BVA technology license and development agreement with ASE

May 3, 13:57

Tessera Technologies has announced that its wholly-owned subsidiary Invensas signed a new technology license and development agreement with Advanced Semiconductor Engineering (ASE)...

SiP demand stays weak in 2Q16, says ASE

May 3, 10:58

Advanced Semiconductor Engineering's core IC ATM (assembly, test and material) business has seen a pick-up in demand in the second quarter of 2016, but demand for SiP (system-in-package)...

ASE grabs major SiP module orders for second-generation Apple Watch, sources say

Apr 14, 14:03

Advanced Semiconductor Engineering (ASE), already a provider of SiP (system-in-package) modules for the first-generation Apple Watch, has reportedly grabbed the majority of SiP module...

ASE orders equipment worth NT$1.72 billion

Stockwatch - Mar 16, 11:09

Advanced Semiconductor Engineering (ASE) has announced three purchases of machinery equipment for a total of about NT$1.72 billion (US$52.6 million) from Kulicke & Soffa, Besi...

MediaTek unveils new chips for wearables, smart homes and UHD Blu-ray

Jan 5, 10:56

MediaTek has announced its new chip series for wearable and smart home applications, and Ultra HD Blu-ray players.

ShunSin revenues to see up to 20% growth in 4Q15

Dec 10, 16:09

ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, is expected to post revenue...

China firm reportedly lands SiP device orders from Apple

Nov 25, 13:56

Jiangsu Changjiang Electronics Technology (JCET), China's largest semiconductor packaging and test services provider, has reportedly grabbed assembly orders for SiP (system-in-package)...

ASE to grow revenues from Korea, says company COO

Nov 3, 11:03

Advanced Semiconductor Engineering (ASE) is looking to grow revenues generated from the market in Korea, where the Taiwan-based IC backend house has invested US$1 billion in building...

Brisk SiP shipments buoying EMS operation, says ASE

Oct 30, 11:01

The average utilization rate of Advanced Semiconductor Engineering's (ASE) IC ATM (assembly test and material) operation is expected to fall 4-6% sequentially in the fourth quarter...

ASE CFO Joseph Tung

ASE, SPIL report increased August revenues

Sep 8, 15:05

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported sequential increases of 5.8% and 5.7%, respectively,...

ASE and TDK launch joint venture

Sep 7, 11:04

Advanced Semiconductor Engineering (ASE) has announced the official inauguration of ASE Embedded Electronics Incorporated, at a formal signing ceremony in Kaohsiung with TDK and local...

SPIL looks to effective results of SiP packaging development with Foxconn

Sep 2, 11:22

Siliconware Precision Industries (SPIL) expects its strategic partnership with Foxconn Electronics for developing SiP (system-in-package) packaging technology to begin bearing fruit...

SPIL chairman Bough Lin
80 items [1/3]
  • Samsung+Secu%2DNFC+chip+

    Samsung Secu-NFC chip

    Samsung Electronics has announced its new system-in-package (SIP) near field communications (NFC) chip, the SENHRN1. The new Secu-NFC chip combines a NFC controller and a secure element...

    Photo: Company, Nov 17.

  • Epicom+WCDMA%2FHSDPA+3G+PAs

    Epicom WCDMA/HSDPA 3G PAs

    Taiwan-based Epic Communications (Epicom) has announced a series of WCDMA/HSDPA power amplifiers (PA) for 3G portable devices and mobile phones. Provided in 3x3mm packages, the new...

    Photo: Company, Jan 26.

  • Sequans+SQN1280+all%2Din%2Done+WiMAX+SiP

    Sequans SQN1280 all-in-one WiMAX SiP

    Sequans has unveiled its latest Mobile WiMAX solution, the SQN1280, an all-in-one WiMAX system-in-package (SiP) for makers of handsets, tablets, USB sticks, portable hotspots, M2M...

    Photo: Company, Oct 25.

  • Samsung+and+Radvision+develop+HD+video+conference+multimedia+LCD+monitor

    Samsung and Radvision develop HD video conference multimedia LCD monitor

    Radvision and Samsung Electronics America have unveiled the VC240, a 24-inch monitor which integrates all the components required for HD desktop video conferencing. The VC240 is...

    Photo: Company, Jun 25.

UMC
Global AP demand forecast, 2017-2020

24-Nov-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
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  • Global AP demand forecast, 2017-2020

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  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.