Taiwan-based IC substrate makers including Unimicron Technology and Kinsus Interconnect Technology have seen a ramp-up in BT substrate orders for MediaTek's 5G SoCs as the chipmaker...
5G AP price competition between Qualcomm and MediaTek is expected to heat up further in the second quarter of 2020 as both chipmakers are gearing up to win more orders from Chinese...
TSMC is set to kick off volume production of chips built using 5nm process technology in April, and has already seen the process capacity fully booked by clients, according to industry...
Qualcomm has newly unveiled the world's first 5nm 5G modem-RF system, the Snapdragon X60, to be paired with its latest, third-generation 5G mmWave antenna module, QTM 535, with Taiwan's...
Apple's demand for 5nm A14 mobile application processors (AP) to support its 5G devices is likely to be 50-60% higher than that for its 7nm A13, highlighting the vendor's determination...
Qualcomm and MediaTek are expected to each post a double-digit increase in mobile chip sales this year, with gross margin edging up single-digit percentage points thanks to the availability...
Taiwan-based Integrated Service Technology (iST), Sporton International and Materials Analysis Technology (MA-tek), all dedicated to semiconductor materials analysis, IC test and...
Taiwan-based IC test solutions providers including Chunghwa Precision Test Tech (CHPT), Keystone Microtech and WinWay Technology are poised to embrace robust orders from major chipmakers...
MediaTek is expected to embrace an ambitious strategy to grow its presence in the 5G smartphone SoC sector. It will focus its efforts on 5G chip solutions for the upper midrange smartphone...
MediaTek reportedly plans to unveil its second 5G SoC in the latter half of December, one month after it released the first model of its 5G SoC family product, the Dimensity 1000,...
Qualcomm has launched new Arm-based processors for notebooks. Among the chips, the new Snapdragon 7c series designed for entry-level devices reportedly adopts ASE Technology's system-in-package...
