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  • Last update: Tuesday 1 July 2014 [60 news items]

Samsung/Globalfoundries team reportedly lands 14nm orders from Qualcomm, Apple

Jul 1, 13:53

The Samsung Electronics and Globalfoundries team reportedly has landed orders for its 14nm FinFET process from Qualcomm and Apple, with related foundry services to begin in early...

Notebook brand vendors to start RFQ in June; ODMs may see order reshuffling

May 27, 12:02

Notebook brand vendors will start their request for quotation (RFQ) processes for notebook orders for 2015 in June and ODMs are already preparing for the event, according to sources...

Toshiba, Canon team up for 15nm NAND flash, says report

Feb 27, 14:35

Toshiba, the world's second-largest maker of NAND flash memory behind Samsung Electronics, will work with fab-tool maker Canon to develop 15nm NAND chips with volume production slated...

Movea, Nuvoton team up to deliver motion-enabled embedded controllers for Windows 8.1 and Android devices

Dec 4, 15:18

Nuvoton Technology, a specialist in embedded controllers for the PC market, has incorporated Movea's SmartMotion technology into its NPCF204U stand-alone sensor hub family and the...

Qualcomm reportedly hopes Samsung and Globalfoundries can team up, sources say

Nov 18, 16:12

Qualcomm reportedly hopes Samsung Electronics and Globalfoundries can form an alliance, as the fabless IC vendor seeks to reduce its reliance on Taiwan Semiconductor Manufacturing...

Globalfoundries, Samsung said to team up to vie for Apple chip orders

Nov 13, 12:23

Rumors have been circulated in the IC industry claiming that Globalfoundries and Samsung Electronics will team up to vie for A9-series chip orders from Apple. Under the reported tie-up,...

Dialog, Richtek team up for power management ICs

Nov 12, 11:56

Taiwan-based Richtek Technology has signed a cooperation agreement with Dialog Semiconductor for the development of power management ICs targeting the tablet and smartphone chipset...

ASE, Infineon team up for assembly of auto products

Nov 7, 15:42

Advanced Semiconductor Engineering (ASE) has announced a joint development and product agreement for assembly services of automotive products with Infineon Technologies. The collaboration...

Alchip, KnCMiner team up for Bitcoin mining machine with 28nm ASIC

Nov 5, 15:44

KnCMiner, a provider of Bitcoin mining devices, and fabless ASIC company Alchip Technologies, have announced the availability of what the companies claim is the world's first 28nm...

Imagination, MediaTek team up for heterogeneous multi-processing SoCs

Sep 4, 12:35

Imagination Technologies has recognized MediaTek for its deployment of heterogeneous processing. The new MediaTek MT8135 chip is a mobile SoC enabling heterogeneous multi-processing...

Huawei to team up with Compal to make smartphones, tablets in Brazil, says paper

Newswatch - Aug 26, 14:04

Huawei Technologies plans to team up with Taiwan-based Compal Electronics to produce smartphones and tablets in Jundiai, Brazil, according to a Chinese-language Economic Daily...

Synopsys, UMC team up for 14nm FinFET

Jun 27, 10:48

IC foundry United Microelectronics (UMC) has announced that its partnership with Synopsys, a provider of electronic design automation (EDA) software and services, resulted in the...

InnoDisk, Aptos team up for industrial embedded use SSDs

May 31, 14:55

InnoDisk, which specializes in flash storage devices for industrial applications and embedded systems, has teamed up with backend service provider Aptos Technology to develop a new...

Xilinx, TSMC team up for 16nm FinFET FPGAs

May 29, 15:44

Xilinx and TSMC have jointly announced that they are teaming up to create FPGAs built using 16nm FinFET process technology.

Imec, Globalfoundries team up for STT-MRAM

May 22, 11:22

Globalfoundries has joined Imec's industrial research collaboration to develop spin-transfer torque magnetoresistive random access memory (STT-MRAM), according to the IC foundry.

Infineon, Globalfoundries team on 40nm embedded flash process

Apr 29, 21:58

Infineon Technologies and Globalfoundries have announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology.

TSMC, Altera team on 55nm embedded flash process

Apr 16, 12:08

Programmable logic supplier Altera is working with foundry partner Taiwan Semiconductor Manufacturing Company (TSMC) on a 55nm embedded flash (EmbFlash) process technology tailored...

Sequans, Alcatel-Lucent team up for LTE broadcast

Feb 25, 11:53

Sequans Communications has successfully completed interoperability testing of Alcatel-Lucent's LTE infrastructure equipment with Sequan's eBMS-capable LTE chipsets, according to the...

Austrian research team develop a new flat, flexible, transparent, and potentially disposable polymer sheet for capturing images

Feb 22, 11:22

An Austrian research team has developed a new way of capturing images based on a flat, flexible, transparent, and potentially disposable polymer sheet. The team describesd their new...

Samsung reportedly replaces management team in Brazil market

Jan 23, 22:34

Korea-based Samsung Electronics has reportedly replaced its management team in Brazil despite the team's efforts helping Samsung to become the largest vendor in the country, defeating...

MStar Semiconductor and Flingo Samba TV platform team up to provide smart TV solution

Jan 17, 15:13

Smart TV app publisher Flingo has announced that Samba, its new interactive TV platform, will be integrated into MStar Semiconductor Smart TV solution to synchronize TV, tablet, phone...

UMC restructures executive team

Nov 20, 13:47

Foundry chipmaker United Microelectronics has announced the appointment of Po-Wen Yen to the position of CEO, effective immediately. Former CEO Shih-Wei Sun has been promoted to company...

UMC, STMicro team up to develop BSI process for image sensors

Sep 7, 15:02

United Microelectronics (UMC) has teamed up with STMicroelectronics to develop 65nm CMOS image sensor technology using backside illumination (BSI).

ALi, Panasonic team up for DVB-T2 chipset

Aug 30, 01:00

ALi, a provider of set-top box (STB) system-on-chip (SoC) solutions, has announced that the company has teamed up with Panasonic's semiconductor business group to begin mass production...

BOE eyes team up with Formosa Epitaxy, Unity Opto to set up LED epitaxial wafer plant

Aug 17, 11:27

China-based LED firms have been producing low-priced LED chips causing oversupply in the upstream LED chip segment to continue. China-based panel maker BOE recently announced plans...

Foxconn refutes rumors about entering Taiwan cable TV channel market

Aug 2, 01:05

Foxconn Electronics (Hon Hai Precision Industry), commenting on a recent rumor that the company is preparing to enter Taiwan's cable TV channel market, has said it is aiming to work...

Fujitsu, DoCoMo and NEC team up for communications IC

Aug 1, 16:14

Fujitsu has announced that the company has reached an agreement with NTT DoCoMo and NEC to form a joint venture, which will focus on the development and sales of semiconductors used...

ARM, TSMC team up to deliver ARM cores on FinFET transistors

Jul 24, 14:06

TSMC and ARM have announced a multi-year agreement extending their collaboration beyond 20nm technology to deliver ARM processors on FinFET transistors, enabling the fabless industry...

UMC signs license deal with IBM to develop 20nm chips

Jul 2, 13:55

United Microelectronics (UMC) announced recently that the company has signed a license agreement with IBM to expedite the development of its 20nm CMOS process with FinFET 3D transi...

ECS passes 2011 finance report with growth of more than 7%

Jun 26, 01:10

Elitegroup Computer Systems (ECS) hosted a shareholder meeting on June 25, passing its finance report for 2011 with consolidated revenues reaching NT$72.7 billion (US$2.43 billion),...

Taiwan market: Yahoo! Kimo expanding marketing team for keyword search advertising

Jun 15, 15:36

Yahoo! Kimo (Yahoo! Taiwan) has expanded its agent workforce for marketing its online keyword search advertising service in the Taiwan market to 38 sales partners and about 300 sales...

Singapore IME, UMC team up to develop TSV for BSI sensors

Jun 6, 01:20

Singapore's Institute of Microelectronics (IME) and United Microelectronics (UMC), the world's second largest foundry company, have announced plans to jointly develop through-silicon...

Spansion, SK Hynix team up for SLC NAND

Apr 3, 10:50

Spansion has announced an alliance with SK Hynix to introduce SLC NAND products at the 4x, 3x, and 2x nodes. As part of the relationship, the pair will enter into a patent cross-licensing...

Arakawa Chemical, Taimide team up on thin-film metallization process research

Jan 9, 14:14

Taiwan-based polyimide (PI) film supplier Taimide Technology has announced it will work with Japan's Arakawa Chemical Industries to develop a new process used for the manufacture...

Fujitsu Semiconductor, Sequans team up for LTE

Oct 21, 14:16

Sequans Communications announced on October 20 it has established a technology and marketing collaboration with Fujitsu Semiconductor for the purpose of providing customers with a...

60 items [1/2]
Realtime news
  • Google to incorporate NFC functionality into Android

    Mobile + telecom | 3h 9min ago

  • TPCA urges Taiwan government to upgrade PCB industry

    Bits + chips | 3h 21min ago

  • TSMC to offer more wafer starts to MediaTek in 3Q14

    Bits + chips | 5h 17min ago

  • TPK sees 2Q14 gross margin drop sequentially

    Before Going to Press | 3h 57min ago

  • O-film Tech to acquire Shenzhen Temobi Science & Tech

    Before Going to Press | 3h 59min ago

  • PCB maker Apex completes capital expansion

    Before Going to Press | 4h 12min ago

  • Handset solution vendors may roll out 10-core CPUs in 2015

    Before Going to Press | 4h 23min ago

  • TPK posts 1H14 net EPS of NT$1.37

    Before Going to Press | 4h 23min ago

  • China market: Mainstream pricing for smart wireless routers stands at CNY100-200

    Before Going to Press | 4h 24min ago

  • More IC vendors to engage in merger or acquisition deals

    Before Going to Press | 4h 26min ago

  • Intel to launch Core M for use in notebook/tablet 2-in-1 models in 4Q14

    Before Going to Press | 4h 26min ago

  • Notebook thermal module makers eye business opportunities from electric vehicles

    Before Going to Press | 5h 35min ago

  • Career expects sales to peak in 4Q14

    Before Going to Press | 5h 36min ago

  • Acer sees booming sales of Chromebooks, says CEO

    Before Going to Press | 5h 44min ago

  • China PV module makers expected to ask Taiwan solar cell makers to offer incentives

    Before Going to Press | 5h 57min ago

  • LG launches cloud-based monitors

    Before Going to Press | 5h 58min ago

  • AUO able to produce 42- to 75-inch WCG curved Ultra HD TV panels

    Before Going to Press | 6h ago

  • Touch Taiwan 2014 to take place in late August

    Before Going to Press | 6h 1min ago

  • Global Ultra HD TV penetration to reach at least 6-8% in 2014

    Before Going to Press | 6h 1min ago

  • Digitimes Research: Japan promoting service robots

    Before Going to Press | 6h 2min ago

  • Small- to medium-size China smartphone component makers under pressure of being forced out in 2H14

    Before Going to Press | 6h 3min ago

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  • MSI+LA+Dodgers+version+all%2Din%2Done+PC

    MSI LA Dodgers version all-in-one PC

    The LA Dodgers and Micro-Star International (MSI) have announced that MSI will be supplying the Dodgers with Wind Top all-in-one PCs and notebooks for use by team executives and office...

    Photo: Company, Mar 17.

  • Team+Rainbow%2Dseries+USB+drives

    Team Rainbow-series USB drives

    Team, a Taiwan-based supplier of memory modules, memory cards, USB drives and solid state drives (SSDs), is showcasing a variety of products at Computex Taipei 2008, including its...

    Photo: Company, Jun 3.

  • Team+Supreme%2Dseries+USB+drives

    Team Supreme-series USB drives

    Among Team's USB disk drive offerings on display at Computex 2008 is its Supreme series, which offer drives in capacities ranging from 8-64GB. With a leather-felt shell and slide...

    Photo: Company, Jun 3.

UHD TV market forecast, 2014-2017

21-Jul-2014 markets closed

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2014 global notebook demand forecast
  • 2014 global high brightness LED market, trends and shipment forecast

    For the global LED lighting market, the market size will reach US$25.82 billion in 2014 or a market penetration rate of 23.4%. This is attributable to exponential shipment growth for light bulbs, tubes, and directional lamps.

  • Greater China touch panel shipment forecast through 2015

    This Special Report provides forecasts through 2015 for Greater China touch panel shipments with breakdowns based on technology (glass, film, resistive), application (smartphone, NB and tablet) and by firm.

  • 2014 global tablet demand forecast

    This report analyzes the main players, their strategies and shipments forecasts for 2014, as well as other factors contributing to either growth or decline in various segments within the tablet market, with a particular focus on Apple, Google, Samsung, and Microsoft, along with whitebox vendors.