Taipei, Wednesday, July 1, 2015 21:02 (GMT+8)
mostly cloudy
Taipei
32°C
News tagged Team
  • Last update: Monday 22 June 2015 [74 news items]

ARM, UMC team to tape out Cortex-A based 14nm FinFET chip

Jun 22, 16:17

United Microelectronics (UMC) has announced that it is collaborating with ARM to tape out a process qualification vehicle (PQV) test chip on the foundry's 14nm FinFET technology to...

InnoDisk, Supermicro and Toshiba team up for SSD cloud storage

Jun 22, 11:32

Taiwan-based InnoDisk, which develops and manufactures industrial-class storage products, has disclosed the company is partnering with NAND flash chip vendor Toshiba and Super Micro...

China market: Qualcomm, Allwinner team up for 4G LTE tablets

Jun 3, 15:19

Qualcomm has followed in the footsteps of Intel, teaming up with China-based IC design houses to promote its entry-level and cost-effective platforms in the China market.

High-quality, long-lasting: Q&A with Gigabyte motherboard team

Jun 1, 19:41

As one of the top vendors in the desktop motherboard industry, Gigabyte Technology has grown its business to reach shipments of around 20 million motherboards per year, most of which...

Tony Liao, Senior Associate VP at Gigabyte

ASE and TDK team up for IC embedded substrates

May 15, 15:38

Advanced Semiconductor Engineering (ASE) and TDK have announced that the companies will enter into an agreement to establish a joint venture company to manufacture IC embedded substrates...

Altera, TSMC develop UBM-free WLCSP packaging

Apr 7, 21:30

Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...

Globalfoundries, IMEC to jointly develop RF solutions for IoT applications

Feb 24, 11:02

Globalfoundries has announced a partnership with IMEC for joint research on future radio architectures and designs for highly-integrated mobile devices and IoT applications.

SK Hynix, Toshiba team up for nanoimprint lithography

Feb 5, 21:01

SK Hynix and Toshiba have announced they have struck a deal to jointly develop nanoimprint lithography (NIL), a candidate for the next-generation lithography technology.

HTC sponsors eSports teams Cloud 9, Team Liquid, Team SoloMid

Jan 28, 22:21

HTC has made an entrance into the eSports arena sponsoring three teams: Cloud 9, Team Liquid and Team SoloMid (TSM).

Taiwan team announces SEMI PV57-1214 standards

Dec 24, 15:53

A Taiwan team has announced SEMI-recognized international standards of performance measurement for dye-sensitized solar cells and organic solar cells, coded SEMI PV57-1214.

Business software vendor SAP looks to team up with Taiwan cloud data centers

Dec 16, 22:09

Enterprise software and service provider SAP is looking to sign a number of strategic alliance agreements with Taiwan-based cloud data centers in 2005, driven by growing demand for...

SAP Taiwan general manager Janice Lai

Micron, Winbond team up for serial NOR flash

Nov 27, 14:25

Micron Technology has partnered with Winbond Electronics to jointly develop serial NOR flash memory for automotive and Internet of Things (IoT) applications, according to the US memory...

Soitec, SK Innovation team up for semiconductor materials

Nov 25, 16:11

France-based Soitec and SK Innovation of Korea have signed an agreement to establish an alliance focused on accelerating innovation in the area of semiconductor materials for information...

Eon reportedly to team up with China Sigma to develop NAND flash chips

Sep 1, 13:22

Taiwan-based flash chip supplier Eon Silicon Solution reportedly will team up with China Sigma to form a NAND flash joint venture in China, according to industry sources.

Samsung/Globalfoundries team reportedly lands 14nm orders from Qualcomm, Apple

Jul 1, 13:53

The Samsung Electronics and Globalfoundries team reportedly has landed orders for its 14nm FinFET process from Qualcomm and Apple, with related foundry services to begin in early...

Notebook brand vendors to start RFQ in June; ODMs may see order reshuffling

May 27, 12:02

Notebook brand vendors will start their request for quotation (RFQ) processes for notebook orders for 2015 in June and ODMs are already preparing for the event, according to sources...

Toshiba, Canon team up for 15nm NAND flash, says report

Feb 27, 14:35

Toshiba, the world's second-largest maker of NAND flash memory behind Samsung Electronics, will work with fab-tool maker Canon to develop 15nm NAND chips with volume production slated...

Movea, Nuvoton team up to deliver motion-enabled embedded controllers for Windows 8.1 and Android devices

Dec 4, 15:18

Nuvoton Technology, a specialist in embedded controllers for the PC market, has incorporated Movea's SmartMotion technology into its NPCF204U stand-alone sensor hub family and the...

Qualcomm reportedly hopes Samsung and Globalfoundries can team up, sources say

Nov 18, 16:12

Qualcomm reportedly hopes Samsung Electronics and Globalfoundries can form an alliance, as the fabless IC vendor seeks to reduce its reliance on Taiwan Semiconductor Manufacturing...

Globalfoundries, Samsung said to team up to vie for Apple chip orders

Nov 13, 12:23

Rumors have been circulated in the IC industry claiming that Globalfoundries and Samsung Electronics will team up to vie for A9-series chip orders from Apple. Under the reported tie-up,...

Dialog, Richtek team up for power management ICs

Nov 12, 11:56

Taiwan-based Richtek Technology has signed a cooperation agreement with Dialog Semiconductor for the development of power management ICs targeting the tablet and smartphone chipset...

ASE, Infineon team up for assembly of auto products

Nov 7, 15:42

Advanced Semiconductor Engineering (ASE) has announced a joint development and product agreement for assembly services of automotive products with Infineon Technologies. The collaboration...

Alchip, KnCMiner team up for Bitcoin mining machine with 28nm ASIC

Nov 5, 15:44

KnCMiner, a provider of Bitcoin mining devices, and fabless ASIC company Alchip Technologies, have announced the availability of what the companies claim is the world's first 28nm...

Imagination, MediaTek team up for heterogeneous multi-processing SoCs

Sep 4, 12:35

Imagination Technologies has recognized MediaTek for its deployment of heterogeneous processing. The new MediaTek MT8135 chip is a mobile SoC enabling heterogeneous multi-processing...

Huawei to team up with Compal to make smartphones, tablets in Brazil, says paper

Newswatch - Aug 26, 14:04

Huawei Technologies plans to team up with Taiwan-based Compal Electronics to produce smartphones and tablets in Jundiai, Brazil, according to a Chinese-language Economic Daily...

Synopsys, UMC team up for 14nm FinFET

Jun 27, 10:48

IC foundry United Microelectronics (UMC) has announced that its partnership with Synopsys, a provider of electronic design automation (EDA) software and services, resulted in the...

InnoDisk, Aptos team up for industrial embedded use SSDs

May 31, 14:55

InnoDisk, which specializes in flash storage devices for industrial applications and embedded systems, has teamed up with backend service provider Aptos Technology to develop a new...

Xilinx, TSMC team up for 16nm FinFET FPGAs

May 29, 15:44

Xilinx and TSMC have jointly announced that they are teaming up to create FPGAs built using 16nm FinFET process technology.

Imec, Globalfoundries team up for STT-MRAM

May 22, 11:22

Globalfoundries has joined Imec's industrial research collaboration to develop spin-transfer torque magnetoresistive random access memory (STT-MRAM), according to the IC foundry.

Infineon, Globalfoundries team on 40nm embedded flash process

Apr 29, 21:58

Infineon Technologies and Globalfoundries have announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology.

TSMC, Altera team on 55nm embedded flash process

Apr 16, 12:08

Programmable logic supplier Altera is working with foundry partner Taiwan Semiconductor Manufacturing Company (TSMC) on a 55nm embedded flash (EmbFlash) process technology tailored...

Sequans, Alcatel-Lucent team up for LTE broadcast

Feb 25, 11:53

Sequans Communications has successfully completed interoperability testing of Alcatel-Lucent's LTE infrastructure equipment with Sequan's eBMS-capable LTE chipsets, according to the...

Austrian research team develop a new flat, flexible, transparent, and potentially disposable polymer sheet for capturing images

Feb 22, 11:22

An Austrian research team has developed a new way of capturing images based on a flat, flexible, transparent, and potentially disposable polymer sheet. The team describesd their new...

Samsung reportedly replaces management team in Brazil market

Jan 23, 22:34

Korea-based Samsung Electronics has reportedly replaced its management team in Brazil despite the team's efforts helping Samsung to become the largest vendor in the country, defeating...

MStar Semiconductor and Flingo Samba TV platform team up to provide smart TV solution

Jan 17, 15:13

Smart TV app publisher Flingo has announced that Samba, its new interactive TV platform, will be integrated into MStar Semiconductor Smart TV solution to synchronize TV, tablet, phone...

74 items [1/3]
Realtime news
  • Acer opens BYOC experience center in Taiwan

    IT + CE | 39min ago

  • GET to outsource production of solar-grade silicon wafers to Eversol

    Green energy | 50min ago

  • Japan-based vendors see decreased digital camera shipments in May, says CIPA

    IT + CE | 55min ago

  • Digitimes Research: Taiwan makers hold advantage for wearable PMOLED orders

    Displays | 58min ago

  • MediaTek declines to comment on merger rumors

    Bits + chips - Stockwatch | 1h ago

  • Xiaomi appoints new CFO

    Before Going to Press | 37min ago

  • NCC to fine Asia Pacific Telecom for lagging behind 4G infrastructure construction

    Before Going to Press | 59min ago

  • China market: HD leads over Full HD in May smartphone sales, says firm

    Before Going to Press | 1h ago

  • Digitimes Research: Japan home entertainment market sees Sharp rise with new 4K solutions

    Before Going to Press | 1h 11min ago

  • Supply chain players gear up for new Nintendo new console

    Before Going to Press | 1h 14min ago

  • China makers lower prices for large-size solar-grade monocrystalline wafers

    Before Going to Press | 1h 15min ago

  • China market: Meizu to launch flagship smartphone MX5, says report

    Before Going to Press | 1h 21min ago

  • LCD monitor shipments drop in 2Q15, says WitsView

    Before Going to Press | 1h 22min ago

  • CSOT expects new 6G facilities to enter mass production in 1Q17

    Before Going to Press | 1h 23min ago

  • Xiaomi sells smartphones in Brazil market

    Before Going to Press | 1h 23min ago

Pause
 | 
View more
  • MSI+LA+Dodgers+version+all%2Din%2Done+PC

    MSI LA Dodgers version all-in-one PC

    The LA Dodgers and Micro-Star International (MSI) have announced that MSI will be supplying the Dodgers with Wind Top all-in-one PCs and notebooks for use by team executives and office...

    Photo: Company, Mar 17.

  • Team+Rainbow%2Dseries+USB+drives

    Team Rainbow-series USB drives

    Team, a Taiwan-based supplier of memory modules, memory cards, USB drives and solid state drives (SSDs), is showcasing a variety of products at Computex Taipei 2008, including its...

    Photo: Company, Jun 3.

  • Team+Supreme%2Dseries+USB+drives

    Team Supreme-series USB drives

    Among Team's USB disk drive offerings on display at Computex 2008 is its Supreme series, which offer drives in capacities ranging from 8-64GB. With a leather-felt shell and slide...

    Photo: Company, Jun 3.

2015 China IC design market forecast
2015 China smartphone panel trend forecast

1-Jul-2015 markets closed

 LastChange

TAIEX (TSE)9323.02+86.92+0.94% 

TSE electronic363.47+3.08+0.85% 

GTSM (OTC)136.03+0.86+0.64% 

OTC electronic181.84+1.73+0.96% 

2015 global notebook demand forecast
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.