Taipei, Friday, April 28, 2017 12:18 (GMT+8)
sunny
Taipei
26°C
News tagged Team
  • Last update: Monday 27 March 2017 [97 news items]

ALi, Alticast team up for pay TV

Mar 27, 22:35

ALi, a Taiwan-based developer of set-top box chipsets, and Korea-based Alticast, which provides software used by the global pay-TV industry, have announced they will work together...

Asustek plans to spin off AR development team, says paper

Newswatch - Mar 27, 14:10

Asustek Computer plans to spin off its AR/VR development team to become an independent startup, according to a Chinese-language Commercial Times report.

MediaTek, Pixart team up for 3D gesture controller

Newswatch - Feb 3, 16:00

MediaTek has teamed up with CMOS image sensor supplier Pixart Imaging to roll out 3D tracking and gesture controller solutions utilizing MediaTek's MT8665-series SoC chip and Pixart's...

Panasonic, UMC team up for 40nm ReRAM

Feb 2, 14:54

Panasonic Semiconductor Solutions (PSCS) announced recently it had reached an agreement with pure-play foundry United Microelectronics (UMC) on the joint development of mass production...

Seagate, SK Hynix said to team up for enterprise SSDs

Dec 13, 14:09

Seagate and SK Hynix will form a joint venture dedicated to developing SSDs for enterprise servers and data centers, according to industry sources.

Dialog Semiconductor, Energous team to accelerate wireless charging adoption

Nov 9, 11:21

Dialog Semiconductor, a provider of highly-integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth low energy (LE) technology, has announced...

Foxconn team creates startup for digital signage products

Nov 3, 11:36

Foxconn Electronics (Hon Hai Precision Industry) is planning to nurture an internal team to create a new startup to push into the digital signage market. The team recently established...

BOE reportedly sets up new R&D team for bio-sensors

Sep 20, 01:00

China-based BOE has teamed up at least 100 engineers engaged in R&D for bio-sensors, according to industry sources. A business unit has also been set up under BOE to focus on...

Himax, Nuviz team up for HUD products

Sep 13, 11:00

Taiwan-based fabless IC firm Himax Technologies has announced it is partnering with Nuviz to develop head-up display (HUD) products.

UMC, APM team up for MEMS foundry services

Sep 5, 21:01

Taiwan-based United Microelectronics (UMC) has announced it is teaming up with dedicated MEMS foundry Asia Pacific Microsystems (APM) to provide enhanced MEMS manufacturing services...

Renesas, TSMC team up for 28nm MCUs

Sep 1, 22:35

Renesas Electronics and TSMC have announced that they are collaborating on 28nm embedded flash (eFlash) process technology for manufacturing microcontrollers (MCUs) targeted at next-generation...

ARM, Intel team up for 10nm

Aug 17, 20:13

At the Intel Developer Forum on August 16, Intel announced its 10nm design platform for foundry customers will now offer access to ARM Artisan physical IP, including POP IP, based...

Micron, Silicon Motion team up for UFS solutions

Aug 17, 11:07

Micron Technology is working with its controller partner Silicon Motion Technology to develop controller solutions for Universal Flash Storage (UFS) chips, according to industry sources...

ASRock expects growing performance in 2016

Jun 8, 10:58

ASRock had an unsatisfactory performance in 2015 due to decreased motherboard shipments in China and increased expenses on server and industrial PC (IPC) investments; however, the...

Brazil market: Xiaomi recalls handset team, to not introduce new models temporarily

Jun 1, 11:13

Xiaomi Technology reportedly has recalled its handset team stationed in Brazil back to China due to difficulty promoting smartphones in the country and will not introduce new models...

University team develops cloud-based symbiotic system for fish farms and hydroponics

Apr 18, 11:24

A team consisting of several professors from the Department of Electronic Engineering at the National Taipei University of Technology has developed a symbiotic ecosystem between fish...

President-elect vows to safeguard Taiwan semiconductor industry

Mar 4, 11:26

The Taiwan government must form a "national team" in cooperation with local enterprises to meet increasing challenges amid the rising supply chain from China, president-elect...

President elect Tsai Ing-wen visiting HSP

Smartphone AP suppliers to team up with TSMC to compete with Qualcomm-Samsung in 10nm chip market

Mar 4, 10:48

Smartphone-use application processor (AP) makers in Taiwan and China are teaming up closely with Taiwan Semiconductor Manufacturing Company (TSMC) to compete with Qualcomm-Samsung...

MediaTek expands R&D team within IoT BU

Jan 4, 23:00

MediaTek has expanded the R&D team within its IoT (Internet of Things) business unit to more than 200 engineers, and the number of its IoT R&D staff will continue to grow...

Asustek assigns new head of R&D team

Nov 19, 14:45

Asustek Computer has appointed its vice president Joe Hsieh to lead its R&D unit, the Da Vinci Laboratory, to focus on developing technology for Internet of Things (IoT) and Industry...

EC anti-circumvention probe team to visit Taiwan in October

Sep 11, 15:14

The European Commission, which in late May 2015 decided to launch an anti-circumvention investigation of Taiwan- and Malaysia-based solar cell and PV module makers as well as China-based...

TPK reportedly recruits LCM team from Wintek

Aug 10, 16:04

Touch panel maker TPK Holding has reportedly recruited an LCM (LCD module) team from fellow maker Wintek in an attempt to extend product development and production to LCM assembly,...

Toshiba develops 2 new process technologies for MCUs, wireless ICs

Jul 27, 15:48

Toshiba has announced the development of a flash memory embedded process based on 65nm logic process and a single-poly non-volatile memory (NVM) process based on 130nm logic and analog...

ARM, UMC team to tape out Cortex-A based 14nm FinFET chip

Jun 22, 16:17

United Microelectronics (UMC) has announced that it is collaborating with ARM to tape out a process qualification vehicle (PQV) test chip on the foundry's 14nm FinFET technology to...

InnoDisk, Supermicro and Toshiba team up for SSD cloud storage

Jun 22, 11:32

Taiwan-based InnoDisk, which develops and manufactures industrial-class storage products, has disclosed the company is partnering with NAND flash chip vendor Toshiba and Super Micro...

China market: Qualcomm, Allwinner team up for 4G LTE tablets

Jun 3, 15:19

Qualcomm has followed in the footsteps of Intel, teaming up with China-based IC design houses to promote its entry-level and cost-effective platforms in the China market.

High-quality, long-lasting: Q&A with Gigabyte motherboard team

Jun 1, 19:41

As one of the top vendors in the desktop motherboard industry, Gigabyte Technology has grown its business to reach shipments of around 20 million motherboards per year, most of which...

Tony Liao, Senior Associate VP at Gigabyte

ASE and TDK team up for IC embedded substrates

May 15, 15:38

Advanced Semiconductor Engineering (ASE) and TDK have announced that the companies will enter into an agreement to establish a joint venture company to manufacture IC embedded substrates...

Altera, TSMC develop UBM-free WLCSP packaging

Apr 7, 21:30

Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...

Globalfoundries, IMEC to jointly develop RF solutions for IoT applications

Feb 24, 11:02

Globalfoundries has announced a partnership with IMEC for joint research on future radio architectures and designs for highly-integrated mobile devices and IoT applications.

SK Hynix, Toshiba team up for nanoimprint lithography

Feb 5, 21:01

SK Hynix and Toshiba have announced they have struck a deal to jointly develop nanoimprint lithography (NIL), a candidate for the next-generation lithography technology.

HTC sponsors eSports teams Cloud 9, Team Liquid, Team SoloMid

Jan 28, 22:21

HTC has made an entrance into the eSports arena sponsoring three teams: Cloud 9, Team Liquid and Team SoloMid (TSM).

Taiwan team announces SEMI PV57-1214 standards

Dec 24, 15:53

A Taiwan team has announced SEMI-recognized international standards of performance measurement for dye-sensitized solar cells and organic solar cells, coded SEMI PV57-1214.

Business software vendor SAP looks to team up with Taiwan cloud data centers

Dec 16, 22:09

Enterprise software and service provider SAP is looking to sign a number of strategic alliance agreements with Taiwan-based cloud data centers in 2005, driven by growing demand for...

SAP Taiwan general manager Janice Lai

Micron, Winbond team up for serial NOR flash

Nov 27, 14:25

Micron Technology has partnered with Winbond Electronics to jointly develop serial NOR flash memory for automotive and Internet of Things (IoT) applications, according to the US memory...

97 items [1/3]
Realtime news
  • Foxconn to build production center for Amazon in China

    IT + CE | 4min ago

  • Digitimes Research: Study of Japan IT industry for 1Q17

    Displays | 5min ago

  • Data is basis for smart factories

    IT + CE | 8min ago

  • Digitimes Research: LCD monitor shipments drop over 6% drop in 1Q17

    Displays | 14min ago

  • Macronix reports profit for 1Q17

    Bits + chips | 31min ago

  • UMC to roll out 22nm process as early as 2018

    Bits + chips | 32min ago

  • PTI eyeing to become largest backend house in Japan

    Bits + chips | 34min ago

  • AUO expects 2Q17 large-size panel shipments to shrink 1-5% on quarter

    Displays | 36min ago

  • Parade sees earnings up on year in 1Q17

    Bits + chips - Newswatch | 37min ago

  • Radiant expects 20% growth in 2017 shipments of BLUs used in tablets, notebooks

    Displays | 39min ago

  • Coretronic nets NT$0.64 per share for 1Q17

    IT + CE | 41min ago

  • Aurora nets NT$1.05 per share for 1Q17

    IT + CE | 42min ago

  • Ex-HTC executive launches startup to promote VR solutions

    Mobile + telecom | 45min ago

  • Largan Precision to deal out 2016 dividend of NT$63.50

    Before Going to Press | Apr 27, 21:56

  • Silitech Technology suffers net loss per share of NT$0.36 for 1Q17

    Before Going to Press | Apr 27, 21:53

  • Radiant Opto-Electronics to deal out 2016 dividend of NT$4.50

    Before Going to Press | Apr 27, 21:52

  • Lenovo to end ZUK smartphone business

    Before Going to Press | Apr 27, 21:51

  • Gamania Digital Entertainment nets NT$0.34 per share for 1Q17

    Before Going to Press | Apr 27, 21:50

  • Firich Enterprises to deal out 2016 dividend of NT$1

    Before Going to Press | Apr 27, 21:49

  • MediaTek smartphone-chip shipments likely to fall in 2017

    Before Going to Press | Apr 27, 21:48

  • GiONEE, Oppo, Vivo to launch smartphones with dual-lens cameras

    Before Going to Press | Apr 27, 21:46

  • FPCB maker Flexium 1Q17 profits fall

    Before Going to Press | Apr 27, 21:45

  • Macronix developing 3D NAND technology for SSDs

    Before Going to Press | Apr 27, 21:44

  • Gaming PC sales in North America in 2016 grow 25-30%

    Before Going to Press | Apr 27, 21:43

  • Faraday seeing growth in 28nm chip market

    Before Going to Press | Apr 27, 21:42

Pause
 | 
View more
  • MSI+LA+Dodgers+version+all%2Din%2Done+PC

    MSI LA Dodgers version all-in-one PC

    The LA Dodgers and Micro-Star International (MSI) have announced that MSI will be supplying the Dodgers with Wind Top all-in-one PCs and notebooks for use by team executives and office...

    Photo: Company, Mar 17.

  • Team+Rainbow%2Dseries+USB+drives

    Team Rainbow-series USB drives

    Team, a Taiwan-based supplier of memory modules, memory cards, USB drives and solid state drives (SSDs), is showcasing a variety of products at Computex Taipei 2008, including its...

    Photo: Company, Jun 3.

  • Team+Supreme%2Dseries+USB+drives

    Team Supreme-series USB drives

    Among Team's USB disk drive offerings on display at Computex 2008 is its Supreme series, which offer drives in capacities ranging from 8-64GB. With a leather-felt shell and slide...

    Photo: Company, Jun 3.

Global notebook shipment forecast, 2017 and beyond
Wireless broadband developments in Southeast Asia markets

27-Apr-2017 markets closed

 LastChange

TAIEX (TSE)9860.62+4.17+0.04% 

TSE electronic406.54+1.27+0.31% 

GTSM (OTC)132.68+0.41+0.31% 

OTC electronic187.23+0.37+0.2% 

Analysis of China revised domestic semiconductor industry goals
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.