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NEWS TAGGED TI
Thursday 17 March 2011
Nvidia launches new 3D Vision glasses and entry-level GPU
Nvidia recently launched a new 3D Vision bundle priced US$149, lower than US$199 of the previous 3D Vision bundle, to boost demand for 3D applications, according to the company.
Tuesday 15 March 2011
Japan earthquake damages factories, says TI
Texas Instruments (TI) has said that its manufacturing site in Miho, Japan, about 40 miles northwest of Tokyo, suffered substantial damage during the recent earthquake.
Tuesday 8 March 2011
Standalone application processors are wining in mobility markets, says Petrov Group (part 1)
Several years ago there was a widely accepted expectation that application mobile processors would be fully integrated with baseband processors on a single chip. However, today we...
Wednesday 2 March 2011
Taiwan analog IC prices affected by TI 12-inch fab going on-line
With Texas Instrument's (TI) 12-inch fab to soon commence production of analog ICs and the company lowering prices since the second half of 2010, a new analog IC price war is expected...
Wednesday 23 February 2011
USB 3.0 interface to become mainstream sooner or later: Q&A with Dan Harmon, interface product marketing manager, Texas Instruments
Texas Instruments (TI) is actively venturing into the USB 3.0 interface market for notebooks, desktops and smartphones as rival Renesas Electronics is still thriving in the segment...
Wednesday 26 January 2011
Switch to 8-inch wafers to provide sufficient capacity and inventory flexibility for analog IC design houses
With the imminent entry of Texas Instrument's (TI) 12-inch analog IC process, Taiwan-based analog IC design houses have looked to transition to 8-inch wafers since the second half...
Thursday 6 January 2011
CES 2011: TI announces DLP Pico HD chipset
At the International Consumer Electronics Show (CES), Texas Instruments (TI) has unveiled a new era for portable high definition (HD) entertainment with the new DLP Pico HD chipset...
Thursday 6 January 2011
CES 2011: DLP Pico technology lights up new, on-the-go possibilities
Texas Instruments (TI) DLP Products has announced that more than 30 DLP Pico-enabled products, covering a wide variety of useful and unique form factors, will be on display by the...
Thursday 30 December 2010
Outsourcing of IC backend services growing
IDMs including Microchip Technology, NXP Semiconductors, STMicroelectronics and Texas Instruments (TI) have all increased outsourcing for their backend production since the fourth...
Tuesday 28 December 2010
TI capacity expansion to benefit wafer probing company Ardentec
More than 50% of Ardentec's revenues now come from IDM clients, especially from major client Texas Instruments (TI). Ardentec, a wafer probing service provider, indicated that orders...
Friday 19 November 2010
Leveraging flexible pricing: Q&A with TI Taiwan GM Robin Chen
Speculation has circulated in Taiwan that Texas Instruments' (TI) 12-inch wafer foundry plant, which is about to enter volume production for analog chips, will allow the chip vendor...
Thursday 21 October 2010
Li-Ion/Poly batteries drive high growth of battery management ICs from headsets to electric vehicles, says Petrov Group
The requirement for power-efficient and high performance solutions in Li-Ion/Poly battery-powered devices and equipment continues to open profitable growth opportunities for existing...
Friday 15 October 2010
TI announces first wafer plant in China
Texas Instruments (TI) has announced the opening of its first wafer plant in China, an 8-inch manufacturing facility located in the Chengdu High-tech Zone.
Friday 15 October 2010
TI reportedly to slash analog IC prices
Texas Instruments (TI) reportedly plans to cut prices for its analog ICs again soon following a reduction launched in August – a move which is design to counter the aggressive...
Thursday 2 September 2010
TI expects shipments of DLP 3D Ready chips to reach 2-3 million units in 2011
Texas Instruments (TI) vice president of DLP business Kent Novak at a conference has commented that the company's shipments of DLP 3D Ready chips will increase to 2-3 million units...