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News tagged wafer
  • Last update: Friday 22 September 2017 [748 news items]

Globalfoundries Chengdu fab nears completion

Sep 22, 11:47

Global foundries will hold a "topping out" ceremony to celebrate a major milestone of the construction of its new 12-inch wafer plant in Chengdu, China at the end of October, according...

Globalfoundries looking to ramp new 12-inch wafer plant in Chengdu in 2018

Supply of 12-inch silicon wafers to stay tight through 2019

Sep 22, 11:11

The global supply of 12-inch silicon wafers will further tighten over the next two years, when new fabs in China are set to come online, according to industry sources.

12-inch wafer supply to remain tight through 2019

TSMC to hold over 70% of PWM IC orders from Qualcomm

Sep 21, 14:11

Taiwan Semiconductor Manufacturing Company (TSMC) is expected to grab 70-80% of the total orders for Qualcomm's new-generation power management ICs (PWM IC), according to industry...

qualcomm

Leading-edge paves way for pure-play foundry growth, says IC Insights

Sep 20, 13:55

In 2017, the 7% increase in the total pure-play foundry market is forecast to be almost entirely due to an 18% jump in sub-40nm feature size device sales, according to IC Insights.

GigaDevice signs wafer supply contract with SMIC

Sep 19, 10:36

China-based GigaDevice Semiconductor, a maker of flash memory devices and microcontroller (MCU) chips, has signed a strategic agreement on the supply of wafers worth about CNY1.2...

SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology

Sep 18, 11:08

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...

IC Insights finds continued adversarial relationship between DRAM buyers and suppliers

Sep 15, 12:27

The DRAM market has been historically the most volatile of the major IC product segments, according to IC Insights, adding that the average selling price (ASP) for DRAM has more than...

ITRI joins TSMC supply chain with new liquid nanoparticle monitor

Sep 15, 11:08

Taiwan's Industrial Technology Research Institute (ITRI) has tapped into the supply chain of Taiwan Semiconductor Manufacturing Company (TSMC) with a new generation liquid nanoparticle...

ITRI displays new liquid nanoparticle monitor at SEMICON Taiwan 2017

SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing

Sep 14, 13:44

With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...

TSMC starts equipment move-in at Nanjing plant

Sep 13, 14:21

TSMC on September 12 held a ceremony to mark the start of equipment move-in at its new 12-inch wafer plant in Nanjing, China.

TSMC chairman Morris Chang at the ceremony to mark the start of equipment move-in at the company's

Most of 2017 capital spending will go to foundry and flash memory, says IC Insights

Sep 1, 11:28

Following a substantial increase in semiconductor capital expenditures during the first half of 2017, IC Insights raised its annual semiconductor capex forecast to a record high of...

Probe card demand for memory chips, high-end APs remains strong

Aug 31, 13:58

Semiconductor probe card demand for the manufacture of memory chips and high-end application processors (APs) has been strong, whereas that for the production of LCD driver ICs and...

Probe card demand rising for memory chips and high-end mobile APs

IC material supplier Wahlee obtains dry-film photoresist orders

Aug 31, 12:24

Semiconductor material distributor Wahlee Industrial has obtained dry-film photoresist orders from Taiwan-based PCB firms for the production of substrate-like PCBs (SLP), according...

Qualcomm, Himax jointly develop 3D depth sensing solution

Aug 30, 19:04

Qualcomm and Himax Technologies have jointly announced a collaboration to accelerate the development and commercialization of a high-resolution, low-power active 3D depth sensing...

Samsung seeking long-term supply contracts with wafer firms

Aug 30, 13:34

Samsung Electronics is striving to sign long-term supply contracts with multiple wafer makers to ensure sufficient silicon wafer supplies for the manufacture of memory chips and logic...

A new Samsung fab in Pyeongtaek to focus on 64-layer 3D NAND flash production

Samsung to expand NAND chip capacity in China

Aug 29, 13:57

Samsung Electronics has disclosed plans to expand production capacity at its NAND flash memory wafer fab in Xian, northwest China for a total of US$7 billion over the next three ye...

ASML opens branch office in Nanjing

Aug 24, 11:51

ASML has announced the opening of a new branch office in Nanjing, China where its major client TSMC is constructing a new 12-inch wafer plant.

ASML opens branch office in Nanjing

Winbond announces equipment purchases

Aug 23, 15:05

Winbond Electronics, a memory chipmaker specializing in specialty DRAM and flash memory chips, has disclosed two purchases of machinery equipment from Lam Research and Tokyo Electron...

Taiwan reliance on diamond wire-sliced solar wafers to surge in 4Q17

Aug 22, 12:00

As China-based poly-Si wafer makers are fast replacing slurry slicing with diamond wire slicing to reduce production cost, Taiwan-based solar cell makers have been compelled to adopt...

solar

Global DRAM revenues increase 17% in 2Q17, says DRAMeXchange

Aug 21, 11:34

Sales in the global DRAM market surged 16.9% sequentially to US$16.51 billion in the second quarter of 2017, when PC DRAM contract prices rose over 10%, according to DRAMeXchange...

Wafer Works expects wafer prices to continue rising on strong demand

Aug 18, 14:05

Taiwan-based Wafer Works, which makes small- to medium-size semiconductor-grade wafers, expects silicon wafer prices to continue rising on strong demand.

Globalfoundries demos 2.5D HBM solution

Aug 16, 09:33

Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...

Globalfoundries intros solution leveraging 2.5D packaging with low-latency

China market: Solar wafer makers may ask for lower tariffs for polysilicon imports in 2018

Aug 15, 14:49

China-based solar wafer makers who are adding production capacities that will come into operation in 2018 are expected to increase their demand for polysilicion and ask the government...

Robust silicon wafer, photoresist demand to boost Topco revenues in 3Q17

Aug 15, 11:51

IC materials distributor Topco Scientific is expected to report brisk sales results for the third quarter of 2017 thanks to strong demand for silicon wafers and photoresists, according...

MediaTek under pressure to cut chip prices

Aug 15, 11:29

With Qualcomm lowering prices for its Snapdragon 450 chips to less than US$10.50, MediaTek is under pressure to cut prices for its upcoming Helio P23 series designed for mid-range...

MediaTek has lowered prices for its upcoming Helio P23 chips to secure orders

GCS optimistic about VCSEL demand for data centers

Aug 14, 11:09

Pure-play compound semiconductor wafer foundry Global Communication Semiconductors (GCS) has expressed optimism about gallium arsenide (GaAs) demand for vertical cavity surface-emitting...

DRAM contract prices to continue growth in 3Q17, says DRAMeXchange

Aug 11, 11:37

DRAM contract prices, which began to rise in the second half of 2016, continue their growth in the second half of 2017. Prices are set to continue rising in the third quarter, according...

Shanghai Huahong renames fabs

Aug 11, 11:35

Shanghai Huahong Group has renamed all the wafer fabs under the group. The move is to enhance the overall image of the group's IC manufacturing business, and enable its worldwide...

wafer

ChipMOS obtains backend orders from Novatek

Aug 10, 11:46

ChipMOS Technologies has obtained backend orders for touch display driver ICs (TDDI) from Novatek Microelectronics, with shipments set to kick off in the fourth quarter of 2017, according...

ChipMOS gearing up for robust demand for TDDI chips

UMC, VIS July revenues down

Aug 9, 19:51

Pure-play wafer foundries United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) have reported sequential decreases in July consolidated revenues of 2.4% and...

GlobalWafers posts record 2Q17 profit

Aug 9, 15:30

Taiwan-based GlobalWafers, a silicon wafer supplier, has reported net profits climbed to a record high of NT$1.29 billion (US$42.8 million) in the second quarter of 2017. EPS for...

Sumco to expand production capacity for 300mm silicon wafers

Aug 9, 14:09

Sumco has announced plans to expand production capacity for 300mm silicon wafers by 110,000 units per month. The additional capacity is expected to come online in the first half of...

Worldwide semiconductor capital spending to grow 10.2% in 2017, says Gartner

Aug 4, 14:22

Worldwide semiconductor capital spending is projected to increase 10.2% to US$77.7 billion in 2017, according to Gartner. This growth rate is up from Gartner's previous forecast of...

Commentary: Can Samsung Foundry unseat TSMC?

Aug 3, 21:20

Samsung Foundry has unveiled an aggressive sub-10nm roadmap that scales down to 4nm, and claimed it is looking to unseat United Microelectronics (UMC) as the world's second-largest...

TSMC is the leader in the pure-play foundry sector

Shanghai Huahong to build 12-inch fab in Wuxi

Aug 2, 21:47

Shanghai Huahong Group on August 2 struck a deal with the national China Integrated Circuit Industry Investment Fund and the city government of Wuxi to set up a new 12-inch wafer...

HHGrace likely to operate a new 12-inch fab in Wuxi
748 items [1/22]
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  • Winbond+SpiStack+memories

    Winbond SpiStack memories

    Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash memory devices. The new SpiStack W25M Series...

    Photo: Company, Mar 30.

  • Micron+16nm+flash+die

    Micron 16nm flash die

    Micron Technology has announced the sampling of its 16nm, 128Gb MLC NAND flash memory devices, designed for applications like SSDs, USB drives and flash memory cards, tablets, ultra-thin...

    Photo: Company, Jul 23.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • Canon+202x205mm+image+sensor

    Canon 202x205mm image sensor

    Canon has developed what it claims is the world's largest CMOS image sensor, with a chip size measuring 202x205mm. The newly-developed CMOS sensor is among the largest chips that...

    Photo: Company, Sep 10.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.