Taiwan's WinWay Technology, which provides high-end test sockets and other IC test interface solutions, expects its new probe card plant in Kaohsiung, southern Taiwan to come online...
Taiwan-based epiwafer suppliers and gallium arsenide (GaAs) foundries have cut into the supply chain for Qualcomm's recently-announced Wi-Fi 7 frontend module (FEM) solutions designed...
Qualcomm Technologies has announced new RFFE modules designed for Bluetooth, Wi-Fi 6E, and the next-generation standard, Wi-Fi 7. The modules are designed for a wide array of device...
Despite lingering handset sales uncertainty, mobile SoC vendors MediaTek and Qualcomm continue to roll out new high-end offerings, while Apple remains keen on developing high-performance...
Taiwan-based gallium arsenide (GaAs) foundries and epi-wafer suppliers have started delivering epi-wafer samples, which are used in power amplifiers (PA) for Wi-Fi 7 radio-frequency...
A leading chipmaker has kicked off its next-generation Wi-Fi SoC inspection and is expected to launch related module products as early as the fourth quarter of 2022, according to...
ASE Technology has landed big orders from Qualcomm and MediaTek for processing their Wi-Fi-Fi SoCs with its unique aQFN (advanced quad flat no-lead) technology, and is actively seeking...
As leading chipmakers including Qualcomm, MediaTek, Broadcom and Intel are keenly developing Wi-Fi 7 core chips and 5G mmWave mobile SoCs, Taiwan's IC inspection and certification...
Unfavorable macro factors including geopolitical tensions will be challenging MediaTek in 2022, but the company remains confident about its growth prospects under solid support from...
MediaTek will see Wi-Fi core chip business rising substantially to become its largest growth driver in 2022, helping offset weakness in handset chip demand so far this year, according...
United Microwave Technology (UMT) has received orders from three major low earth orbit (LEO) satellite customers, which is expected to bring in LEO satellite opportunities for its...
With RF integrated device manufacturers (IDMs) stepping up the development of power amplifiers (PAs) for Wi-Fi 7 FEM (front-end module) solutions, Taiwan-based gallium arsenide (GaAs)...
Qualcomm has demonstrated its latest wireless innovations at the Mobile World Congress (MWC), including what it said is the world's first 5G AI processor, as well as a new Wi-Fi 7...
Taiwan-based RichWave Technology, which specializes in Wi-Fi FEM (front-end module) solutions, has seen delivery lead times for Wi-Fi core chips from vendors shorten to 26-36 weeks...
