"...developed a new material for a new generation of non-volatile FeRAM...enables data storage capacity up to five times greater than current materials..."

"...features a three-dimensional (3-D) chip connection whose approximately 60-micron gap and 50-micron-pitch microbump between the logic and memory devices can support transmissions up to 100 gigabits per second (Gbps)..."

"...small increases in ASP...improved yields and increased shipments on 90nm node... Fab 12A and 12B have a current monthly capacity of over 85K 300mm wafers and Fab 12M will begin mass production in August..."

"...Infineon and Qimonda will pay Tessera one-time license fees of US-Dollar 10 million and US-Dollar 40 million, respectively, during the fourth quarter of the 2006 financial year..."

"...Lithography-tool shipments are projected to hit $6.4 billion in 2006, up 28.5% over 2005...overall front-end wafer-equipment market is projected to grow 25.4% in 2006..."

"...we are looking for a site that enables us to expand... In November 2005, the company broke ground on an expansion at its existing facility in Hemlock...current capacity will increase to 19,000 metric tons by 2009..."

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"...the former engineer of Toshiba estimated Toshiba gained at least 20 billion yen from the patent royalties and exclusive sales of the flash memory products...he should have been entitled to 8 billion..."

A Chinese company that recycles silicon wafers to be used in solar panels has raised $50m from an initial public offering in London.