Around the web news tagged Semiconductors

Around the web

Displaying links tagged Semiconductors [back to index]

All 7 days 14 days

29 Jun 2005

Korea calls WTO decision a 'miscarriage of justice;' Hynix downplays impact (Jun 28)

subscription required

Applied Materials buys single-wafer cleaning technology from SCP; SCP to focus on service (Jun 28)

subscription required

August Technology jilts Nanometrics, agrees to be acquired by Rudolph (Aug 28)

subscription required

SigmaTel slashes June quarter guidance on weaker than expected audio player sales (Jun 28)

subscription required

Japan could penalize Hynix after WTO decision (Jun 28)

LSI pushes RapidChip ASICs to 90 nm (Jun 28)

Japan could impose tariffs on Hynix, says report (Jun 28)

Apple adds Radeon X850 XT as Power Mac G5 option (Jun 28)

AMD charges Intel with coercion in antitrust suit (Jun 28)

Altera, InterNiche and MorethanIP announce networking reference design for Nios II processor (Jun 28)

28 Jun 2005

New powerhouse is emerging in India (June 27)

CEVA unveils CEVA-Audio DSP-based audio platform (Jun 27)

China-made chips to be embedded in TVs (Jun 27)

Toppan Photomasks to expand Ichon, Korea, facility and add leading-edge production line (Jun 27)

Nano-Tech Silicon India breaks ground for 200-mm fab (Jun 27)

subscription required

Freescale joins EU 45nm research (Jun 27)

AMD sticks with single core for gamers (Jun 27)

4G mobile phone tests hit 1Gbit/sec. (Jun 27)

WTO backs U.S. appeal on Hynix computer-chip tariffs (Jun 27)

SMIC releases 180 nm design kit for use with Agilent tools (Jun 27)

0.4-V DRAM array technology using twin cells for next generation mobile devices (Jun 27)

Metalink unveils complete chipset for 802.11n standard

Broadcom unveils world's first Bluetooth EDR chip for wireless stereo headsets

27 Jun 2005

Samsung develops extra-small image sensor chip (Jun 27)

Intel, STMicro release fuel cell specs for notebooks (Jun 27)

Samsung, analysts clash over memory market (Jun 24)

Hynix issues smaller than expected US$500 million bond in New York (Jun 25)

Winbond buys NexFlash technology (Jun 24)

DRAM maker beefs up graphics memory portfolio (Jun 24)

Book-to-bill up in slow year for fab gear (Jun 24)

Broadcom settles shareholder suit for $150 million (Jun 24)

Motorola bgins auto electronics production in new China plant (Jun 24)

26 Jun 2005

Flextronics plans expansion in India (Jun 24)

24 Jun 2005

Taiwan's Winbond takes full ownership of US NexFlash Technology (Jun 23)

Micron has 3Q loss of US$127.9 million as sales fall (Jun 23)

Polysilicon shortages to cause wafer price hikes (Jun 23)

Taiwan's TSMC says no plan to set up another China plant now (Jun 23)

Samsung CEO says DRAM prices seen stabilizing (Jun 23)

Infineon chief executive says no plans to break up company (Jun 23)

Taiwan's TSMC contracted to make 65nm wireless chips for Freescale (Jun 23)

357/506 pages

Filter by keywords

Asia IT + CE Mobile + telecom Chips + components

Members only