Chinese memory chip manufacturers pose no serious threat yet to established players, Micron Technology CEO Sanjay Mehrotra said, citing high barriers to entry for aspiring global suppliers.

According to the Korean Intellectual Property Office (KIPO), patents related to AI semiconductors, which was 32 in 2013, soared to 391 in 2017 in South Korea, a ten-fold increase over the four years.

China will continue to invest in the development of high-end chips and will monitor the sector to ensure that only products of high quality are manufactured, said the head of the country's national semiconductor fund.

Broadcom executives said the company is eyeing fresh potential targets for acquisition, just days after US President Donald Trump quashed the company's proposed $117 billion hostile takeover attempt of rival Qualcomm.

The move comes days after US President Donald Trump blocked Broadcom's $142bn hostile bid for the San Diego-based company over national security concerns.

Samsung plans to invest US$7 billion over the next three years for the expansion project.

Talluri joins Micron after nine years at Qualcomm, where he most recently served as senior vice president of product management, responsible for the company's Internet of Things business and, before that, its mobile computing platform

A unit of Apple's Taiwanese contract manufacturer Wistron has won approval from Karnataka to build a new assembly facility in the south Indian state, signaling a potential expansion of iPhone assembly work in India.

President Donald Trump has blocked Singapore-based Broadcom's proposed US$140 billion takeover of rival US chipmaker Qualcomm on grounds of national security. His order cited "credible evidence" that a takeover "threatens to impair the national security of the US".

Western Digital will invest about JPY500 billion ($4.68 billion) over the next three years in a memory chip venture with Toshiba, helping their joint operations recover after a bruising legal spat between the companies.

Samsung's new Galaxy S9 uses ST's 6-axis IMU in addition to ST's pressure sensor.

After more than four years as chief executive officer of Globalfoundries, Sanjay Jha will hand over the company's top position to Thomas Caulfield, senior vice president and general manager.

Toshiba expects the sale of its $18 billion memory chip business to be completed by June at the latest, if not by an agreed deadline of the end of March, as it awaits antitrust regulatory approval from China.

Autoparts supplier Denso will raise its stake in Renesas Electronics to 5% from 0.5% to work even more closely with the chipmaker in developing self-driving systems.

Intel is considering a range of acquisition alternatives in reaction to Broadcom's hostile pursuit for Qualcomm that could include a bid for Broadcom, according to people familiar with the matter.

Apple has reported an increase in the number of serious violations of working conditions at factories where its products are manufactured, but says that overall conditions improved.

Globalfoundries has asked Chinese regulators to probe Taiwan Semiconductor Manufacturing Co. for violating antitrust laws, said two industry sources familiar with the matter.

SAIC Motor and Infineon Technologies have announced the establishment of a joint venture to manufacture power modules for the dynamically developing electric vehicle market in China.

Qualcomm's shareholders will no longer be meeting Tuesday to weigh in on Broadcom's unsolicited takeover bid for the U.S. chipmaker.

Dialog Semiconductor expects Apple, its top customer, to use its chips for a significant proportion of its devices in 2019 and 2020, Chief Executive Jalal Bagherli told a German newspaper.

China's government aims to raise as much as CNY200 billion ($31.5 billion) to invest in homegrown chip companies and accelerate its ambition of building a world-class semiconductor industry, people familiar with the matter said.

Japanese electronics maker Kyocera will raise capital spending to more than JPY100 billion ($935 million) in the year starting April 1, much of which will go toward increasing domestic output of chip-related components used in smartphones and cars.

The tapeout project, geared toward advancing 3nm chip design, was completed using extreme ultraviolet (EUV) and 193 immersion (193i) lithography-oriented design rules and the Cadence Innovus Implementation System and Genus Synthesis Solution.

Does ever-emerging Ferroelectric Random Access Memory(FRAM) have a role in autonomous vehicles? Cypress Semiconductor thinks so.

The main trading partners of the US have reacted angrily after President Donald Trump announced plans to impose tariffs on steel and aluminium imports. Canada and the EU, both key US allies, said they would bring forward countermeasures. Mexico, China and Brazil have also said they are weighing up retaliatory steps.

Mobile World Congress (MWC) 2018 has seen dozens of 5G-related announcements, spanning devices, modems, radios, plans, spectrum, and trials.

Intel intends to expand its partnership with Beijing-backed Tsinghua Unigroup by providing NAND flash memory chips as soon as this year, according to industry sources.

Qualcomm has introduced the new Qualcomm Snapdragon 700 Mobile Platform Series, designed to exceed what is expected from today's high-tier mobile experiences, with features and performance previously only available in the premium Snapdragon 800 Mobile Platform Series. Advances to be expected in the 700 Series include on-device AI supported by the Qualcomm Artificial Intelligence (AI) Engine, and improvements to camera, device performance and power.

Qualcomm has dropped its objections to being acquired by Singapore's Broadcom and is willing to agree a deal with its rival chipmaker if it raises its takeover offer to $160bn including debt, according to people involved in the negotiations.

STMicroelectronics and Macom Technology Solutions announced an agreement that will improve Macom's access to manufacturing capacity for its gallium nitride-on-silicon technology and enable ST to manufacture its own products based on the technology for the RF energy and RF lighting markets.

Microchip maker Broadcom has cut its bid for Qualcomm by 4% to $117 billion as it objected to Qualcomm's decision to raise its own bid for NXP Semiconductors to $44 billion.

Google is working on an overhaul of its Android mobile software for a new generation of smartphones mimicking Apple's controversial new "notch" at the top of the iPhone X, according to people familiar with the situation.

Samsung Electronics will break ground for a new foundry in Hwaseong, south of Seoul, on Friday with an aim to start mass-producing below-7 nanometer chips in the second half next year and make headway in the race for customized computer chips to power smart and robotics devices.

Intel plans to invest $5 billion to expand production at its Kiryat Gat plant in southern Israel, Israeli Economy Minister Eli Cohen said on Wednesday after talks with the US chipmaker.

Intel claimed that it maintained Moore's law scaling with a 10-nm SRAM that it described here at the International Solid-State Circuits Conference (ISSCC). However, Samsung followed by describing a smaller 256-Mbit SRAM made with extreme ultraviolet lithography and expressed confidence in EUV.

Tsinghua Unigroup has signed an agreement with the government of the Chinese city of Chongqing and Sino IC Capital to set up an integrated circuit (IC) investment firm, which will invest up to $100 billion in the Chinese state chipmaker's IC sites over the next decade.

Injong Rhee, a former chief technology officer at Samsung Electronics, has joined Google as an entrepreneur-in-residence to lead Google's Internet of Things (IoT) business, Rhee said in a blog posting on LinkedIn.

Qualcomm and Broadcom plan to meet on Wednesday to talk about the latter's $121 billion acquisition offer, the first time the semiconductor companies will discuss the potential deal, people familiar with the matter said.

Qualcomm's Snapdragon X50 5G NR modem family has been selected by a number of global original equipment manufacturers (OEMs) for standard-compliant 5G NR mobile device product launches starting in 2019. Those working with Qualcomm include OEMs such as Asus, Fujitsu Limited, Fujitsu Connected Technologies Limited, HMD Global, HTC, Inseego/Novatel Wireless, LG, NetComm Wireless, NETGEAR, OPPO, Sharp, Sierra Wireless, Sony Mobile, Telit, vivo, Wingtech, WNC, Xiaomi and ZTE.