Taipei, Taiwan (December 2, 2025) – ASRock Industrial made its mark at FIDO Taipei Seminar, presenting a keynote on Secure Device integration with FIDO Device Onboard (FDO) deployment technology, demonstrating how automated, trusted, and scalable onboarding is transforming industrial edge AI. As the first industrial computer company in Taiwan to achieve FIDO Device Onboard (FDO) certification, ASRock Industrial continues to raise the bar for industrial cybersecurity. Backed by IEC 62443-4-1 and IEC 62443-4-2 certifications, the company delivers a security architecture that spans from product design and manufacturing to deployment, building an unbroken chain of trust at every layer.With its newly introduced Ai FDO solution, ASRock Industrial empowers enterprises to automate device onboarding and configuration from factory to field, reducing risk, accelerating deployment, and enhancing operational resilience. By merging secure device, verifiable trust, and zero-touch deployment, the company continues to push the boundaries of what's possible at the industrial edge, anchored by its leading industrial cybersecurity platform and in collaboration with ecosystem partners, driving transformation across smart manufacturing, smart retail, smart cities, and other critical infrastructure industries.Security Engineered into Every Layer – Secure Device + FDO DeploymentBuilt on the foundation of the FDO trust chain, ASRock Industrial strengthens security across every layer – from secure device to secure deployment, establishing a comprehensive secure edge AI platform that sets a new industrial cybersecurity standard for critical infrastructure.Secure Device: ASRock Industrial's Secure Device architecture delivers multi-layered, industrial-grade protection built on a hardware-rooted and boot-time chain of trust. Leveraging TPM, Secure Boot, and other trusted technologies, it protects data from boot to runtime through defense-in-depth. The architecture reinforces virtualization and I/O isolation, strengthens memory and code safeguards during runtime, and incorporates accelerated cryptography to secure stored data.It also provides a verifiable security baseline for automated deployment and remote management. Fully aligned with the FDO onboarding stages (TO0, TO1, TO2), it verifies device identity, keys, and configuration integrity, reducing tampering risks and establishing trusted readiness for the intelligent edge.  Secure Deployment: Taking trust beyond the device, ASRock Industrial advances security by integrating its Secure Device design with FDO deployment through the Ai FDO solution, developed in accordance with the FIDO Alliance standard. Upon first boot, devices can automatically connect to designated servers to complete authentication, registration, and deployment - shortening time-to-deploy and minimizing manual intervention and human errors. Supporting bare-metal FDO onboarding, Ai FDO combines cryptographic validation and anti-tampering mechanisms to ensure consistent and scalable secure deployment across both cloud and private environments.Certified for Global Standards, Driving FDO Adoption Across the Industrial EdgeASRock Industrial’s secure hardware platform is certified under multiple international standards, including IEC 62443-4-1 (Secure Product Development Lifecycle Requirements) and IEC 62443-4-2 (Technical Security Requirements for IACS Components). Every stage - from design and development to testing - undergoes rigorous risk assessment and security validation to ensure compliance and resilience.As the first industrial computer company in Taiwan to achieve FDO certification, ASRock Industrial strengthens its leadership in trusted and verifiable edge AI platforms. Beyond product certifications, the company continues to enhance secure applications, supply chain transparency, and incident response capabilities - establishing multiple-layer defenses across device, deployment, and operations.At the FIDO Taipei Seminar, ASRock Industrial showcased its integrated Secure Device and FDO deployment solution that accelerates secure onboarding, reduces cyber risks, and ensures deployment consistency. James Lee, Chairman of ASRock Industrial, stated: "Industrial cybersecurity is the new baseline for intelligent edge computing. With field-proven expertise in secure edge AI, ASRock Industrial unifies secure device with FDO-driven deployment, aligned with international standards. Through zero-touch onboarding and a verifiable chain of trust, every device is protected from the first connection and runs reliably at scale - enabling enterprises to deploy faster, operate safely, and expand edge AI with confidence."For more information on ASRock Industrial's secure device and FDO deployment solutions, visit our Website or contact us via Product Inquiry.

As artificial intelligence (AI) and edge computing continue to accelerate worldwide, industrial displays are undergoing a significant transformation. Once regarded merely as passive terminals for visual output, displays have now become intelligent interfaces that connect human–machine interaction, data visualization, and real-time decision-making across diverse smart environments. From collaborative robots and medical systems to EV charging stations, automated factory lines, and self-service kiosks, industrial displays increasingly serve as the first point of contact between AI-driven systems and users, directly influencing operational efficiency, system reliability, and brand perception.Multi-Scenario Demand Accelerates Industrial Display EvolutionAcross factories, medical equipment, and retail environments, the role of industrial displays has expanded far beyond simple information presentation. Autonomous mobile robots and unmanned transport vehicles rely on displays for real-time navigation feedback. Medical diagnostic equipment requires precise visualization to support AI-assisted analysis. Self-service kiosks integrate touch interfaces, sensing, user identification, and edge computing to deliver responsive, data-driven interaction.  According to Roger Ma, Director of Advantech's Industrial Display Solutions Business Unit, industrial sectors exhibit vastly different display requirements. Medical environments demand high accuracy and easy-to-clean designs; outdoor EV charging stations require high brightness and durable weather-resistant builds; robotics and automation systems prioritize responsiveness, stability, and seamless user interaction. These increasingly differentiated use cases are driving industrial displays toward greater flexibility, durability, and customization—creating new growth momentum for the market.Sector-Driven Strategy Accelerates Customization and InnovationAs industrial applications become more complex, a key challenge is integrating display hardware with edge AI, image processing, and intelligent computing. Backed by extensive cross-industry expertise, Advantech adopts a sector-driven strategy, enabling the company to deeply understand the operational challenges of autonomous systems, robotics, factory automation, medical diagnostics, and retail environments. This approach allows Advantech to deliver display solutions tailored to specific industry demands and expedite deployment.Roger Ma pointed out that a major competitive strength lies in Advantech's Design To Order Service (DTOS) capabilities. Its in-house R&D teams cover the entire design spectrum, including mechanical and optical engineering, electronic and software development, touch-bonding integration, assembly precision, and picture-quality tuning. This vertically integrated capability enables stronger quality control and significantly accelerates development cycles.Advantech further enhances customer responsiveness through agile supply chain management and regional manufacturing, enabling rapid customization and efficient adoption of new technologies such as miniLED backlighting. Looking forward, the company is advancing the integration of edge-AI capabilities directly into displays, including embedded cameras, microphone arrays, and sensor modules to support intelligent video conferencing, AI-enabled recognition, and real-time decision-making. With these advancements, displays are evolving into intelligent front-end nodes capable of analysis rather than merely presentation.AI-Enabled Applications: Real Deployment across Factory and Retail EnvironmentsAdvantech's industrial display technologies are already demonstrating real-world impact across multiple vertical markets. In robotic palletizing systems, Advantech's 12.1-inch WXGA (1280 × 800) industrial display serves as the primary interface for complex robotic operations. Offering 400-nit brightness, wide 160/160° viewing angles, and responsive PCAP touch, the display ensures clear visibility and intuitive control even in demanding factory environments.For real-time information visibility on the production line, Advantech deployed the 55-inch VUE-55 digital signage solution, configured as a 2×2 video wall to create a 110-inch large-format display. With a robust design supporting 50,000 hours of LED lifetime and 24/7 continuous operation, the solution delivers reliable performance for critical factory data.In retail environments closely connected to consumers' daily lives, Advantech's technologies also play a critical role. The 850-nit high-brightness, optically bonded IDP31-101W display enhances the touch experience and durability of intelligent cleaning robots. Meanwhile, the VUE-2238 anti-glare touch display provides flexible landscape and portrait installation options for self-service ordering kiosks and hotel counters. Its IP65 front-panel water- and dust-resistant design, along with its color accuracy, not only improves product reliability but also effectively strengthens brand image.Global Reach and Cross-Platform Integration as Key AdvantagesDisplays serve as the critical bridge connecting humans and machines, as well as data and decision-making. In the era of AI and edge computing, industrial displays are shifting from simple information output devices to core interfaces that drive digital transformation and create business value. According to Roger Ma, the competitiveness of Advantech's display product line stems from the company's unique strengths, including its expertise in multi-platform system integration and its extensive cross-industry experience. These capabilities enable Advantech to deliver complete solutions that go beyond standard display products and integrate seamlessly into customers’ overall application ecosystems.Looking ahead, Advantech will continue to provide high-reliability, rapid-deployment intelligent display solutions for global customers. With stronger edge-AI integration and enhanced customization capabilities, the company is poised to lead industrial displays into a new stage of development.Advantech's Industrial Display Solutions.Credit: Advantech

DigiKey, a leading global electronic components and automation products distributor, proudly announces the official launch of its Indian subsidiary, Digi-Key Electronics & Automation Trading Private Limited, which will operate a Global Capability Center (GCC) in Bengaluru. This reinforces DigiKey's long-term commitment to the Indian market by leveraging the expertise of nearly 300 DigiKey India employees to support its global operations.The launch of DigiKey India marks a significant milestone in the company's global expansion strategy. The newly established DigiKey GCC will serve as a hub for innovation and collaboration, signaling future growth in hiring and capability expansion.This milestone represents a major step forward in DigiKey's global strategy, said Dave Doherty, chief executive officer of DigiKey. India’s tech ecosystem and skilled workforce are key to our continued success in the region. We are thrilled to deepen our roots and invest in the future of DigiKey India.

The Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC) hosted the "AWS JIC Demo Day" on November 18 at InterContinental Kaohsiung, bringing together technology leaders, startups, and enterprises across Southern Taiwan. The event focused on how AI-driven innovation can accelerate startup growth, advance enterprise digital transformation, and enhance Taiwan's global competitiveness.Robert Wang, Managing Director of AWS Taiwan & Hong Kong, emphasized that since the AWS Joint Innovation Center launched in Kaohsiung in 2022, it has continued to empower the city to seize emerging opportunities. Through startup incubation and cloud-driven support, the JIC has helped accelerate innovation among local industries and expand Taiwan's presence in international markets. Moving forward, AWS will work closely with Kaohsiung under the core strategy of "New Finance, New Economy," with the goal of making the city a key financial innovation sandbox and a major demonstration hub in Asia. This initiative aims to inject new economic energy into Kaohsiung while accelerating enterprise modernization across sectors.Lin Chin-Tien, Director of the Southern Region Service Office of the Small and Medium Enterprise and Startup Administration (SMESA), Ministry of Economic Affairs, noted that the event represents a major milestone for Kaohsiung's smart economy and startup ecosystem. "Our collaboration with AWS has enabled startups to strengthen their technical capabilities while securing business opportunities with enterprises. We will continue supporting outstanding teams as they expand onto the global stage," Lin said.Lin Liao-Chia-Hung, Deputy Director-General of the Kaohsiung City Government Economic Development Bureau, highlighted the unique advantages of Kaohsiung's diverse industrial environment - where emerging technologies and traditional industries coexist and complement each other. He expressed hope that startups will leverage AWS's cloud technologies and ecosystem resources to help accelerate economic development in Kaohsiung and further contribute to Taiwan's overall industrial transformation.New Economic Growth Driven by AIA spotlight session, the "Joint Innovation Forum - The Smart New Economy Driven by AI," showcased public-private joint innovation cases where established enterprises collaborate with startups to create new industry momentum.Jacky Pan, Vice President of the Technical R&D Group at iPASS Corporation, shared how AI-driven, user-centric services are beginning to generate tangible public impact. For instance, AI analytics derived from iPASS Senior Citizen Cards usage data enable proactive early-warning mechanisms, allowing local governments to deliver timely care and strengthen elderly support services - a clear demonstration of how AI enhances public welfare and unlocks new avenues of innovation.DOTDOT Global CEO Ting Hsieh discussed digital transformation challenges faced by SMEs, noting that despite the company's initial aim to serve street-side vendors, many business owners lack the time and technical familiarity to adopt complex IT systems. "From an AI implementation standpoint, the biggest beneficiaries aren't the shop owners - it's the consumers and franchise headquarters. AI-driven features such as weather-triggered advertising help maximize order conversion and operational efficiency," he explained.Frank Liao, Director of Partnership at AIFT, highlighted how the company integrates red-teaming and real-time protection modules to establish strong compliance and safety guardrails for enterprise generative AI adoption. This solution has enabled innovation in highly regulated industries such as finance while ensuring compliance with global standards.Startups and Enterprises Co-Creating New Economic MomentumTwelve startup teams from the 2025 Startup Terrace Kaohsiung AWS Joint Innovation Center showcased their AI solutions spanning manufacturing, retail, legal services, smart buildings, and sports technology. Startups included AIRA (facial recognition and tracking), Ret[AI]ling Data (smart retail and manufacturing AI), LegalSign.ai (generative AI legal workflow platform), eCloudEdge (AIoT edge orchestration platform), eNeural (edge AI self-learning), PowerArena (Data insights for manufacturing using AI computer vision), Linker Vision (Vision AI with data-centric insights and edge integration), SHIPENG Technology (digital twin and smart construction AI), StatsInsight (Data solution for baseball), and Seasalt.ai (Cloud communication AI technology solutions). These teams demonstrated how the AWS JIC ecosystem is accelerating innovation and enabling enterprises to modernize through cloud-powered AI.AIRA, for example, develops facial recognition, face tracking, human detection, and smart fencing technologies that have been deployed in retail stores, factories, smart buildings, and public safety applications to enhance site management and safety.Addressing the challenges of data diversity, cloud-edge collaboration, and cybersecurity compliance in manufacturing and energy sectors, eCloudEdge provides the NeoEdge Edge Orchestration Platform. By integrating physical AI and sensor fusion technologies, NeoEdge helps enterprises accelerate innovation across OT and IT environments.The event brought together more than a hundred representatives from enterprises, startups, investors, and government agencies. AWS Taiwan & Hong Kong Managing Director  Robert Wang concluded the event by sharing his commitment to empowering promising startups with AWS cloud technologies and ecosystem resources, enabling them to achieve transformative growth and expand their reach from Taiwan to international markets.

MiTwell is revolutionizing embedded AI computing through its innovative OSM (Open Standard Module) and AMC (Advanced Micro Computing) architectures, delivering a new generation of scalable, cross-architecture AI platforms. With its miniaturized SIOC (System In One Chip) design and flexible converter board technology, MiTwell empowers industries with compact yet powerful edge AI solutions that accelerate intelligent transformation across manufacturing, healthcare, and smart IoT applications. Recently, MiTwell achieved IEC 62443-4-1 certification, demonstrating its commitment to secure development practices. This certified process enables future system products to be developed under a rigorous cybersecurity framework - enhancing product cybersecurity, reliability, and trustworthiness across the company's AI computing solutions.Cross-Architecture and Scalable OSM EcosystemThe MiTwell OSM module series addresses diverse AI computing needs with leading-edge platforms including MediaTek Genio 520/720, Qualcomm QCS6490/5430, and Renesas RZ/V2N, delivering AI performance from 3.2 TOPS to 15 TOPS - covering a full range of edge sensing and inference applications.Through MiTwell's flexible Converter Board technology, OSM modules can seamlessly integrate with Qseven, SMARC, and COMe mini industrial standard carrier boards while supporting both x86 and ARM architectures. This unified design framework enables developers to transition and scale effortlessly, achieving efficient, compatible, and modular product development. Whether for rapid prototyping or final system deployment, MiTwell empowers customers to shorten design cycles, reduce integration complexity, and bring innovation to market faster.Miniaturization Excellence: The Birth of a Palm-Sized AI SystemPursuing the philosophy of "Smaller Size, Greater Performance," MiTwell leverages Advanced Embedded Computing principles by combining OSM modules with its patented 45×45 mm baseboard design to launch the new SIOC (System In One Chip) solution. This breakthrough condenses complete edge AI computing capabilities into a compact footprint, delivering high performance, low power consumption, and superior reliability - the ideal embedded platform for AIoT, industrial automation, and medical applications.In addition, MiTwell introduces a compact Vision AI PC system equipped with a built-in Full HD camera, supporting real-time image recognition and intelligent data analytics - enabling customers to rapidly deploy Vision AI solutions and usher in a new era of smart edge computing.Security and Trust: Building Industrial-Grade Cyber ResilienceIn industrial environments, safety and reliability are the foundation of every system. MiTwell has officially achieved TUV NORD Taiwan IEC 62443-4-1 certification for secure development processes and is actively progressing toward IEC 62443-4-2 and CRA (Cyber Resilience Act).This milestone underscores MiTwell's long-term commitment to product security lifecycle management, ensuring every solution not only delivers top-tier AI performance and design flexibility but also meets global industrial standards for cybersecurity, reliability, and trust.

 AGI Technology, a leading memory brand from Taiwan, announced that it will participate in CES 2026 from January 6 to 9 in Las Vegas at The Venetian Resort, Level 2, Bellini 2001B, where it will debut its complete lineup of next-generation high-speed storage solutions. Under the theme "Powering What's Next with AGI Innovation," AGI will showcase breakthrough technologies across extreme overclocking, high-speed transmission, and rugged mobile storage to address the surging demands of AI computing, ultra-high-resolution content workflows, and multi-task creative environments.AGI's Next-Generation Storage Portfolio DebutsProject S10 Gen5 SSD - 6nm Controller, 11,000 MB/s PerformanceAGI introduces its new flagship Project S10 Gen5 SSD featuring TSMC's 6nm controller, delivering significantly enhanced efficiency and effectively addressing the thermal challenges common in Gen5 devices under extended heavy workloads. With PCIe Gen5 x4, the drive reaches speeds of 11,000 MB/s, offering a dramatic bandwidth upgrade over Gen4. Combined with its low-power controller and high-efficiency cooling module, the S10 provides sustained, stable performance for AI datasets, AAA gaming, and high-resolution rendering.Project K10 DDR5 - 10,000 MT/s Overclocking FlagshipBuilding on the success of the Turbojet series, AGI reveals Project K10 DDR5 memory, achieving an impressive 10,000 MT/s with optimized latency and a 24GB x2 high-capacity configuration. The aluminum heatsink and a fluid-cut design with a dynamic RGB light bar enhance both cooling performance and visual aesthetics, delivering an exceptionally smooth overclocking experience for gamers.Comprehensive Mobile Storage: High Speed x Durability x Capacity in One LineupAGI presents three new portable SSDs designed around mobility, high-speed transmission, and rugged durability. The AGI ED158 uses a cap-less sliding connector that plugs directly into smartphones for 4K ProRes recording and instant backup with zero cables needed, enabling intuitive and efficient mobile creation. The AGI ED268 features IP55 water- and dust-resistance, 2-meter drop protection, and 20 Gb/s transfer speeds, offering the ideal balance between durability and performance. The AGI ED368 adopts the latest USB4 Gen3 x2 interface, reaching up to 40 Gb/s with an outdoor-grade reinforced enclosure suited for field production, on-the-go editing, and professional imaging teams.AGI Technology invites attendees to visit Bellini 2001B to experience the power of its next-generation storage innovations. Additional products and accessories will be showcased, with AGI engineers available for technical discussions on the future of high-speed computing and storage.

TAIPEI, Taiwan - WeLink Solutions proudly introduces the RSQ11 NUC System, a next-generation industrial-grade computing platform built on Intel Twin Lake architecture. Designed for smart manufacturing, IoT, and edge AI applications, the RSQ11 combines high performance, efficiency, and rugged reliability within a compact form factor - now further reinforced by IEC 62443-4-1  certification for securing product development lifecycle process.Twin Lake Performance at the EdgePowered by Intel's latest Twin Lake processors, the RSQ11 delivers exceptional computing power with optimized energy efficiency - the ideal foundation for intelligent edge solutions.Intel N150 (4 cores, 6W TDP): Fanless efficiency for stable, low-power edge gateways.Intel N355 (8 cores, 15W TDP): Balanced performance for automation, machine vision, and AI inference.Combined with DDR5 memory, dual 2.5 GbE LAN, and modular M.2 expansion, the RSQ11 ensures seamless data flow, ultra-low latency, and flexible scalability - including integration with leading AI accelerator cards from Hailo or DeepX for enhanced edge intelligence.Cybersecurity Built into Every Stage - IEC 62443-4-1 CertifiedWeLink Solutions has achieved IEC 62443-4-1 certification, following a rigorous audit by TUV NORD Taiwan. This internationally recognized standard validates WeLink's secure product development lifecycle, ensuring that cybersecurity is embedded from initial design through final deployment.This certification reinforces WeLink's commitment to secure innovation across its portfolio - from modular computing platforms to ruggedized edge systems. For customers, it guarantees long-term security assurance, continuous vulnerability management, and  forward-looking readiness for upcoming regulations such as the EU Cyber Resilience Act (CRA)."As industries increasingly rely on connected intelligence, security must be built into the hardware foundation," said a company representative. "With IEC 62443-4-1 certification, our RSQ series combines industrial reliability with verified cybersecurity, empowering global partners to deploy smarter, safer edge solutions."Engineered for Industrial IntelligenceThe RSQ11 embodies WeLink's vision of compact power with infinite possibilities. From factory automation and intelligent transportation to AI-driven edge analytics, the RSQ11 adapts seamlessly to diverse industrial applications - delivering the reliability, scalability, and security essential for Industry 4.0 and beyond.

In 2025, LitePoint, a global leader in wireless testing solutions, hosted its "Smart Connectivity Unbounded · Testing Drives the Future" Innovative Testing Technology Seminar in Hsinchu and Taipei on September 23 and 24. This year’s event spotlighted cutting-edge testing and verification methods for diverse wireless communication technologies, setting new benchmarks for user experience and underscoring the transformative impact of wireless innovation.The seminar opened with a keynote address by Glenn Farris, LitePoint's Vice President of Global Sales, who warmly welcomed attendees and shared an overview of the latest advancements in testing technology. As a pioneer in wireless testing, LitePoint continues to deliver solutions that are fully connected, highly intelligent, and strongly compatible, enabling enterprises to overcome complex testing challenges and capitalize on emerging opportunities.Following this, Adam Smith, LitePoint's Vice President of Marketing, outlined the seminar's core themes. He emphasized that the rapid evolution of AI applications is accelerating the growth of wireless technologies. Today's diverse usage scenarios demand high bandwidth, robust stability, and ultra-low latency for seamless connectivity and data transmission. No single wireless technology can dominate the market, making multi-technology integration-including 5G RedCap, Wi-Fi, Bluetooth, and UWB-essential. Coupled with enhanced security measures, these innovations are critical to meeting the ever-increasing expectations of end-users.Adam Smith, Vice President of Marketing, LitePoint. Credit: LitePointRapid Progress in Multi-Technology Wireless Integration in the AI EraAdam Smith began by examining the current state of the 5G market. Drawing insights from Mobile World Congress (MWC), he noted that telecom operators remain cautious about 6G adoption, largely due to the slow return on investment from 5G. However, the global 5G Fixed Wireless Access (FWA) market has emerged as a game-changer, delivering fast and cost-effective high-speed network deployment solutions. This trend continues to gain traction among service providers, driving growth in the 5G FWA Customer Premises Equipment (CPE) segment, which is projected to achieve a 31.5% CAGR from 2024 to 2032.Meanwhile, the rise of Wi-Fi 7 and the upgrade cycle for mid-to-high-end networking equipment are fueling demand. With its significantly improved transmission speed and spectral efficiency, Wi-Fi 7 is accelerating the adoption of high-end routers in both residential and commercial environments. Market penetration is expected to exceed 10% in 2025, setting the stage for strong growth in 2026 and sparking anticipation for the upcoming Wi-Fi 8 standard.In addition, the Industrial Internet of Things (IIoT) is creating new opportunities through the convergence of low-speed, long-range wireless technologies with Wi-Fi. Solutions such as 5G RedCap, Bluetooth, and UWB are experiencing heightened demand, serving as the true engine behind the dynamic wireless communication market. To ensure seamless integration and performance, verification and testing of these technologies are critical. LitePoint’s advanced testing solutions play a pivotal role in enabling continuous AI-driven innovation and delivering exceptional user experiences.Wi-Fi 8: Ushering in an Era of "Ultra-High Reliability" Wireless ConnectivityJames Lin, Deputy General Manager of the Connectivity Technology Development Division at MediaTek, was invited to share the technical highlights of Wi-Fi 8. Reflecting on the 25-year evolution of Wi-Fi technology, he noted that transmission speeds have increased thousands of times. However, Wi-Fi 8's focus has shifted beyond mere speed to "Ultra-High Reliability" and multi-device connectivity, aiming to deliver a more stable and lower-latency wireless network environment, providing users with a tangible upgrade.James Lin, Deputy General Manager, Connectivity Technology Development Division, MediaTek. Credit: LitePointJames Lin highlighted four major innovations driving Wi-Fi 8:Enhanced Long Range (ELR): ELR addresses the asymmetry in transmission power between routers and end devices, eliminating the “visible but unreachable” issue. MediaTek has integrated its proprietary MediaTek Long Range (MLR) technology into Filogic Wi-Fi 7 chips, achieving the extended coverage promised by ELR. This advancement enables the Dimensity 9400 mobile chip to maintain connectivity up to 30 meters on the 2.4GHz band.Coordinated Spatial Reuse (Co-SR): By coordinating transmission power among routers, Co-SR optimizes time reuse and significantly improves Mesh network performance. MediaTek was first to implement Co-SR in its Filogic Wi-Fi 7 chips. In real-world Mesh topology tests, download speeds improved by 48%, while file download times dropped by 37.5%.Dynamic Sub-Channel Operation (DSO): Addressing the mismatch between large bandwidth support in routers (5GHz or 6GHz bands) and smaller bandwidth support in most end devices, DSO optimizes router bandwidth efficiency through frequency hopping techniques. Simulation results show up to an 80% increase in overall network speed.Non-Primary Channel Access (NPCA): NPCA leverages primary channel hopping to increase channel access opportunities, improving interference resistance and connection stability while maintaining compatibility with surrounding routers. Simulations show peak-hour speeds up by 67% and latency reduced by up to 92%.James Lin emphasized: "Wi-Fi 8 aims to create a harmonious, high-performance network environment for multiple devices-offering speed, stability, and reliability. MediaTek remains committed to innovation, standard-setting, and delivering products aligned with the latest specifications. Our upcoming Filogic Wi-Fi 8 solution targets Wi-Fi 8 certification, streamlining partner product approvals and accelerating the industry’s transition to ultra-reliable connectivity."As a global leader in wireless testing, LitePoint is dedicated to delivering precise RF testing solutions. The company will continue collaborating closely with MediaTek to validate Wi-Fi 8 technologies, ensuring exceptional chip quality and performance. Together, they aim to help the industry embrace a new era of ultra-reliable wireless connectivity-unlocking innovative applications and limitless possibilities.The Importance of Deploying Silicon Photonics and CPO Packaging Communication Chips with Multi-Channel Parallel TestingAlex Zhang, Asia Technical Sales Manager at Quantifi Photonics-a Teradyne subsidiary headquartered in Auckland, New Zealand-shared insights on multi-channel parallel testing solutions for silicon photonics chips and Co-Packaged Optics (CPO). With the industry anticipating significant growth in cloud data centers, demand for 800Gbps optical modules is expected to surge from 2026, with 1.6Tbps modules poised to become the next standard. However, as this market accelerates, the primary challenge lies in developing efficient testing solutions for optical modules from wafer to final assembly.Alex Zhang, Asia Technical Sales Manager, Quantifi Photonics. Credit: LitePointQuantifi Photonics specializes in testing Photonic Integrated Circuits (PICs), leveraging the PXI (PCI eXtensions for Instrumentation) platform to integrate high-frequency signal generators, high-speed sampling oscilloscopes, spectral analyzers, and other instruments for wafer-level PIC testing. Automated testing through high-speed optical-to-electrical I/O interfaces ensures accurate verification of optical interconnect performance.During his presentation, Alex demonstrated testing of CPO chip samples, showcasing the process from wafer-level packaging to PCBA assembly and optical fiber channel integration, forming a complete optical communication module test sample. The module under test featured 512 optical channel connections-a scale that would require several days if tested sequentially. This underscores the critical role of parallel testing design and verification in transforming CPO and silicon photonics module testing methodologies.Teradyne has successfully expanded its expertise from chip and wireless communication testing into optical communication systems, marking a strategic evolution in its technology roadmap.Wi-Fi 8 RF Performance Verified by the IQxel-MX Series for Real-World ReliabilityYoung Huang, Associate Director of Applications Engineering at LitePoint, discussed RF performance verification for Wi-Fi 8. He noted that Wi-Fi 8 builds upon Wi-Fi 7's architecture, retaining many RF specifications while introducing enhancements in spectrum utilization and interference mitigation-necessitating comprehensive RF testing coverage.Young Huang, Associate Director of Applications Engineering, LitePoint. Credit: LitePointCurrent verification focuses on coexistence with other wireless technologies across the 2.4GHz–6GHz bands, particularly optimizing the 6GHz spectrum, which supports 320MHz bandwidth and 4096-QAM modulation. Accurate simulation and interference testing are essential to validate real-world performance.Additionally, ensuring multi-device connectivity and low-latency performance requires analyzing spectrum conflicts and coordinated operations among multiple Access Points (APs). Wi-Fi 8 introduces new technical challenges, including Data Rate and Unequal Modulation techniques and dRU subcarrier testing, all supported by LitePoint's advanced Wi-Fi 8 testing systems.LitePoint has already begun initial preparations for Wi-Fi 8 sample testing, with physical chip testing expected in 2026 and Wi-Fi Alliance certification targeted for 2028. To address these challenges, LitePoint has deployed its IQxel series, led by the IQxel-MX platform, integrated with IQfact+ automated testing software. Customers will need to update their compliance frameworks to meet full RF performance requirements.Unleashing the Full Potential of 5G RedCap and eRedCapJohnson Li, Software Engineer, explored the growing adoption of the RedCap standard. The 3GPP Release 17 (R17) version targets wearable devices, industrial sensors, and security cameras, while the enhanced Release 18 (eRedCap) standard takes aim at broader IoT connectivity. By reducing bandwidth from 100MHz to 10MHz and adopting 1T1R/1T2R antenna configurations, eRedCap lowers costs by 40-60%, positioning RedCap as a major growth driver for 5G devices-particularly in the Asia-Pacific market, which is outpacing Europe and North America. This trend also accelerates 5G Standalone (SA) network deployment and lays the groundwork for 6G development.Johnson Li, Software Engineer, LitePoint. Credit: LitePointCurrently, operators in the U.S. and China have deployed RedCap networks, with strong government and industry support fueling market momentum. LitePoint's testing solutions, including Signaling (IQcell-5G) and Non-Signaling platforms, enable rapid advancement of 5G SA architectures and ensure seamless integration of RedCap technology.Next-Generation Bluetooth: Features, Testing Requirements, and Market OutlookJerry Chien, LitePoint Applications Engineer, analyzed the capabilities of Bluetooth 6.0, launched in 2024, highlighting its Channel Sounding positioning function, which achieves sub-meter accuracy -a critical feature for object-finding applications and enhanced personal item tracking.Jerry Chien, Applications Engineer, LitePoint. Credit: LitePointBluetooth has expanded beyond the 2.4GHz band, now leveraging 5GHz and 6GHz for improved anti-interference performance via spectrum switching. With market growth projected to triple between 2024 and 2028, Bluetooth 6.1 introduces new testing requirements to support Channel Sounding, creating significant market opportunities.LitePoint's testing of Channel Sounding positioning focused on PBR (phase-based ranging) along with Time of Flight (ToF). The IQxel-MW 7G and IQxel-MX platforms provide comprehensive testing for Bluetooth's Channel Sounding feature, helping clients accelerate next-generation product development.UWB 802.15.4.ab: Precision Ranging Gains MomentumChih Wei Huang, Associate Director of Applications Engineering, discussed Ultra-Wideband (UWB) micro-positioning technology and the testing challenges of the IEEE 802.15.4.ab standard. 802.15.4ab introduces a new narrowband signal, which is deployed at is lower frequency and higher power, to assist the UWB transmission. This enables the UWB positioning to operate at longer distances.Chih Wei Huang, Associate Director of Applications Engineering, LitePoint. Credit: LitePointTesting must address long-range performance, dynamic data rates, and RSF/RIF requirements. Narrowband signals' strong anti-noise capability enhances synchronization accuracy and stability between UWB devices. LitePoint offers the IQgig-UWB+ One-Box solution, along with FiRa 3.0 certification and CCC PHY compliance testing. Recent collaboration between the Connectivity Standards Alliance (CSA) and FiRa further strengthens UWB's future prospects.Collaborative Efforts in IIoT and Edge AI: Unlocking New OpportunitiesThe seminar concluded with a panel discussion moderated by Eric Huang, Deputy General Manager of DIGITIMES, featuring Glenn Farris (LitePoint VP of Global Sales), Adam Smith (LitePoint VP of Marketing), Jerry Chiang (Advantech Embedded IoT Business Group), and Bruce Chen (Qualcomm Staff Product Manager).The discussion focused on Edge AI opportunities in Industrial IoT (IIoT), highlighting applications in robotics, autonomous mobile robots (AMRs), smart healthcare, smart manufacturing, and smart cities. Key wireless technologies-Wi-Fi 7, GNSS, RedCap, and long-range low-speed protocols-will play pivotal roles. Integrating 5G and Wi-Fi to balance cost and performance is critical for smart mining and warehousing. The panel emphasized ecosystem collaboration to build next-generation industrial-grade wireless networks for Edge AI, accelerating deployment and unlocking transformative potential.(All photos in this article are provided by the LitePoint event.)

SK hynix Inc. (or "the company", www.skhynix.com) announced on December 7, 2025, that it has been named the winner of the Best Financially Managed Semiconductor Company Award(Achieving Greater than $1 Billion in Annual Sales) and the Outstanding Asia-Pacific Semiconductor Company Award at the Global Semiconductor Alliance(GSA) Awards 2025, held on December 4 PST in Santa Clara, California.The GSA Awards, organized annually since 1996, are regarded as the most prestigious honors in the global semiconductor sector, recognizing outstanding performance in leadership, financial results and industry reputation. SK hynix secured its second win in the financial management category following 2017, and its first recognition as the top Asia-Pacific semiconductor company. The dual achievement reinforces the company's reputation as a leading global technology innovator.While the semiconductor industry faced a severe downturn just two years ago, the company has been the fastest to rebound thanks to its advanced AI memory technologies including HBM. This performance has resulted in global recognition for its operational excellence and financial execution. SK hynix plans to continue building sustainable growth with its dominant leadership in the AI memory market.The awards reflect the company's proactive delivery of groundbreaking HBM solutions and its steadfast commitment to customer-centric performance in surging global AI demand. SK Chairman Chey Tae-won has consistently emphasized that securing technological competitiveness must remain unwavering, especially during challenging times. This long-term focus on technology investment and global cooperation network has contributed to the company's improved performance and reinforced financial health.Driven by this strategy, SK hynix has recorded historic performance throughout 2025. For the first three quarters, the company reported revenue of 64 trillion won and operating profit of 28 trillion won in total, positioning it well to surpass its previous full-year earnings record set in 2024(66 trillion won in revenue and 23 trillion won in operating profit).Financial health has also significantly strengthened. As of the end of the third quarter, cash and cash equivalents reached 27.9 trillion won, up 10.9 trillion won quarter-over-quarter, while interest bearing debt decreased to 24.1 trillion won— successfully transitioning into a net cash position of approximately 4 trillion won.To secure long-term leadership in AI memory, SK hynix is accelerating major investments. The Cheongju M15X fab, which opened its cleanroom earlier than planned in October, is on track to begin HBM mass production in the first half of next year. Construction of the first fab in the Yongin Semiconductor Cluster, launched in February, is also progressing ahead of schedule.With its recent financial achievements and continued expansion, SK hynix is expected to further solidify its AI memory leadership going forward.SK hynix was represented at the ceremony by Justin Kim, President & Head of AI Infra at SK hynix, and Sungsoo Ryu, President of SK hynix America. "It is a great honor to receive this award." Kim said, "We will continue to lead the market and create new value for customers as a Full-Stack AI Memory Creator, driving growth across the global AI ecosystem."

At NewPower Worldwide, we are closely monitoring the accelerating shifts in the semiconductor market as global demand surges to unprecedented levels. Procurement professionals across every industry are preparing for 2026, a year that is shaping up to be fiercely competitive as demand continues to soar while supply remains limited.The semiconductor market is surging to unprecedented levels, with global demand intensifying across nearly every product category. As we look ahead to 2026, it's clear that the industry is entering a fiercely competitive phase characterized by high demand and a finite supply.The demand for semiconductors continues to increase at a rapid pace, driven by transformative technologies such as artificial intelligence, cloud infrastructure, electric and autonomous vehicles, and next-generation consumer electronics. The market is expected to grow by over 8% in 2026, hitting a staggering $760 billion in global sales. For buyers and procurement teams, this rapid growth reinforces the value of partnering with NewPower Worldwide to secure reliable access to components during sustained market expansion.However, this growth comes with significant constraints. Semiconductor supply remains limited, especially for mature-node components that power a broad range of applications. The combination of exploding demand and constrained supply has created intense competition within the market - a fight to secure the necessary components ahead of rivals. This environment underscores the importance of NewPower Worldwide’s global sourcing capabilities, which help procurement teams stay ahead of shortages and market disruptions.As these dynamics evolve, this perspective remains consistent with our communication over the past several years. At NewPower Worldwide, we have long believed that global demand significantly outpaces supply across semiconductors, memory, and related segments, and recent data underscore that this imbalance is not only persisting but deepening. As new technologies emerge and applications accelerate, this gap is expected to continue well into 2026 and beyond, impacting multiple product categories and geographies.In this environment, companies that anticipate and act early to secure supply chains, manage inventory wisely, and maintain operational agility will emerge as leaders. Getting in front of these challenges is no longer optional - it is the defining factor for success. NewPower Worldwide supports procurement teams in building proactive strategies that mitigate shortages and reduce operational risk.At NewPower Worldwide, we have positioned ourselves to help customers thrive in this complex environment. Our global sourcing strength spans multiple continents and leverages a vast network of suppliers to quickly identify alternative routes and hard-to-find parts. Managing over $1 billion in inventory, we provide access to critical components while minimizing excess stock and lead times.We have invested heavily in our proprietary technology, EMPOWER, which delivers real-time pricing transparency, market intelligence, and transactional analytics, enabling customers to optimize their purchasing decisions and mitigate risk.Our proactive obsolescence management helps clients navigate end-of-life product challenges before they disrupt operations, while our certified quality assurance protocols ensure authenticity and reliability. Furthermore, we maintain stringent cybersecurity measures, including ISO 27001 certification, to safeguard customer data and supply chains against emerging cyber threats.Finally, our 24/7 worldwide customer support team works closely with clients to deliver tailored solutions and maintain clear communication, helping them stay ahead of supply uncertainties. The market pressures of 2026 will be intense, but with the right partner, they can be managed. NewPower's integrated approach - combining global reach, innovative technology, and committed service - is designed to protect our customers and empower their success in this rapidly evolving semiconductor landscape, please visit offcial webiste.