Tong Hsing Electronic, a global leader in semiconductor assembly and testing services, today announced a strategic collaboration with Singapore-based AI solutions provider SixSense, following a comprehensive market evaluation. The partnership aims to advance Tong Hsing's smart factory initiatives, with an initial focus on AI-driven defect classification (ADC) in manufacturing processes.As semiconductor manufacturing becomes increasingly complex and high-volume, traditional manual defect inspection and classification methods face growing challenges in terms of labor cost, consistency, and efficiency. After evaluating multiple solutions, Tong Hsing Electronic selected SixSense for its strong performance in classification accuracy, deployment flexibility, and seamless integration with existing production systems - aligning closely with the company's long-term digital transformation and smart manufacturing strategy.By adopting SixSense's AI-powered ADC solution, Tong Hsing Electronic look forward to automatically analyzing and classifying large volumes of defect images generated across production lines. This significantly reduces reliance on manual inspection, improves classification consistency, accelerates cycle time, and enables engineering teams to identify and address process issues more effectively.Skid Chiu, Senior Assistant Vice President of Tong Hsing commented:"Reducing labor-intensive steps while maintaining quality is critical for sustainable growth. The adoption of SixSense's AI ADC solution is expected to enable us to optimize resources more effectively while keeping pace with increasing inspection demands."Akanksha Jagwani, Co-Founder & CEO of SixSense, added:"Our goal is to help semiconductor manufacturers scale operations without scaling complexity or cost. The results currently validated by Tong Hsing Electronic Industries also demonstrate how AI can simultaneously reduce labor dependency and improve cycle efficiency in high-volume manufacturing environments."Tong Hsing Electronic emphasized that this collaboration represents more than a system deployment - it marks a key milestone in its smart factory roadmap. Moving forward, both companies plan to deepen their collaboration by expanding AI applications across additional process stages and product lines, further strengthening manufacturing resilience and competitiveness.

QuiX Quantum, a leading provider of photonic quantum computing hardware, and Artilux, a developer of advanced semiconductor-based photonic detector technologies, today announced the signing of a Memorandum of Understanding (MoU).This agreement builds on the companies' complementary strengths in photonic system design and their positions within the broader semiconductor ecosystem. The collaboration is aimed at strengthening hardware integration, improving manufacturability, and lowering operational energy requirements in photonic quantum computing systems.Building quantum hardware for practical environmentsAs quantum computing matures into real-world applications, operating efficiently beyond specialized laboratory environments is becoming increasingly critical. The collaboration focuses on integrating advanced detector components more closely within photonic quantum hardware, enabling meaningful reductions in infrastructure demands. This direction contributes to quantum computing hardware that is increasingly compatible with modern data-center environments and designed with deployability and total cost of ownership in mind.Integration, scalability, and energy efficiencyBy combining Artilux's expertise on germanium silicon (GeSi) photonic technology with QuiX Quantum's system-level photonic quantum computing development, the collaboration seeks to simplify system architecture and reduce detector-level cooling requirements and support infrastructure. This approach improves overall manufacturability and supports QuiX Quantum's objective of delivering high-performance photonic quantum computing hardware in Data Centers and HPC infrastructure, enabling scaling with industry needs.Executive Quotes:Dr.-Ing. Stefan Hengesbach, CEO, QuiX Quantum "We are thrilled to partner with Artilux as this collaboration supports our long-term strategy of building scalable and most energy-efficient photonic quantum computers. This allows us to improve manufacturability, uptime and reduce operational complexity while further expanding practical deployment."Erik Chen, CEO, Artilux "We are excited to collaborate with QuiX Quantum on leveraging our detector technologies to advance and support more energy-efficient and scalable quantum hardware. Partnerships like this help accelerate progress in next-generation photonic computing and underscores our growing role in global deep-tech innovation across multiple industrial sectors."Bas Pulles, Representative of Netherlands Office Taipei "We are pleased to witness the signing of this agreement between two technology pioneers; this agreement exemplifies how international cooperation can accelerate breakthrough technologies and create long-term economic and technological value for both regions."

DesignCon, the United States' premier annual gathering for chip, board, and systems design engineers, returns to the Santa Clara Convention Center from February 24-26, 2026. For over three decades, this flagship Silicon Valley event has served as the essential forum for industry professionals to discover innovative solutions to the most pressing signal and power integrity challenges.As a global leader in semiconductor test sockets, Smiths Interconnect is proud to announce its participation in this prestigious conference and exhibition. We will feature a comprehensive portfolio of our star test products, highlighting solutions engineered for the next generation of technology in AI PCs, Enterprise Data Centres (EDC), automotive electronics, and the Internet of Things (IoT).Spotlight on Innovation: DaVinci Gen V High-Speed Test SocketHeadlining the display will be the DaVinci Gen V High-Speed Test Socket, Smiths Interconnect's latest flagship product. Designed to meet the extreme demands of high-performance computing and AI data centres, the DaVinci Gen V test socket delivers breakthrough high-speed signal transmission and performance. It enables unprecedented digital signaling speeds of up to 224 Gbps PAM4 for AI accelerators and beyond 100 GHz for 6G communications. These speeds are crucial for supporting the growing demand for massive data transfer.The solution supports BGA, LGA, and other package variants, using spring probe technology with a homogeneous alloy and gold plating to ensure better grounding. It delivers RF bandwidth greater than 84 GHz at -1 dB insertion loss, with a short signal path and a 4.90 mm test height. The impedance is tuned to match the system, providing consistent and stable contact resistance of 55 mΩ on average.The design also accommodates high co-planarity and features a tri-temp socket structure capable of operating from -55 °C to +150 °C. The same socket is suitable for manual test, bench test, and high-volume manufacturing (HVM) production test, enabling greater efficiency and consistency across test stages.In addition to high-speed test solutions, Smiths Interconnect will also showcase its high-power burn-in socket, a specialised electromechanical interface designed to temporarily connect a semiconductor device—such as a CPU, GPU, AI accelerator, or high-power discrete component—to a test board during the burn-in and stress-testing phase of manufacturing.It is designed to support next-generation devices with up to 22,000 contacts and sizes up to 150 × 150 mm, while managing power levels of up to 2000 W through integrated liquid cooling. The socket is universally compatible with advanced burn-in chamber platforms and can deliver a 500 lb applied load with a maximum closing force of 15 lb. Flexible thermal options, including passive heatsinks and heat pipes, are also available to meet different testing requirements.This burn-in socket is built for durability and thermal/electrical stability under extreme stress conditions.Attendees are invited to visit Booth 508 to experience Smiths Interconnect's cutting-edge technologies firsthand and engage with technical experts.Credit: Smiths InterconnectCredit: Smiths Interconnect

The online gaming landscape is evolving rapidly, shaped by cutting-edge technologies and innovative formats. As we look ahead, it's crucial to understand how these changes impact player experiences and market dynamics. This article examines key trends driving the transformation of gaming entertainment.As of January 2026, online gaming continues to captivate audiences worldwide, becoming a cornerstone of digital entertainment. Emerging trends are reshaping this dynamic landscape, offering players novel ways to engage with their favorite games. One significant development is the increasing interest in games that offer thrilling and potentially rewarding experiences, such as progressive jackpot slots. In this fast-paced digital era, understanding these trends is essential for both players and industry stakeholders who aim to navigate and thrive in an ever-evolving market.Technological Advancements Change Gaming EnvironmentsThe role of technology in enhancing gaming experiences cannot be overstated. Innovations such as artificial intelligence (AI) and virtual reality (VR) are at the forefront, creating more immersive and interactive environments for players. AI-driven algorithms personalize game recommendations, adapting to individual preferences and improving player satisfaction. Meanwhile, VR technology transports users into lifelike game worlds, offering unprecedented levels of engagement and realism.These technological breakthroughs are not merely enhancing gameplay; they are redefining what players expect from their gaming experiences. As you explore these new realms, you'll notice how seamless integration of AI and VR heightens the sense of immersion and engagement. The potential for further innovation remains vast, promising even more sophisticated gaming landscapes that captivate and challenge players in exciting ways.New Gaming Formats Change Player EngagementIn recent years, new gaming formats have emerged, captivating audiences with fresh approaches to gameplay. These formats often emphasize social interaction and collaboration, appealing to a diverse range of players seeking unique experiences. As these formats gain traction, they alter how players engage with games, fostering communities that thrive on shared adventures and challenges.For many players, these innovations offer a chance to connect with others in meaningful ways, enhancing the social aspect of gaming. Whether through cooperative missions or competitive tournaments, new formats provide opportunities for camaraderie and competition alike. As you dive into these engaging worlds, the evolution of player expectations becomes clear, demanding more interactive, community-driven content that keeps pace with technological advancements.Economic Implications and Growth Prospects in GamingThe evolving trends in online gaming have significant economic implications for the industry at large. With technological innovations driving new possibilities, the market is poised for substantial growth in the coming years. Industry stakeholders must adapt to capitalize on emerging opportunities while navigating potential challenges posed by rapid change.The market is expected to expand as companies invest in cutting-edge technologies and diversify their offerings. This growth presents lucrative possibilities for developers, investors, and entrepreneurs looking to enter or expand within the sector. By staying informed about current trends and anticipating future shifts, you can position yourself advantageously within this thriving industry.

The "From Shenzhen to Global Opportunity: BIWIN Mini SSD Ecosystem Application Seminar", jointly hosted by BIWIN and Intel, was successfully concluded at the Intel Greater Bay Area Innovation Center in Shenzhen.  The seminar convened leading companies, industry partners, and authoritative media from across the value chain, including but not limited to computing power, advanced packaging, controller solutions, and end-device manufacturing providers. Together, participants gained an early glimpse into BIWIN's Mini SSD ecosystem strategy and engaged in in-depth discussions on industry collaboration and emerging business opportunities driven by AI.On-Device AI Is Redefining Storage Innovations at the EdgeAI is now embedding into edge devices like PCs, wearables, and robots with unmatched depth and reach, sparking revolutionary hardware needs. Storage, the core data foundation, must balance form factor, speed/performance, and power consumption - a critical constraint hindering new terminal designs and major performance jumps.Across the industry, a clear consensus is emerging: the edge-AI revolution must be powered by a fundamental transformation in storage technology. Conventional storage solutions can no longer satisfy the rigid requirements for ultra-compact size, high performance, low power consumption, and flexible scalability. The market is calling for a truly disruptive solution.BIWIN Mini SSD: Reshaping Industry Possibilities with a Ground-Up InnovationIn response to these industry shifts, BIWIN introduced Mini SSD, a product designed from the ground up for next-generation edge platforms. Rather than a simple iteration of existing solutions, Mini SSD represents a complete redefinition of SSD form factors, purpose-built for the future."The explosive growth of edge AI has created the perfect moment for storage innovation," said Rixin Sun, Founder and Group Strategic Advisor of BIWIN, in his opening remarks. "Mini SSD is not only a technological breakthrough for BIWIN, but also a new starting point for co-creating business value with our ecosystem partners."With approximately 40% of the volume of an M.2 2230 SSD and weighing about 1 gram, the Mini SSD delivers flagship-class performance, supporting capacities of up to 2TB and sequential read/write speeds of up to 3,700MB/s and 3,400MB/s. It also features IP68-rated dust and water resistance, 3-meter drop protection, and durability rated for over 12,000 insertion cycles.Its breakthrough design has earned multiple prestigious international awards, including TIME's Best Inventions of 2025 (the only storage product globally selected) and "Best-in-Show" at Embedded World North America 2025.Huilian Wang, Product Director, BIWIN. Credit:BIWINHuilian Wang, Product Director at BIWIN, further elaborated on the product's ecosystem value. Mini SSD is precisely positioned for five key application scenarios, namely ultra-thin notebooks, gaming handhelds, external storage, mobile workstations, and Physical AI devices, providing a new core engine for terminal-side innovation.BIWIN Mini SSD's power ultra-thin laptops, handhelds, external storage, workstations, and Physical AI. Credit:BIWINVertical Integration + Ecosystem Collaboration: Building a Solid Industrial FoundationThe success of Mini SSD is underpinned by BIWIN's strong vertically integrated capabilities and its open, collaborative ecosystem strategy.Internally, BIWIN has established a complete vertical chain spanning IC design, firmware development, and advanced packaging and testing. Greater Bay Advanced Technology Co., Ltd. (GBAT), its wholly-owned subsidiary and also the advanced packaging and manufacturing center, has overcome critical challenges such as 45μm ultra-thin die cracking in advanced packaging, ensuring exceptional reliability and performance.Externally, BIWIN is working closely with leading ecosystem partners to foster an open and mutually beneficial industry environment. As a long-term strategic partner, Intel shared its latest advancements in AI PC technologies. Tao Yan, Client Technology Director, Intel China, noted the strong foundation of cooperation between the two companies and expressed expectations for broader innovation enabled by Mini SSD in the AI PC era.Vertical Integration + Ecosystem Collaboration: Building a Solid Industrial Foundation. Credit:BIWINGlobal controller leaders such as Silicon Motion and Maxio Technology have also collaborated closely with BIWIN to provide powerful performance engines for Mini SSD. On the terminal side, Lin Wang, General Manager of One-Netbook (ONEXPLAYER), the first brand to adopt Mini SSD, shared that the product has become a core differentiator for its offerings. Meanwhile, AI PC solution providers such as Sixunited Intelligent confirmed plans to actively integrate Mini SSD into future product lines to address the surging storage demands driven by AI applications.Open Collaboration, Shared GrowthThis successful seminar marks not only a key milestone in BIWIN's Mini SSD ecosystem strategy, but also signals the industry's collective move into a new era of AI-driven storage.Looking ahead, BIWIN reaffirmed its commitment to openness by sharing product specifications, standardizing interfaces, and working with partners to establish industry alliances. Leveraging 32-die stacking packaging technology, 4TB and higher capacity Mini SSD variants are already on the roadmap, promising even higher performance and larger storage options.From defining a breakthrough product to building an open ecosystem, BIWIN is steadily transforming Mini SSD from a single innovation into a scalable industry standard. Through continuous technological advancement, open interface standards, and deep scenario enablement, BIWIN will work alongside global partners to convert the vast potential of edge AI into tangible commercial value, accelerating the arrival of the next era of AI hardware.Seminar marks BIWIN's Mini SSD milestone and a new AI-driven storage era. Credit:BIWIN

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has achieved record financial results in 2025 – 97.1467 trillion won in revenue, 47.2063 trillion won in operating profit (with an operating margin of 49%), and 42.9479 trillion won in net profit (with a net margin of 44%).The results significantly exceeded the previous record set in 2024. The annual revenue increased by more than 30 trillion won while the annual operating profit nearly doubled year-on-year, marking the highest annual performance in the company's history.Growth momentum accelerated further in the fourth quarter. In addition to HBM, demand on conventional memory solutions for servers increased sharply, to which SK hynix responded proactively. As a result, the company achieved record-high quarterly performance across all three indicators, with revenue rising 34% to 32.8267 trillion won, operating profit surging 68% to 19.1696 trillion won, and operating margin reaching 58% quarter-on-quarter.SK hynix emphasized that 2025 marked a year in which the company once again demonstrated its world-class technological leadership. In response to an AI-centric demand structure, the company secured both growth and profitability by enhancing technological competitiveness and expanding its portfolio of high value-added products.In the DRAM segment, HBM revenue more than doubled year-on-year, making a significant contribution to the company's record performance. Conventional DRAM entered full-scale mass production of 1cnm process, or the sixth-generation of the 10-nanometer technology. The company also solidified its leadership in server modules, with the development of the 256GB DDR5 RDIMM - a high capacity server module based on 32Gb fifth-generation 10nm-class (1b) DRAM.For the NAND business, despite sluggish demand in the first half, the company completed its development of 321-layer QLC products. SK hynix also achieved the highest annual revenue on record, responding to customer demand centered on eSSD in the second half.The company noted that as the AI market shifts from training to inference while demand for distributed architectures expands, the role of memory will become increasingly critical. Accordingly, not only demand for high-performance memory such as HBM is expected to grow continuously, but also for overall memory products including server DRAM and NAND as well.In response, SK hynix plans to further strengthen its proven quality, technological leadership and mass-production capabilities, based on the customer trust it has secured as the only industry player capable of stably supplying both HBM3E and HBM4 simultaneously. In particular, having successfully completed the preparation stages to mass produce HBM4 - for the first time in the industry - in September last year, the large-scale production of the next-generation HBM has been underway to meet customer requests, the company said.The company also sets to maintain its HBM4 leadership while strengthening customer and partner collaboration to supply optimized products in 'Custom HBM', which continues to gain traction as a key differentiator.For conventional DRAM, SK hynix intends to accelerate the transition to the 1cnm process, expanding its AI memory product portfolio to include solutions like SOCAMM2 and GDDR7. For NAND, the company plans to maximize product competitiveness by transitioning to 321-layer technology, while actively addressing AI data center storage demand by leveraging Solidigm's QLC eSSD.SK hynix stated that it will prioritize meeting customer demand amid supply-demand imbalances by reinforcing partnerships. To this end, the company plans to maximize production capacity of the M15X fab in Cheongju at an early stage. The company also intends to secure stable mid-to-long-term production capabilities through the construction of the first fab in the Yongin Semiconductor Cluster.The construction of the advanced packaging facilities in Cheongju and Indiana, the U.S., are also progressing smoothly. This enables the company to establish integrated global manufacturing capabilities spanning front-end and back-end processes, having able to respond flexibly to changes in customer demand.Meanwhile, backed by record-high financial performance, SK hynix announced a large-scale shareholder return program to enhance shareholder value.The company will deliver an additional dividend of 1 trillion won, equivalent to 1,500 won per share. Combined with the regular quarterly dividend of 375 won, the year-end dividend will total 1,875 won per share, bringing total dividends for FY2025 to 3,000 won per share, or 2.1 trillion won in aggregate.SK hynix also plans to cancel 15.3 million treasury shares (approximately 12.2 trillion won based on the closing price on the 27th) equivalent to 2.1% of total shares outstanding, signaling a long-term commitment to enhance per-share value and shareholder returns.Song Hyun Jong, President and Head of Corporate Center, said that SK hynix will continue to generate sustainable performance growth while maintaining the optimal balance between future investment, financial stability and shareholder returns, based on the company's technological edge. "We will strengthen our role not merely as a product supplier, but as a core infrastructure partner in the AI era, enabling customers to meet their AI performance requirements."4Q25 Financial Results (K-IFRS). Credit: SK hynixFY2025 Financial Results (K-IFRS).Credit: SK hynix

Collaboration combines GUC's ASIC design leadership with Lightmatter's industry-leading 3D CPO platform to redefine AI infrastructure scalability.Lightmatter, the leader in photonic interconnect solutions for AI, and Global Unichip Corp. (GUC), the Advanced ASIC leader and a key enabler for hyperscaler AI infrastructure, today announced a strategic partnership to bring commercial Passage 3D Co-Packaged Optics (CPO) solutions to market.The collaboration integrates Lightmatter's revolutionary Passage photonic interconnect with GUC's state-of-the-art ASIC design services and advanced packaging expertise. This joint solution is specifically engineered to overcome the critical connectivity bottlenecks currently limiting the scaling of next-generation AI and High-Performance Computing (HPC) workloads for the world's largest data center operators."The fundamental architecture of computers is changing. The world has hit a wall in per silicon area performance, the network is becoming the computer, and that network needs to run on light. GUC has unmatched ASIC engineering execution in this rapidly-evolving landscape. Pairing their silicon expertise with our photonic interconnects provides the industry with a concrete path to escape the energy and performance traps of legacy signaling, enabling the massive scale-up required for tomorrow's intelligence," said Nick Harris, founder and CEO of Lightmatter.Redefining AI Interconnect with PassageThe integrated solution will leverage GUC's advanced node chiplet and packaging workflows to incorporate Passage, a silicon photonics-based platform that sets a new standard for AI interconnect performance. Passage delivers unprecedented bandwidth density and power efficiency for XPU and switch chip-to-chip communications, pushing the performance boundaries of world's largest and most complex foundation models.These advantages mark a decisive evolution beyond existing solutions, which are fundamentally constrained by physical I/O limits - or "shoreline" - of the chip, restricting the maximum bandwidth and radix per optical engine (OE). By seamlessly extending the scale-up domain of AI clusters acrossmultiple racks, the Passage platform substantially improves training time and token throughput for the next wave of frontier AI models."To enable our hyperscale customers to deliver the most competitive services, we need partners with proven, superior technology," said Igor Elkanovich, CTO of GUC. "Integrating Lightmatter's Passage CPO platform into our world-class ASIC designs allows us to bring to market a jointsolution that fundamentally redefines AI interconnect. Our combined expertise solves complex challenges - architectural, thermal, mechanical, and signal integrity, and ensures that customers receive a robust, power-efficient, and scalable CPO platform that accelerates their path to large-scaleAI deployment."Analyst Perspective on Market Impact"Optical interconnect is no longer a luxury; it is a necessity for hyperscale AI to continue its exponential growth path," said Dr. Wei-Chung Lo, Deputy General Director at Electronic & Optoelectronic System Research Laboratories (EOSL) of Industrial Technology Research Institute (ITRI), Taiwan. "The combination of GUC's extensive experience in custom AI silicon design for top-tier cloud providers and Lightmatter's innovation signals to the market that the supply chain is maturing, providing a credible blueprint for hyperscalers to address the critical bandwidth and power constraints of the next generation of AI clusters."For more information, visit.

The Seoul Business Agency (Seoul Business Agency (SBA), CEO Hyun Woo Kim), a small business support organization dedicated to revitalizing Seoul's startup ecosystem and discovering promising startups, announced that it held the Global Innovation Forum, the largest country pavilion–led global startup ecosystem networking event at CES, on Wednesday, January 7, the second day of CES.The event marked the first country-based startup competition and networking program at CES. It drew strong attention with a more substantive program than in previous years, through collaboration with seven countries that lead the global startup ecosystem: the Republic of Korea, Taiwan, Switzerland, Israel, Japan, Canada, and France.The Global Innovation Forum began with the goal of using CES, the world's largest exhibition, as a platform to naturally connect startup ecosystems across countries. The initiative was first launched in 2025 under the name "Seoul Innovation Forum," through cooperation among five national pavilions - the Republic of Korea (Seoul), Taiwan, Switzerland, Japan, and the Netherlands - participating in CES. As the first event built on the solidarity of Eureka Park–participating countries at CES, it carried special significance.？A "national pavilion" refers to an exhibition pavilion established and operated by a national institution participating in CES.The success of the Seoul Innovation Forum stemmed from its demonstration of the potential to evolve beyond individual booth exhibitions into a country-to-country cooperation platform, where global national pavilions gathered in one place and representative innovative startups from each country participated in an IR pitching competition. Building on this success, the program was strengthened and rebranded as the "Global Innovation Forum" from 2026, enabling CES-participating startups to experience more stable and expanded opportunities for global collaboration.The 2026 Global Innovation Forum was held based on close cooperation among startup support organizations from seven countries. The event was led by the combined efforts of the host organization, Seoul Business Agency (SBA) of the Republic of Korea, Taiwan Tech Arena (TTA), Switzerland Global Enterprise (S-GE), Israel Economic and Trade Office, Japan External Trade Organization (JETRO), Quebec Government Office of Canada, and Business France.The Global Innovation Forum opened with an IR pitching competition featuring startups selected by each participating country. Following the positive response last year, the competition was held again this year in the same format, with each participating country - the Republic of Korea, Taiwan, Switzerland, Israel, Japan, Canada, and France - selecting outstanding domestic startups to deliver IR pitches to judges and on-site attendees.Going beyond last year's format, which limited judging to global media representatives, this year's competition featured a judging panel composed of both global media and venture capital (VC) professionals. This change expanded investment opportunities for participating companies and enhanced the competition's credibility. Participating startups positively evaluated the event, noting that it enabled them to introduce their technologies to VCs to pursue investment opportunities and effectively promote their products and technologies to global media.A total of 20 global media representatives and six venture capital professionals participated as judges in the IR pitching competition, evaluating the advanced technologies and visions of startups from seven countries based on criteria such as investment attractiveness and global promotional potential.As a result of the competition, the Grand Award (first place) was presented to Firsthabit from the Republic of Korea (Seoul Pavilion). The Scale-up Award (second place) was awarded to Hua Tec International from Taiwan, represented by Taiwan Tech Arena (TTA). The Impact Award (third place) went to CubicSpace from Canada, represented by the Quebec Government Office. The winners received trophies along with prize money of USD 3,000, USD 2,000, and USD 1,000, respectively.Firsthabit, a company from the Seoul Integrated Pavilion that won the Grand Award, said, "We did not expect to win, so this feels like a great reward for all the hard work we have put in. With CES 2026 and the Global Innovation Forum award as a turning point, we plan to seriously pursue entry into the U.S. market."Even startups that did not receive awards shared positive feedback, saying, "The Global Innovation Forum was a place where startups with diverse cultural and technological backgrounds came together to share insights and strengthen their determination to open global market channels."The panel discussion that followed featured representatives from participating countries who introduced their respective startup support programs and discussed agendas for the global startup ecosystem. It was a meaningful occasion where the nurturing know-how of organizations that have led the global startup ecosystem by showcasing innovative startups at CES each year was shared in one place.The significantly strengthened networking session compared to previous years also stood out. In addition to judges, global venture capital firms, media, startups, and startup support organizations visiting CES participated, creating a lively exchange and reinforcing the event's status as the largest global networking program at CES.During the networking session following the competition, participants freely exchanged views and shared insights on key issues in the tech industry. Startups attending the event welcomed the opportunity to connect with major players in the startup ecosystem and expressed plans to actively leverage the networks formed that day as a bridge to attract investment and enter global markets. This moment demonstrated that the event meaningfully contributed to enhancing the outcomes of startups' CES participation.In addition, startups that wished to do so were given the opportunity to take the stage for a one-minute PR speech, effectively introducing their innovative technologies to stakeholders across the startup ecosystem. This element also received high praise.Hyun Woo Kim, President and CEO of the Seoul Business Agency, said, "We hope the Global Innovation Forum will establish itself as a symbolic program representing cross-country cooperation and global startup exchange within CES." He added, "We will continue to develop the forum so that it becomes the most closely watched event by all players in the global startup ecosystem visiting CES, including media, venture capital firms, startups, and national pavilion representatives."

The Ministry of Economic Affairs (MOEA) officially announced the launch of the 2026 Best AI Awards during a press conference held on January 20, 2026. This prestigious competition serves as a strategic platform to bridge Taiwan's software innovation with its world-class semiconductor industry, aiming to solidify the nation's position as a global hub for artificial intelligence.Championing the Next Wave: Agentic AISpeaking at the launch, Director General Kuo Chao-Chung of the Department of Industrial Technology highlighted a pivotal shift in the industry. "AI is moving beyond traditional discriminative and generative models toward 'Agentic AI' - autonomous systems capable of independent planning, reasoning, decision-making, and task execution," Kuo stated. To encourage this evolution, the 2026 awards will prioritize projects focusing on Agentic AI and AI model lightweighting, ensuring that software solutions are both intelligent and hardware-efficient.Competition Highlights and Incentives The 2026 Best AI Awards are divided into two primary tracks: AI Applications and IC Design. Registration is open from now until March 16, 2026, with the final competition set for April 25, 2026.Financial rewards are substantial, with corporate winners eligible to secure up to NT$1 million. Student teams also have significant incentives, with potential prizes reaching up to NT$300,000.Beyond direct cash prizes, winning Taiwanese companies benefit from enhanced R&D support, receiving an additional 10% subsidy bonus when applying for the "A+ Industrial Innovative R&D Program." Furthermore, these awards serve as a springboard for startup growth by providing domestic winners with priority access to the Startup Terrace Kaohsiung.International teams and global companies are incentivized through specialized support designed to integrate them into Taiwan's technology ecosystem. In addition to competing for the top cash prizes, winning global entities receive streamlined eligibility for Taiwan’s Employment Gold Card, as well as priority access to Startup Terrace Kaohsiung to support residency applications. These benefits are designed to facilitate global talent recruitment while enabling international startups and professionals to establish operations, scale their businesses, and build a long-term presence in Taiwan.Finalists gain valuable market exposure by being showcased at major international platforms such as InnoVEX. This placement is intended to facilitate critical business matching and attract potential investment from global stakeholders in the AI and semiconductor industries.A Proven Track Record of SuccessThe inaugural edition of the awards attracted over 1,000 teams and has already yielded significant commercial results. Previous winners, such as Zhen-Sheng Semiconductor and ProsperX Medical Technology, have successfully raised NT$180 million and NT$100 million respectively following their participation. Established firms like Etron Technology also reported that the awards significantly boosted their visibility among global system manufacturers.The MOEA invites students, startups, and established enterprises to showcase their innovations and join Taiwan's thriving AI ecosystem. By fostering a "Software-Hardware Synergy," Taiwan aims to redefine the global semiconductor supply chain through AI-driven intelligence.For more information on registration and competition guidelines, please visit the official website or follow the official LinkedIn page for the latest updates.

MOSS is an AI-assisted digital audio workstation designed to make professional-quality music production more accessible - without replacing the artist.While more people than ever are creating music, production remains a major barrier. Traditional DAWs demand years of technical expertise, complex plugin workflows, and interfaces that have changed little over the past two decades. For many musicians, these challenges prevent ideas from ever becoming finished songs."Making great music shouldn't be bound to years of expertise or expensive studios," says Hansol Sohn, CEO of MOSS.To address this, MOSS embeds an AI co-producer directly into the DAW workflow. Rather than generating music autonomously, the system focuses on assistance. It analyzes musical context - including genre, arrangement, and sonic balance - to support decisions such as sound selection, mix balance, effect configuration, and mastering chains. Creative control always remains with the artist.Technically, MOSS combines a modern multi-track audio engine with real-time signal processing and AI-driven decision support. The AI layer translates musical intent into production-ready settings, helping creators achieve consistent, release-ready results without deep engineering knowledge.Built for professional musicians, students, hobbyists, and first-time creators alike, MOSS lowers the technical barrier to music production and enables more artists to finish, share, and release their work.As AI continues to reshape creative tools, MOSS positions itself as a human-centered alternative - using intelligence to enhance the creative process rather than automate it.