NewPower Worldwide, a leading independent distributor of electronic components and supply chain management solutions, today announced an expansion of its committed credit facility to $500 million, strengthening the company's ability to respond quickly to evolving market dynamics and meet customers' ever？changing needs.The expanded facility underscores strong lender confidence in NewPower Worldwide's operational excellence, financial discipline, and ability to move decisively in rapidly shifting global markets."This expanded credit facility gives us the financial flexibility to execute deals of any scale at the pace our customers require," said Carleton Dufoe, Chief Executive Officer of NewPower Worldwide. "Our customers need partners who can move fast, adapt to change, and deliver consistent results. This additional capacity ensures we can meet those demands every time.""Our continued partnership with NewPower reflects our confidence in their ability to support customers through dynamic market conditions," said Jason Upham, Senior Vice President at Citizens. "Our team led a new credit facility that will give NewPower the agility and resources needed to deliver solutions that align with their customer's supply goals and timing."This increased capacity provides NewPower Worldwide the financial strength and flexibility to execute deals of any size with speed and consistency. It enables the company to align seamlessly with its customers' pace, delivering tailored supply solutions that help them maintain stability, adapt quickly to market changes, and move forward with confidence.
In Taiwan's older urban neighborhoods, five- or six-story walk-ups are common. For elderly residents living with chronic conditions such as diabetes, even a routine hospital visit can become a grueling physical ordeal - often requiring the assistance of family members or caregivers. This simple yet often overlooked reality became the catalyst for a major innovation in AI-powered healthcare.A group of international Ph.D. students at Taipei Medical University (TMU), known as the TSY-AI Team, set out to address this pain point. Their goal was clear: to bring diagnostics directly into people's homes. This result is a disposable, AI-integrated biosensor system capable of measuring blood glucose and pH levels with just a drop or two of blood - and delivering results in under 10 minutes, all without the need to leave the house. This groundbreaking platform recently earned the team the Bronze Medal at the 2025 Best AI Awards, hosted by Taiwan's Ministry of Economic Affairs. "We're not just building a chip. We're building a full platform," says Asaduzzaman, the team's representative and a Ph.D. candidate from Bangladesh. "Something that supports long-term chronic care while reducing unnecessary hospital visists.”At the core of the platform is the 3DISFETCHIP, a three-dimensional ion-sensitive field-effect transistor (3D ISFET) engineered to capture biochemical data from just minimal blood samples. The chip, housed in a disposable microfluidic chamber, connects to a mobile app that displays blood glucose and pH results within 10 minutes.But the innovation doesn't stop there. The system also incorporates AI-powered image recognition, enabling patients to photograph wounds - such as diabetic foot ulcers - and receive real-time analysis of healing progress. Over time, this feature allows doctors to remotely track wound recovery without requiring in-person visits."I saw the announcement for the Best AI Award in the newspaper," recalls Asaduzzaman. "We had just finished the core development work for our biosensor and thought - why not apply?""But for us, it wasn't about the competition," he adds. "It was about sharing our idea with Taiwan's AI and healthcare communities. We wanted to show students, researchers, and industry leaders that AI medical devices can be both simple and impactful."The response from the event was overwhelming. Visitors from the medical device industry expressed surprise at the product's affordability and ease of use. Some even opened conversations about future partnerships.With product development progressing, the TSY-AI Team is now evaluating Taiwan as a long-term base for commercialization."Taiwan has world-class semiconductor capabilities, and the startup ecosystem here is extremely welcoming," Asaduzzaman explains. "We've spoken with major players like Wistron, as well as smaller chip manufacturers, all of whomare very open to supporting medical AI solutions like ours."In addition to hardware partnerships, the team has also initiated collaboration with local hospitals. They have completed preliminary testing with animal models and controlled human samples, and are currently preparing to apply forInstitutional Review Board approval. Clinical trials are planned with Taipei Medical University Hospital and Shuang Ho Hospital.While the current system focuses on glucose and pH monitoring, the team is actively expanding its biomarker detection capabilities. Plans are underway to incorporate inflammation markers, HbA1c, and early indicators of infection - all from the same minimal blood sample."We want to turn this into a multi-analyte health platform that gives both patients and doctors a comprehensive view of physical conditions from home," says Asaduzzaman. "I believe the future of medical diagnostics is home-based. Patients shouldn't need to visit hospitals every week just to monitor chronic conditions. They should be able to do it easily, safely, affordably, and accurately from home."TSY-AI Team won the Broze Award in the International Group IC Design Category at the 2025 Best AI Awards. If you have innovation would like to present, 2026 Best AI Awards with global tracks open for both AI Applications and IC Design, students and companies worldwide can compete for the grand prize of up to USD 30,000 (NTD 1,000,000). The deadline is March 16, 5:00pm (GMT+8). For more details, please follow official Linkedin for the lastest updates.
Intelligent Asia Thailand 2026, Southeast Asia's leading B2B platform for PCB manufacturing and industrial automation, will take place from 11 to 13 March 2026 at Event Hall 98, BITEC, Bangkok. The exhibition brings together global technology providers and regional manufacturers seeking to enhance efficiency, precision, and production flexibility, offering a unique gateway to the region's rapidly evolving electronics and smart manufacturing market.Thailand's electronics and smart manufacturing sector is expanding rapidly. In 2025, foreign direct investment in the country reached 324 billion THB (approximately USD 10.5 billion), a 42% increase compared with the previous year. While the semiconductor industry remains at an early stage, the country already demonstrates strong potential due to advanced infrastructure, skilled talent, a business-friendly environment, and integrated downstream supply chains. These conditions make Intelligent Asia Thailand 2026 a timely platform for connecting with key stakeholders and exploring growth opportunities.According to the Board of Investment (BOI), between 2018 and November 2025, investment promotion applications in the electronics and electrical sector totaled 1.17 trillion THB(USD 37 billion) across 1,748 projects. This accounted for 19% of total promoted investments, making electronics the sector with the highest investment volume. Growth was driven primarily by printed circuit boards, semiconductor packaging and testing, hard disk drives and components, as well as electronic parts for automotive, medical, telecom, and smart electronics manufacturing - further underscoring the importance of this industry in Southeast Asia's economic development.Positioned at the intersection of electronics manufacturing and smart automation, Intelligent Asia Thailand 2026 features strong participation from Taiwan's semiconductor and PCB supply chain leaders expanding into Southeast Asia. Visitors can discover cutting-edge technologies, forge regional partnerships, and seize emerging business opportunities across Thailand and neighboring countries. Covering 10,000 sqm with over 310 exhibitors, the event is organized by Yorkers Trade & Marketing Service Co., Ltd., Messe Frankfurt (HK) Ltd, Taiwan Branch, and GMTX Company Limited.Dual Focus: PCB Thailand and Automation ThailandThe exhibition is structured around two core pillars - PCB Thailand and Automation Thailand - providing a comprehensive platform where electronics manufacturing and smart automation converge. Exhibitors showcase end-to-end solutions spanning advanced PCB materials, precision processing, surface treatment, inspection systems, robotics, motion control, factory automation, and digital management. These technologies enable manufacturers to optimize production efficiency, enhance quality control, and respond flexibly to evolving market demands. FeaturedExhibitors and Technologies:PCB & Advanced Electronics Manufacturing Atotech(Thailand) – Surface treatment, plating, and finishing solutions for electronics and industrial applications.Hunson – Industrial cameras, AOI inspection systems, sensors, and machine vision solutions. Jiangsu Ysphotech – High-performance integrated circuit equipment and solutions. Nano Electronics & Micro System Technologies – Plasma etching, drilling, and cleaning machines for HDI/ABF PCBs.PATA Chemicals & Machinery – Tailored chemicals and process support for plating and surface treatment. Qnity – Advanced connectivity materials for flexible, rigid-flex, and rigid PCBs. SCREEN GP Thailand – PCB production systems: imaging, miniaturization, energy-efficient solutions. Schlötter Asia – Specialty electroplating chemicals and surface finishing solutions.Automation, Robotics & Industrial ControlAuer Signal – Smart signaling devices for industrial automation, real-time status visualization, predictive maintenance. DEEP Robotics – Quadruped robots for inspection, rescue, and industrial applications. FINERN – Automation and intelligent measurement systems for automotive, electronics, and healthcare. MRDVS Technology – AI-powered 3D robot cameras and navigation modules for AMRs and AGVs. Smart Motion Control – Motion control products: servo motors, drivers, amplifiers, PC-based controllers. TJ Solutions – Automation and QC measurement solutions with application-based consulting. Weldex – High-efficiency welding and cutting solutions with German/US technology support. Wieland Electric Singapore Pte. Ltd. – Scalable industrial safety solutions: sensors, relays, safety controllers.Manufacturing Infrastructure & Supporting TechnologiesEVERBIZ Industrial – Customized wiring solutions for automotive, electronics, and industrial applications. Long Long Clean Room Technology – Dust-free and sterile cleanrooms for semiconductor, medical, and precision industries. Molding Innovation Technology （Minnotec） – Smart mold and plastic injection solutions for Southeast Asia. Taiwan Grace – High-efficiency industrial filter cartridges, media, and housings. Thai Murata – Ceramic passive components, wireless modules, and power conversion technologies. Factory Max – 3D scanning, motor spindles, and advanced manufacturing solutions. Software & Digital Manufacturing SolutionsData Systems – Digiwin ERP and sMES for manufacturing management, IoT integration, and production optimization. Xian Jin Trading – CAD/CAM/CAE software solutions for design, engineering, and manufacturing.Technical Forums and Industry SeminarsIn parallel with the exhibition, a three-day seminar and management forum program offers actionable insights and practical guidance for manufacturing transformation:Day 1(11 March 2026): Opening Ceremony and Management Forum on Thailand's manufacturing strategy in Southeast Asia, with sessions on AI-driven quality improvement and smart factory maintenance systems.Day 2 (12 March 2026): AIoT and EDGE technologies in modern manufacturing, smart factory integration, and next-generation PCB processes.Day 3(13 March 2026): Dedicated PCB Seminar, KAIZEN-based manufacturing excellence, and strategies for high-value electronic component production.These sessions are designed for engineers, plant managers, system integrators, and business decision-makers seeking practical strategies to optimize production efficiency, quality control, and smart manufacturing capabilities. Coupled with the country's growing electronics investment, participants can gain insights aligned with Southeast Asia's dynamic industry trends.Why Attend Intelligent Asia Thailand 2026Gain first-hand access to the latest PCB and automation technologies, connect directly with industry-leading suppliers, and acquire actionable knowledge to enhance efficiency, quality, and production flexibility. Don't miss the opportunity to explore business potential in Thailand's expanding electronics sector. Register now for free visitor access: website.Credit: Intelligent Asia ThailandCredit: Intelligent Asia ThailandCredit: Intelligent Asia Thailand
Today, an increasing number of scientific papers, media repoerts, and television health programs - highlighting the increasing incidence of heart attacks and strokes. What is often overlooked is that a large portion of these cases are linked to atrial fibrillation (AF). In fact, AF is associated with more than 80% of strokes and heart attacks, and it significantly increases both the risk of having a stroke and the risk of dying from it.Even more alarming is the fact that most people with AF are unaware they have it. Current statistics indicate that only around 30% of individuals with AF know about their condition, meaning millions of people worldwide are living with an undiagnosed, potentially life-threatening heart rhythm disorder.That is the reality that EDABK from Vietnam set out to change. Rather than relying on bulky ECG monitors or expensive medical devices, the team developed a low-power edge AI chip that could be embedded into the smartwatches and other wearables devices already used in daily life. Their innovation, which won a Silver Medal at Taiwan's 2025 Best AI Awards, is a signal of where healthcare is headed: real-time, always-on, and hyper-personalized. "We chose to focus on atrial fibrillation detection because we saw a real, unmet need - one that current solutions haven't adequately addressed," said Nguyen Duc Minh, representative of Team EDABK. "We wanted to make AF monitoring accessible, low-cost, and capable of running entirely on a chip, without relying on the cloud."AF is typically detected through electrocardiograms (ECGs), which requires hospital visits and professional equipment. EDABK's idea was to use photoplethysmography (PPG) - the same light-based technology found in off-the-shelf wearables. While PPG data is noisier than ECG, the team developed a processing pipeline that enables reliable AF detection.They began with preprocessing and quantization of the raw PPG signal, followed by a novel Pi-K Plot technique to extract irregularities in heart rhythm. These signal is transformed into spikes and fed into a Spiking Neural Network (SNN) - a brain-inspired AI architecture optimized for low power consumption and low latency.SNNs represent a fundamental shift in how AI operates. Instead of running continuous computations, they activate only "spike" when meaningful data appears, mimicking the behavipr of biological neurons. This event-driven architecture allows AI to run in real-time on small chips, using a fraction of the energy required by traditional neural networks. "Our model reduces RAM usage by more than 80%, while still detecting early warning signs of AF in real time," Minh explained. "It's built for wearables - devices with tight constraints on battery life, processing power, and form factor."The improvement is enormous, with no reliance on cloud services, users receive faster feedback, enhance privacy, and a more seamless user experience. And because the chip behaves like standard memory, it can also be easily integrate into commercial hardware.While still based at a university, EDABK is actively working with local partners to collect clinical data and validate the model beyond the laboratory. The team is already planning a smart ring prototype, complete with PPG sensors and wireless connectivity to deliver alerts directly to a smartphone.Beyond AF, the system's architecture is modular and generalizable. The SNN core and its toolchain can be retrained to detect other heart rhythm disorders or physiological abnormalities - simply by introducing new datasets and adjusting design goals."Our roadmap includes expanding detection to multiple arrhythmias, not just AF," Minh said. "The goal is to build a scalable platform that enables proactive health monitoring in daily life."For Team EDABK, the Best AI Awards did more than validate their work - it opened a new chapter. "We were amazed by how advanced Taiwan is - not just in chip design, but in edge AI innovation at the silicon level," Minh noted. "Some of our members are now considering graduate studies in Taiwan to take our work even further."This experience has also sparked early discussions around potential commercialization in Taiwan, where the supply chain for AI chips and medical wearables is already world-class.As wearable adoption continues to accelerate globally - forecasted to exceed 1.2 billion devices in use by 2028 - solutions like EDAB's EADK's point to a future where AI does not simply reside in the cloud, but operated quietly in the background of everyday life, watching for the warning signs users may not feel."We're not just building a device," Minh said. "We're building a safety net - one that helps users become aware of silent health threats before they become emergencies." In a world where heart disease remains the leading cause of death, that safety net cannot arrive soon enough.EDABK won the Silver Medal in the International Group IC Design Category at the 2025 Best AI Awards. Now it's your chance to shine - bring your innovation to the world and apply for the 2026 Best AI Awards! With global tracks open for both AI Applications and IC Design, students and companies worldwide can compete for the grand prize of up to USD 30,000 (NTD1,000,000). The deadline is March 16, 5pm (GMT+8), follow offcial Linkedin for the latest updates.
Luna, the health-tech company behind the Luna Ring today announced the launch of LifeOS V1, a foundational upgrade to the Luna Ring that introduces one of the first truly vertically integrated AI systems designed to unify the full spectrum of personal health data into a single, intelligent interface. LifeOS brings together wearable biometrics, nutrition, supplements, medication history, medical reports, reproductive health signals, workouts, environmental context, and recovery behavior, transforming fragmented inputs into clear, meaningful insight that users can understand and act on instantly.This release represents a critical step toward Luna's long-term vision of building a context-first health intelligence system, one that moves beyond passive tracking to help individuals understand why their body responds the way it does, and how daily behaviors shape recovery, resilience, and performance over time."Until now, health data has existed in silos: wearables in one place, nutrition in another, medical history somewhere else. LifeOS is designed to unify this complexity and translate it into simple, human-readable understanding. Our goal is not just to track health, but to bring clarity to it."Unlike clinical or diagnostic systems, LifeOS is not a medical product. Instead, it is designed to help users recognize how small, everyday choices: what they eat, how they move, how they sleep, and how they recover - collectively influence the body's long-term response and healing capacity.With LifeOS V1 now live, Luna begins the next phase of its roadmap toward real-time, context-aware health guidance, powered by continuous biomarker intelligence and adaptive AI. This is like an advanced version of ChatGPT for health which knows your body 24*7.Availability LifeOS V1 is rolling out starting today to Luna users via the latest version of the Luna app.
Teamsworld Innovation Inc. announced its AI-powered manufacturing matchmaking platform, targeting multinational enterprises seeking to diversify supply chains. The platform connects clients with precision component manufacturers in Taiwan and mass production facilities in Vietnam, addressing information gaps and geopolitical risks in cross-border sourcing. The digital platform serves companies implementing "China Plus One" strategies. Teamsworld combines Taiwan's research and development capabilities with Vietnam's cost advantages, providing sourcing solutions for mechanical components from prototype development to mass production with supply chain transparency and flexibility.AI-Driven Manufacturing SupportThe platform digitalizes traditional procurement processes using artificial intelligence. The system analyzes materials and geometric tolerances while incorporating Design for Manufacturing (DFM) experience to optimize production paths during early development stages. Company data indicates the platform helps clients increase production efficiency by 25% and reduce research and development costs by up to 40%. A cloud-based dashboard offers global clients real-time visibility into production status, fostering seamless cross-border collaboration while significantly lowering overhead.Taiwan-Vietnam Dual-Hub Model"In today's volatile global landscape, manufacturing has evolved from a race on price to a test of resilience," said Vincent Lin, CEO of Teamsworld. "We aren't just a matchmaking platform; we are a strategic partner. By integrating Taiwan's advanced R&D with Vietnam's cost-effective production, we empower enterprises to navigate the entire lifecycle from prototype to mass production with unparalleled agility."Specialized Thermal Management Solutions for EV and 5G MarketsTeamsworld has developed technical capabilities in thermal management for high-power consumption and harsh environment applications. The company provides precision thermal enclosures for electric vehicle battery management systems, 5G communication base stations, and industrial automation equipment. Production processes integrate over 50 techniques, including aluminum die casting and injection molding, with assembly services spanning thermal bases to protective enclosures. Further information is available at official website.
XTPL (WSE:XTP), a developer of Ultra-Precise Dispensing (UPD) technology for nanomaterial deposition, has entered a strategic partnership with Manz Asia to support the development and commercialization of advanced semiconductor packaging applications.Under the partnership, XTPL will install a Delta Printing System in Manz Asia's Semiconductor Innovation and R&D centre in Taoyuan, Taiwan, establishing a local capability for process development, testing, and validation. The facility will enable customers to evaluate specific applications and establish a pathway from prototype development to volume production.The partnership combines XTPL's proprietary dispensing technology with Manz Asia's expertise in advanced semiconductor manufacturing systems and process development. The collaboration will focus on joint engagement with third-party customers and the evaluation of application-specific commercial opportunities.XTPL's UPD technology enables highly controlled deposition of functional nanomaterials with feature sizes ranging from tens of micrometres down to below one micrometre. The technology is already qualified for high-volume production in display applications and is currently being evaluated for additional applications in advanced electronics, including inline manufacturing, multichip module packaging, and advanced electronic structures."I am delighted to start the partnership with Manz Asia - a company with a strong position and deep expertise in the semiconductor industry in Taiwan and Asia. It is only natural for us to work side by side with a partner who knows this ecosystem from the inside.The synergy between XTPL's unique ultra-precise dispensing technology and Manz Asia's competencies in advanced semiconductor packaging is a natural fit. That is precisely why I am confident this collaboration will translate into tangible business opportunities for both sides.," said Filip Granek, CEO of XTPL.Robert Lin, CEO of Manz Asia, added: "This strategic partnership with XTPL expands our printing capabilities into ultra-precise material deposition, enabling a wide range of advanced semiconductor applications. The technology supports both conductive and non-conductive materials across 2D, 2.5D and 3D substrates in diverse manufacturing scenarios.By combining XTPL's dispensing technology with Manz's automation and process integration expertise, we broaden our portfolio and provide more flexible manufacturing solutions, helping customers accelerate innovation and move efficiently from prototype to volume production."
Seoul, February 26, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) and Sandisk Corporation held 'HBF Spec. Standardization Consortium Kick-Off' event at Sandisk Headquarters in Milpitas, California on the 25th(local time) announcing global standardization strategy of next-generation memory solution HBF(High Bandwidth Flash) aimed at the AI inference era.SK hynix said, "By making HBF an industry standard, together with Sandisk, we will lay the foundation for the entire AI ecosystem to grow together. A dedicated workstream under OCP1 will be launched with Sandisk to begin standardization work."Recently, the AI industry is shifting from training which focuses on creating Large Language Models (LLMs) to inference, which accelerates actual AI services to users.Fast and efficient memory is essential as the number of users using AI services increases rapidly. However, the existing memory structure cannot meet the high capacity data processing and power efficiency at the same time in the inference stage and HBF technology is designed to address these limitations.HBF technology is a new memory layer between ultra-fast memory, HBM and high-capacity storage device, SSD. HBF technology can fill the gap between HBM's high performance and SSD's high capacity and ensure both capacity expansion and power efficiency required for AI inferencing. While HBM handles the high level bandwidth, HBF technology serves as a supporting layer in the architecture.In particular, HBF technology is expected to reduce the total cost of ownership (TCO) while increasing the scalability of AI systems. The industry forecasts that the demand of complex memory solutions, including HBF, will pick up around 2030.In the AI inference market, the role of a total memory solution company that can provide both HBM and HBF is becoming more important as system level optimization of CPU, GPU, and memory determines the overall competitiveness rather than the performance of a single chip.In line with this, SK hynix and Sandisk are proactively pursuing HBF solution's standardization and commercialization based on their design, packaging and mass production experience in HBM and NAND."The key to AI infrastructure is to go beyond the performance competition of individual technologies and to optimize the entire ecosystem," said, Ahn Hyun, President and Chief Development Officer. "Through HBF technology standardization the company will establish a cooperative system and present an AI-era optimized memory architecture to create new value for customers and partners."
Artificial Intelligence Industry Exhibition (hereinafter, AI EXPO KOREA 2026) - the largest AI exhibition in Asia, presenting a comprehensive view of the present and a blueprint for future industries - will be held for three days from May 6 to 8 at COEX Hall A (entire 1st floor) in Samseong-dong, Seoul.First launched in 2018 to foster the domestic AI ecosystem and promote the development and activation of the AI industry, AI EXPO KOREA 2026 marks its 9th edition this year. The event is jointly organized by the Korea Artificial Intelligence Association, Seoul Messe, and AI Newspaper. Over the years, the exhibition has established itself as a leading platform that diagnoses the current state of AI and presents future directions, functioning as a venue where the latest AI technologies and real-world business applications can be directly experienced while relevant information and insights are actively shared.Scenes from AI EXPO KOREA 2025 held last year. Credit: AI EXPO KOREA 2026In particular, it has firmly positioned itself as a practical forum where companies and institutions across diverse industries plan and design strategies in response to the AI era, playing a pivotal role in shaping the domestic AI ecosystem and advancing industrial development. It is widely recognized as the largest and most authoritative AI event in Asia in both name and substance.At the 8th edition held last year, 322 companies and institutions from 18 countries, including the United States and Canada, participated with a total of 544 booths. Over the three-day event, 43,788 visitors and buyers attended, proving its status as a premier standalone AI exhibition. Building on this success, AI EXPO KOREA 2026 is expected to be held on an even larger scale with more diverse content. The organizers anticipate participation from approximately 350 companies from around 20 countries with a total of 600 booths, setting a new record as the largest edition to date.If 2025 marked the era of "thinking machines" driven by generative AI, we are now entering the era of "moving intelligence," namely the age of Physical AI. The AI industry is expected to experience explosive growth centered on AI Agents capable of autonomously performing personalized tasks, increasingly sophisticated and versatile Large Language Models (LLMs), and the powerful AI infrastructure that supports all of these technologies. Furthermore, as AI expands beyond the digital world to directly interact with the physical world through robots, autonomous driving, smart devices, and industrial automation systems, Physical AI is rapidly reshaping the very structure of industries and daily life. AI EXPO KOREA 2026 will spotlight these key trends and provide visitors with an opportunity to experience the forefront of AI technology.Moving beyond simple chatbots, AI Agent technologies that understand user intent and autonomously plan and execute complex tasks are transforming paradigms across industries. In particular, these AI Agents are no longer confined to software environments but are expanding into Physical AI that acts directly in the real world through integration with robotics and autonomous systems. This exhibition will showcase a wide range of AI Agent solutions and real-world applications across fields such as personal assistants, smart home control, industrial automation, customer service innovation, robotics, and autonomous systems. Visitors will be able to directly observe how AI Agents maximize work efficiency and create entirely new user experiences.Represented by LG EXAONE, Solar, A.X K1, OpenAI's GPT series, Google's Gemini, Meta's LLaMA, Hangzhou DeepSeek, and Qwen, LLMs have evolved into multimodal systems capable of generating not only images but also videos, demonstrating increasingly creative and advanced task execution capabilities. These LLMs go beyond simple content generation and, when combined with robotics, serve as the "brains" of Physical AI by directing and controlling physical actions. At AI EXPO KOREA 2026, the latest LLMs developed by leading domestic and international companies, along with various application services and industry-specialized LLM solutions, will be presented through live demonstrations. In particular, in-depth discussions are expected on the ethical use of LLMs, data security, and technologies for model lightweighting and optimization.Above all, establishing AI strategies requires more than simply selecting a model; it demands solutions that can fine-tune models for specific use cases and efficiently manage the substantial costs associated with AI deployment and operation. Accordingly, this exhibition will introduce comprehensive AI infrastructure technologies and solutions, ranging from AI chips and accelerators to storage, AI servers, various edge devices and computing, HPC, cloud, and data centers. Key discussion topics will include robotics computing for the Physical AI era, real-time sensor processing, on-device AI, and low-latency edge infrastructure. On site, a series of solutions and demonstrations will illustrate practical strategies for how AI infrastructure and on-device AI enable AI to interact with our daily lives, industries, and businesses from the perspective of AI convergence and real-world application.In addition, the exhibition will provide a comprehensive overview of core infrastructure technologies and solutions for AI development and operations, including data collection, processing, and analytics platforms, as well as automation tools for AI model training and deployment. Domestic and international semiconductor companies, data center solution providers, and cloud service companies will present their latest technologies, showcasing hardware and software competitiveness for the AI era.Ultimately, AI EXPO KOREA 2026 will go beyond a simple technology and industry exhibition to serve as a venue that presents concrete answers to the business innovations and industrial transformations driven by AI. Participating companies will showcase their AI technologies and solutions to discover new business partners, while visitors will gain the latest information and valuable insights on strengthening competitiveness through AI adoption and securing future growth engines.Detailed information can be found on the official website.
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced it has successfully taped-out industry-leading, Universal Chiplet Interconnect Express. (UCIe.) IP, achieving a data rate of 64 Gbps per lane, the highest speed defined in the UCIe specification. The 64G UCIe IP, supporting UCIe 3.0, delivers an impressive bandwidth density of 21 Tbps per 1 mm of die edge (10.5 Tbps/mm full-duplex). This milestone was achieved using TSMC's advanced N3P technology and CoWoS advanced packaging, typically leveraged by AI, high-performance computing (HPC), datacenter and networking applications.To ensure seamless system integration, GUC has developed bridges for AXI, CXS, and CHI buses utilizing the UCIe Streaming Protocol. These bridges are optimized for high traffic density, low power consumption, minimal data transfer latency, and efficient end-to-end flow control – enabling a seamless transition from traditional single-chip Networks-on-Chip (NoC) to chiplet-based architectures. Additionally, the bridges support Dynamic Voltage and Frequency Scaling (DVFS), allowing real-time voltage and frequency adjustments independently for each die withoutinterrupting data flow.GUC's UCIe IP also features advanced reliability capabilities, including UCIe Preventive Monitoring functionality and integrated I/O signal quality monitors from proteanTecs. This technology enables continuous, mission-mode monitoring of signal integrity during data transmission without the need for re-training or disrupting operations. Each signal lane is individually monitored, with real-time detection of power and signal integrity anomalies. Potential defects in bumps and traces are identified early, triggering repair algorithms that replace marginal I/Os with redundant ones to prevent system failures. This proactive approach significantly extends chip lifespan and enhances system reliability."We are fully committed to delivering the highest performance and lowest power 2.5D/3D chiplet and HBM interface IPs on TSMC's advanced process and packaging technologies," said Igor Elkanovich, CTO of GUC. "The convergence of 2.5D and 3D packaging technologies, leveraging HBM3E/4/4E, UCIe-A, and UCIe-3D interfaces, enables the development of highly modular processors that exceed reticle size limitations, paving the way for the next generation of highperformance computing. Our strong collaboration with TSMC and its Open Innovation PlatformR (OIP) ecosystem is enabling our customers to accelerate time-to-market in today's AI-driven competitive market."Click here for more information.GUC UCIe 64G IP Highlights. Credit:Guc
