SK hynix Inc. (or "the company", www.skhynix.com) announced on December 7, 2025, that it has been named the winner of the Best Financially Managed Semiconductor Company Award(Achieving Greater than $1 Billion in Annual Sales) and the Outstanding Asia-Pacific Semiconductor Company Award at the Global Semiconductor Alliance(GSA) Awards 2025, held on December 4 PST in Santa Clara, California.The GSA Awards, organized annually since 1996, are regarded as the most prestigious honors in the global semiconductor sector, recognizing outstanding performance in leadership, financial results and industry reputation. SK hynix secured its second win in the financial management category following 2017, and its first recognition as the top Asia-Pacific semiconductor company. The dual achievement reinforces the company's reputation as a leading global technology innovator.While the semiconductor industry faced a severe downturn just two years ago, the company has been the fastest to rebound thanks to its advanced AI memory technologies including HBM. This performance has resulted in global recognition for its operational excellence and financial execution. SK hynix plans to continue building sustainable growth with its dominant leadership in the AI memory market.The awards reflect the company's proactive delivery of groundbreaking HBM solutions and its steadfast commitment to customer-centric performance in surging global AI demand. SK Chairman Chey Tae-won has consistently emphasized that securing technological competitiveness must remain unwavering, especially during challenging times. This long-term focus on technology investment and global cooperation network has contributed to the company's improved performance and reinforced financial health.Driven by this strategy, SK hynix has recorded historic performance throughout 2025. For the first three quarters, the company reported revenue of 64 trillion won and operating profit of 28 trillion won in total, positioning it well to surpass its previous full-year earnings record set in 2024(66 trillion won in revenue and 23 trillion won in operating profit).Financial health has also significantly strengthened. As of the end of the third quarter, cash and cash equivalents reached 27.9 trillion won, up 10.9 trillion won quarter-over-quarter, while interest bearing debt decreased to 24.1 trillion won— successfully transitioning into a net cash position of approximately 4 trillion won.To secure long-term leadership in AI memory, SK hynix is accelerating major investments. The Cheongju M15X fab, which opened its cleanroom earlier than planned in October, is on track to begin HBM mass production in the first half of next year. Construction of the first fab in the Yongin Semiconductor Cluster, launched in February, is also progressing ahead of schedule.With its recent financial achievements and continued expansion, SK hynix is expected to further solidify its AI memory leadership going forward.SK hynix was represented at the ceremony by Justin Kim, President & Head of AI Infra at SK hynix, and Sungsoo Ryu, President of SK hynix America. "It is a great honor to receive this award." Kim said, "We will continue to lead the market and create new value for customers as a Full-Stack AI Memory Creator, driving growth across the global AI ecosystem."
In 2025, LitePoint, a global leader in wireless testing solutions, hosted its "Smart Connectivity Unbounded · Testing Drives the Future" Innovative Testing Technology Seminar in Hsinchu and Taipei on September 23 and 24. This year’s event spotlighted cutting-edge testing and verification methods for diverse wireless communication technologies, setting new benchmarks for user experience and underscoring the transformative impact of wireless innovation.The seminar opened with a keynote address by Glenn Farris, LitePoint's Vice President of Global Sales, who warmly welcomed attendees and shared an overview of the latest advancements in testing technology. As a pioneer in wireless testing, LitePoint continues to deliver solutions that are fully connected, highly intelligent, and strongly compatible, enabling enterprises to overcome complex testing challenges and capitalize on emerging opportunities.Following this, Adam Smith, LitePoint's Vice President of Marketing, outlined the seminar's core themes. He emphasized that the rapid evolution of AI applications is accelerating the growth of wireless technologies. Today's diverse usage scenarios demand high bandwidth, robust stability, and ultra-low latency for seamless connectivity and data transmission. No single wireless technology can dominate the market, making multi-technology integration-including 5G RedCap, Wi-Fi, Bluetooth, and UWB-essential. Coupled with enhanced security measures, these innovations are critical to meeting the ever-increasing expectations of end-users.Adam Smith, Vice President of Marketing, LitePoint. Credit: LitePointRapid Progress in Multi-Technology Wireless Integration in the AI EraAdam Smith began by examining the current state of the 5G market. Drawing insights from Mobile World Congress (MWC), he noted that telecom operators remain cautious about 6G adoption, largely due to the slow return on investment from 5G. However, the global 5G Fixed Wireless Access (FWA) market has emerged as a game-changer, delivering fast and cost-effective high-speed network deployment solutions. This trend continues to gain traction among service providers, driving growth in the 5G FWA Customer Premises Equipment (CPE) segment, which is projected to achieve a 31.5% CAGR from 2024 to 2032.Meanwhile, the rise of Wi-Fi 7 and the upgrade cycle for mid-to-high-end networking equipment are fueling demand. With its significantly improved transmission speed and spectral efficiency, Wi-Fi 7 is accelerating the adoption of high-end routers in both residential and commercial environments. Market penetration is expected to exceed 10% in 2025, setting the stage for strong growth in 2026 and sparking anticipation for the upcoming Wi-Fi 8 standard.In addition, the Industrial Internet of Things (IIoT) is creating new opportunities through the convergence of low-speed, long-range wireless technologies with Wi-Fi. Solutions such as 5G RedCap, Bluetooth, and UWB are experiencing heightened demand, serving as the true engine behind the dynamic wireless communication market. To ensure seamless integration and performance, verification and testing of these technologies are critical. LitePoint’s advanced testing solutions play a pivotal role in enabling continuous AI-driven innovation and delivering exceptional user experiences.Wi-Fi 8: Ushering in an Era of "Ultra-High Reliability" Wireless ConnectivityJames Lin, Deputy General Manager of the Connectivity Technology Development Division at MediaTek, was invited to share the technical highlights of Wi-Fi 8. Reflecting on the 25-year evolution of Wi-Fi technology, he noted that transmission speeds have increased thousands of times. However, Wi-Fi 8's focus has shifted beyond mere speed to "Ultra-High Reliability" and multi-device connectivity, aiming to deliver a more stable and lower-latency wireless network environment, providing users with a tangible upgrade.James Lin, Deputy General Manager, Connectivity Technology Development Division, MediaTek. Credit: LitePointJames Lin highlighted four major innovations driving Wi-Fi 8:Enhanced Long Range (ELR): ELR addresses the asymmetry in transmission power between routers and end devices, eliminating the “visible but unreachable” issue. MediaTek has integrated its proprietary MediaTek Long Range (MLR) technology into Filogic Wi-Fi 7 chips, achieving the extended coverage promised by ELR. This advancement enables the Dimensity 9400 mobile chip to maintain connectivity up to 30 meters on the 2.4GHz band.Coordinated Spatial Reuse (Co-SR): By coordinating transmission power among routers, Co-SR optimizes time reuse and significantly improves Mesh network performance. MediaTek was first to implement Co-SR in its Filogic Wi-Fi 7 chips. In real-world Mesh topology tests, download speeds improved by 48%, while file download times dropped by 37.5%.Dynamic Sub-Channel Operation (DSO): Addressing the mismatch between large bandwidth support in routers (5GHz or 6GHz bands) and smaller bandwidth support in most end devices, DSO optimizes router bandwidth efficiency through frequency hopping techniques. Simulation results show up to an 80% increase in overall network speed.Non-Primary Channel Access (NPCA): NPCA leverages primary channel hopping to increase channel access opportunities, improving interference resistance and connection stability while maintaining compatibility with surrounding routers. Simulations show peak-hour speeds up by 67% and latency reduced by up to 92%.James Lin emphasized: "Wi-Fi 8 aims to create a harmonious, high-performance network environment for multiple devices-offering speed, stability, and reliability. MediaTek remains committed to innovation, standard-setting, and delivering products aligned with the latest specifications. Our upcoming Filogic Wi-Fi 8 solution targets Wi-Fi 8 certification, streamlining partner product approvals and accelerating the industry’s transition to ultra-reliable connectivity."As a global leader in wireless testing, LitePoint is dedicated to delivering precise RF testing solutions. The company will continue collaborating closely with MediaTek to validate Wi-Fi 8 technologies, ensuring exceptional chip quality and performance. Together, they aim to help the industry embrace a new era of ultra-reliable wireless connectivity-unlocking innovative applications and limitless possibilities.The Importance of Deploying Silicon Photonics and CPO Packaging Communication Chips with Multi-Channel Parallel TestingAlex Zhang, Asia Technical Sales Manager at Quantifi Photonics-a Teradyne subsidiary headquartered in Auckland, New Zealand-shared insights on multi-channel parallel testing solutions for silicon photonics chips and Co-Packaged Optics (CPO). With the industry anticipating significant growth in cloud data centers, demand for 800Gbps optical modules is expected to surge from 2026, with 1.6Tbps modules poised to become the next standard. However, as this market accelerates, the primary challenge lies in developing efficient testing solutions for optical modules from wafer to final assembly.Alex Zhang, Asia Technical Sales Manager, Quantifi Photonics. Credit: LitePointQuantifi Photonics specializes in testing Photonic Integrated Circuits (PICs), leveraging the PXI (PCI eXtensions for Instrumentation) platform to integrate high-frequency signal generators, high-speed sampling oscilloscopes, spectral analyzers, and other instruments for wafer-level PIC testing. Automated testing through high-speed optical-to-electrical I/O interfaces ensures accurate verification of optical interconnect performance.During his presentation, Alex demonstrated testing of CPO chip samples, showcasing the process from wafer-level packaging to PCBA assembly and optical fiber channel integration, forming a complete optical communication module test sample. The module under test featured 512 optical channel connections-a scale that would require several days if tested sequentially. This underscores the critical role of parallel testing design and verification in transforming CPO and silicon photonics module testing methodologies.Teradyne has successfully expanded its expertise from chip and wireless communication testing into optical communication systems, marking a strategic evolution in its technology roadmap.Wi-Fi 8 RF Performance Verified by the IQxel-MX Series for Real-World ReliabilityYoung Huang, Associate Director of Applications Engineering at LitePoint, discussed RF performance verification for Wi-Fi 8. He noted that Wi-Fi 8 builds upon Wi-Fi 7's architecture, retaining many RF specifications while introducing enhancements in spectrum utilization and interference mitigation-necessitating comprehensive RF testing coverage.Young Huang, Associate Director of Applications Engineering, LitePoint. Credit: LitePointCurrent verification focuses on coexistence with other wireless technologies across the 2.4GHz–6GHz bands, particularly optimizing the 6GHz spectrum, which supports 320MHz bandwidth and 4096-QAM modulation. Accurate simulation and interference testing are essential to validate real-world performance.Additionally, ensuring multi-device connectivity and low-latency performance requires analyzing spectrum conflicts and coordinated operations among multiple Access Points (APs). Wi-Fi 8 introduces new technical challenges, including Data Rate and Unequal Modulation techniques and dRU subcarrier testing, all supported by LitePoint's advanced Wi-Fi 8 testing systems.LitePoint has already begun initial preparations for Wi-Fi 8 sample testing, with physical chip testing expected in 2026 and Wi-Fi Alliance certification targeted for 2028. To address these challenges, LitePoint has deployed its IQxel series, led by the IQxel-MX platform, integrated with IQfact+ automated testing software. Customers will need to update their compliance frameworks to meet full RF performance requirements.Unleashing the Full Potential of 5G RedCap and eRedCapJohnson Li, Software Engineer, explored the growing adoption of the RedCap standard. The 3GPP Release 17 (R17) version targets wearable devices, industrial sensors, and security cameras, while the enhanced Release 18 (eRedCap) standard takes aim at broader IoT connectivity. By reducing bandwidth from 100MHz to 10MHz and adopting 1T1R/1T2R antenna configurations, eRedCap lowers costs by 40-60%, positioning RedCap as a major growth driver for 5G devices-particularly in the Asia-Pacific market, which is outpacing Europe and North America. This trend also accelerates 5G Standalone (SA) network deployment and lays the groundwork for 6G development.Johnson Li, Software Engineer, LitePoint. Credit: LitePointCurrently, operators in the U.S. and China have deployed RedCap networks, with strong government and industry support fueling market momentum. LitePoint's testing solutions, including Signaling (IQcell-5G) and Non-Signaling platforms, enable rapid advancement of 5G SA architectures and ensure seamless integration of RedCap technology.Next-Generation Bluetooth: Features, Testing Requirements, and Market OutlookJerry Chien, LitePoint Applications Engineer, analyzed the capabilities of Bluetooth 6.0, launched in 2024, highlighting its Channel Sounding positioning function, which achieves sub-meter accuracy -a critical feature for object-finding applications and enhanced personal item tracking.Jerry Chien, Applications Engineer, LitePoint. Credit: LitePointBluetooth has expanded beyond the 2.4GHz band, now leveraging 5GHz and 6GHz for improved anti-interference performance via spectrum switching. With market growth projected to triple between 2024 and 2028, Bluetooth 6.1 introduces new testing requirements to support Channel Sounding, creating significant market opportunities.LitePoint's testing of Channel Sounding positioning focused on PBR (phase-based ranging) along with Time of Flight (ToF). The IQxel-MW 7G and IQxel-MX platforms provide comprehensive testing for Bluetooth's Channel Sounding feature, helping clients accelerate next-generation product development.UWB 802.15.4.ab: Precision Ranging Gains MomentumChih Wei Huang, Associate Director of Applications Engineering, discussed Ultra-Wideband (UWB) micro-positioning technology and the testing challenges of the IEEE 802.15.4.ab standard. 802.15.4ab introduces a new narrowband signal, which is deployed at is lower frequency and higher power, to assist the UWB transmission. This enables the UWB positioning to operate at longer distances.Chih Wei Huang, Associate Director of Applications Engineering, LitePoint. Credit: LitePointTesting must address long-range performance, dynamic data rates, and RSF/RIF requirements. Narrowband signals' strong anti-noise capability enhances synchronization accuracy and stability between UWB devices. LitePoint offers the IQgig-UWB+ One-Box solution, along with FiRa 3.0 certification and CCC PHY compliance testing. Recent collaboration between the Connectivity Standards Alliance (CSA) and FiRa further strengthens UWB's future prospects.Collaborative Efforts in IIoT and Edge AI: Unlocking New OpportunitiesThe seminar concluded with a panel discussion moderated by Eric Huang, Deputy General Manager of DIGITIMES, featuring Glenn Farris (LitePoint VP of Global Sales), Adam Smith (LitePoint VP of Marketing), Jerry Chiang (Advantech Embedded IoT Business Group), and Bruce Chen (Qualcomm Staff Product Manager).The discussion focused on Edge AI opportunities in Industrial IoT (IIoT), highlighting applications in robotics, autonomous mobile robots (AMRs), smart healthcare, smart manufacturing, and smart cities. Key wireless technologies-Wi-Fi 7, GNSS, RedCap, and long-range low-speed protocols-will play pivotal roles. Integrating 5G and Wi-Fi to balance cost and performance is critical for smart mining and warehousing. The panel emphasized ecosystem collaboration to build next-generation industrial-grade wireless networks for Edge AI, accelerating deployment and unlocking transformative potential.(All photos in this article are provided by the LitePoint event.)
In 2025, LitePoint, a global leader in wireless testing solutions, hosted its "Smart Connectivity Unbounded · Testing Drives the Future" Innovative Testing Technology Seminar in Hsinchu and Taipei on September 23 and 24. This year’s event spotlighted cutting-edge testing and verification methods for diverse wireless communication technologies, setting new benchmarks for user experience and underscoring the transformative impact of wireless innovation.The seminar opened with a keynote address by Glenn Farris, LitePoint's Vice President of Global Sales, who warmly welcomed attendees and shared an overview of the latest advancements in testing technology. As a pioneer in wireless testing, LitePoint continues to deliver solutions that are fully connected, highly intelligent, and strongly compatible, enabling enterprises to overcome complex testing challenges and capitalize on emerging opportunities.Following this, Adam Smith, LitePoint's Vice President of Marketing, outlined the seminar's core themes. He emphasized that the rapid evolution of AI applications is accelerating the growth of wireless technologies. Today's diverse usage scenarios demand high bandwidth, robust stability, and ultra-low latency for seamless connectivity and data transmission. No single wireless technology can dominate the market, making multi-technology integration-including 5G RedCap, Wi-Fi, Bluetooth, and UWB-essential. Coupled with enhanced security measures, these innovations are critical to meeting the ever-increasing expectations of end-users.Adam Smith, Vice President of Marketing, LitePoint. Credit: LitePointRapid Progress in Multi-Technology Wireless Integration in the AI EraAdam Smith began by examining the current state of the 5G market. Drawing insights from Mobile World Congress (MWC), he noted that telecom operators remain cautious about 6G adoption, largely due to the slow return on investment from 5G. However, the global 5G Fixed Wireless Access (FWA) market has emerged as a game-changer, delivering fast and cost-effective high-speed network deployment solutions. This trend continues to gain traction among service providers, driving growth in the 5G FWA Customer Premises Equipment (CPE) segment, which is projected to achieve a 31.5% CAGR from 2024 to 2032.Meanwhile, the rise of Wi-Fi 7 and the upgrade cycle for mid-to-high-end networking equipment are fueling demand. With its significantly improved transmission speed and spectral efficiency, Wi-Fi 7 is accelerating the adoption of high-end routers in both residential and commercial environments. Market penetration is expected to exceed 10% in 2025, setting the stage for strong growth in 2026 and sparking anticipation for the upcoming Wi-Fi 8 standard.In addition, the Industrial Internet of Things (IIoT) is creating new opportunities through the convergence of low-speed, long-range wireless technologies with Wi-Fi. Solutions such as 5G RedCap, Bluetooth, and UWB are experiencing heightened demand, serving as the true engine behind the dynamic wireless communication market. To ensure seamless integration and performance, verification and testing of these technologies are critical. LitePoint’s advanced testing solutions play a pivotal role in enabling continuous AI-driven innovation and delivering exceptional user experiences.Wi-Fi 8: Ushering in an Era of "Ultra-High Reliability" Wireless ConnectivityJames Lin, Deputy General Manager of the Connectivity Technology Development Division at MediaTek, was invited to share the technical highlights of Wi-Fi 8. Reflecting on the 25-year evolution of Wi-Fi technology, he noted that transmission speeds have increased thousands of times. However, Wi-Fi 8's focus has shifted beyond mere speed to "Ultra-High Reliability" and multi-device connectivity, aiming to deliver a more stable and lower-latency wireless network environment, providing users with a tangible upgrade.？？？？？？？James Lin, Deputy General Manager, Connectivity Technology Development Division, MediaTek. Credit: LitePointJames Lin highlighted four major innovations driving Wi-Fi 8:Enhanced Long Range (ELR): ELR addresses the asymmetry in transmission power between routers and end devices, eliminating the “visible but unreachable” issue. MediaTek has integrated its proprietary MediaTek Long Range (MLR) technology into Filogic Wi-Fi 7 chips, achieving the extended coverage promised by ELR. This advancement enables the Dimensity 9400 mobile chip to maintain connectivity up to 30 meters on the 2.4GHz band.Coordinated Spatial Reuse (Co-SR): By coordinating transmission power among routers, Co-SR optimizes time reuse and significantly improves Mesh network performance. MediaTek was first to implement Co-SR in its Filogic Wi-Fi 7 chips. In real-world Mesh topology tests, download speeds improved by 48%, while file download times dropped by 37.5%.Dynamic Sub-Channel Operation (DSO): Addressing the mismatch between large bandwidth support in routers (5GHz or 6GHz bands) and smaller bandwidth support in most end devices, DSO optimizes router bandwidth efficiency through frequency hopping techniques. Simulation results show up to an 80% increase in overall network speed.Non-Primary Channel Access (NPCA): NPCA leverages primary channel hopping to increase channel access opportunities, improving interference resistance and connection stability while maintaining compatibility with surrounding routers. Simulations show peak-hour speeds up by 67% and latency reduced by up to 92%.James Lin emphasized: "Wi-Fi 8 aims to create a harmonious, high-performance network environment for multiple devices-offering speed, stability, and reliability. MediaTek remains committed to innovation, standard-setting, and delivering products aligned with the latest specifications. Our upcoming Filogic Wi-Fi 8 solution targets Wi-Fi 8 certification, streamlining partner product approvals and accelerating the industry’s transition to ultra-reliable connectivity."As a global leader in wireless testing, LitePoint is dedicated to delivering precise RF testing solutions. The company will continue collaborating closely with MediaTek to validate Wi-Fi 8 technologies, ensuring exceptional chip quality and performance. Together, they aim to help the industry embrace a new era of ultra-reliable wireless connectivity-unlocking innovative applications and limitless possibilities.The Importance of Deploying Silicon Photonics and CPO Packaging Communication Chips with Multi-Channel Parallel TestingAlex Zhang, Asia Technical Sales Manager at Quantifi Photonics-a Teradyne subsidiary headquartered in Auckland, New Zealand-shared insights on multi-channel parallel testing solutions for silicon photonics chips and Co-Packaged Optics (CPO). With the industry anticipating significant growth in cloud data centers, demand for 800Gbps optical modules is expected to surge from 2026, with 1.6Tbps modules poised to become the next standard. However, as this market accelerates, the primary challenge lies in developing efficient testing solutions for optical modules from wafer to final assembly.？？？？？？？Alex Zhang, Asia Technical Sales Manager, Quantifi Photonics. Credit: LitePointQuantifi Photonics specializes in testing Photonic Integrated Circuits (PICs), leveraging the PXI (PCI eXtensions for Instrumentation) platform to integrate high-frequency signal generators, high-speed sampling oscilloscopes, spectral analyzers, and other instruments for wafer-level PIC testing. Automated testing through high-speed optical-to-electrical I/O interfaces ensures accurate verification of optical interconnect performance.During his presentation, Alex demonstrated testing of CPO chip samples, showcasing the process from wafer-level packaging to PCBA assembly and optical fiber channel integration, forming a complete optical communication module test sample. The module under test featured 512 optical channel connections-a scale that would require several days if tested sequentially. This underscores the critical role of parallel testing design and verification in transforming CPO and silicon photonics module testing methodologies.Teradyne has successfully expanded its expertise from chip and wireless communication testing into optical communication systems, marking a strategic evolution in its technology roadmap.Wi-Fi 8 RF Performance Verified by the IQxel-MX Series for Real-World ReliabilityYoung Huang, Associate Director of Applications Engineering at LitePoint, discussed RF performance verification for Wi-Fi 8. He noted that Wi-Fi 8 builds upon Wi-Fi 7's architecture, retaining many RF specifications while introducing enhancements in spectrum utilization and interference mitigation-necessitating comprehensive RF testing coverage.？？？？？？？Young Huang, Associate Director of Applications Engineering, LitePoint. Credit: LitePointCurrent verification focuses on coexistence with other wireless technologies across the 2.4GHz–6GHz bands, particularly optimizing the 6GHz spectrum, which supports 320MHz bandwidth and 4096-QAM modulation. Accurate simulation and interference testing are essential to validate real-world performance.Additionally, ensuring multi-device connectivity and low-latency performance requires analyzing spectrum conflicts and coordinated operations among multiple Access Points (APs). Wi-Fi 8 introduces new technical challenges, including Data Rate and Unequal Modulation techniques and dRU subcarrier testing, all supported by LitePoint's advanced Wi-Fi 8 testing systems.LitePoint has already begun initial preparations for Wi-Fi 8 sample testing, with physical chip testing expected in 2026 and Wi-Fi Alliance certification targeted for 2028. To address these challenges, LitePoint has deployed its IQxel series, led by the IQxel-MX platform, integrated with IQfact+ automated testing software. Customers will need to update their compliance frameworks to meet full RF performance requirements.Unleashing the Full Potential of 5G RedCap and eRedCapJohnson Li, Software Engineer, explored the growing adoption of the RedCap standard. The 3GPP Release 17 (R17) version targets wearable devices, industrial sensors, and security cameras, while the enhanced Release 18 (eRedCap) standard takes aim at broader IoT connectivity. By reducing bandwidth from 100MHz to 10MHz and adopting 1T1R/1T2R antenna configurations, eRedCap lowers costs by 40-60%, positioning RedCap as a major growth driver for 5G devices-particularly in the Asia-Pacific market, which is outpacing Europe and North America. This trend also accelerates 5G Standalone (SA) network deployment and lays the groundwork for 6G development.？？？？？？？Johnson Li, Software Engineer, LitePoint. Credit: LitePointCurrently, operators in the U.S. and China have deployed RedCap networks, with strong government and industry support fueling market momentum. LitePoint's testing solutions, including Signaling (IQcell-5G) and Non-Signaling platforms, enable rapid advancement of 5G SA architectures and ensure seamless integration of RedCap technology.Next-Generation Bluetooth: Features, Testing Requirements, and Market OutlookJerry Chien, LitePoint Applications Engineer, analyzed the capabilities of Bluetooth 6.0, launched in 2024, highlighting its Channel Sounding positioning function, which achieves sub-meter accuracy -a critical feature for object-finding applications and enhanced personal item tracking.？？？？？？？Jerry Chien, Applications Engineer, LitePoint. Credit: LitePointBluetooth has expanded beyond the 2.4GHz band, now leveraging 5GHz and 6GHz for improved anti-interference performance via spectrum switching. With market growth projected to triple between 2024 and 2028, Bluetooth 6.1 introduces new testing requirements to support Channel Sounding, creating significant market opportunities.LitePoint's testing of Channel Sounding positioning focused on PBR (phase-based ranging) along with Time of Flight (ToF). The IQxel-MW 7G and IQxel-MX platforms provide comprehensive testing for Bluetooth's Channel Sounding feature, helping clients accelerate next-generation product development.UWB 802.15.4.ab: Precision Ranging Gains MomentumChih Wei Huang, Associate Director of Applications Engineering, discussed Ultra-Wideband (UWB) micro-positioning technology and the testing challenges of the IEEE 802.15.4.ab standard. 802.15.4ab introduces a new narrowband signal, which is deployed at is lower frequency and higher power, to assist the UWB transmission. This enables the UWB positioning to operate at longer distances.？？？？？？？Chih Wei Huang, Associate Director of Applications Engineering, LitePoint. Credit: LitePointTesting must address long-range performance, dynamic data rates, and RSF/RIF requirements. Narrowband signals' strong anti-noise capability enhances synchronization accuracy and stability between UWB devices. LitePoint offers the IQgig-UWB+ One-Box solution, along with FiRa 3.0 certification and CCC PHY compliance testing. Recent collaboration between the Connectivity Standards Alliance (CSA) and FiRa further strengthens UWB's future prospects.Collaborative Efforts in IIoT and Edge AI: Unlocking New OpportunitiesThe seminar concluded with a panel discussion moderated by Eric Huang, Deputy General Manager of DIGITIMES, featuring Glenn Farris (LitePoint VP of Global Sales), Adam Smith (LitePoint VP of Marketing), Jerry Chiang (Advantech Embedded IoT Business Group), and Bruce Chen (Qualcomm Staff Product Manager).The discussion focused on Edge AI opportunities in Industrial IoT (IIoT), highlighting applications in robotics, autonomous mobile robots (AMRs), smart healthcare, smart manufacturing, and smart cities. Key wireless technologies-Wi-Fi 7, GNSS, RedCap, and long-range low-speed protocols-will play pivotal roles. Integrating 5G and Wi-Fi to balance cost and performance is critical for smart mining and warehousing. The panel emphasized ecosystem collaboration to build next-generation industrial-grade wireless networks for Edge AI, accelerating deployment and unlocking transformative potential.(All photos in this article are provided by the LitePoint event.)
As the semiconductor industry braces for tighter supply and surging demand in 2026, NewPower Worldwide emerges as a critical partner for companies seeking stability and strategic insight. As the fastest-growing independent distributor - powered by its cutting-edge EMPOWER technology -NewPower delivers the global reach, sourcing intelligence, and agility needed to navigate an increasingly complex and fast-moving market.In the landscape of 2025, the electronics distribution industry presents significant opportunities and challenges. Demand across key sectors continues to climb, and by mid-year, it is anticipated that demand for certain critical products and manufacturers will exceed supply. This growing imbalance underlines the accelerating pace of the market and the need for businesses to remain both agile and prepared for what lies ahead. NewPower Worldwide consistently equips organizations with the real-time visibility and strategic sourcing capabilities necessary to anticipate these shifts before they escalate.The strong demand is being fueled by transformative advancements in artificial intelligence, high-performance computing (HPC), data centers, automotive innovation, and telecommunications. The global semiconductor industry is projected to reach $700 billion in 2025, setting a new record and keeping the industry on track to achieve $1 trillion in sales by 2030. The primary drivers of this growth are AI-powered applications, edge computing, and the increasing sophistication of automotive technologies. These trends are reshaping industries and creating unprecedented opportunities for growth and innovation. NewPower's EMPOWER platform provides customers with enhanced intelligence on these emerging trends, helping them secure high-demand components and reduce exposure to market volatility.The semiconductor industry is experiencing a remarkable period of expansion, with sales expected to grow by 15% in 2025. This growth is largely attributed to the increasing demand for high-end logic process chips and high bandwidth memory (HBM) required for AI applications. The memory segment, in particular, is forecasted to surge by more than 25%, driven by the adoption of advanced products like HBM3 and HBM3E for AI accelerators. Backed by its extensive global network and data-driven EMPOWER technology, NewPower helps customers identify availability, assess risk, and secure high-quality components in a tightening supply environment.In the automotive sector, semiconductor chips are playing a crucial role in enabling smarter, more connected, and autonomous vehicles. Companies such as Tesla, Qualcomm, and Infineon are at the forefront of integrating advanced semiconductor solutions into next-generation automobiles, enhancing capabilities such as full self-driving, advanced driver assistance systems, and improved energy efficiency in electric vehicles. NewPower supports these advancements by delivering reliable access to the automotive-qualified components that manufacturers depend on, along with strict quality control across every step of the supply chain.However, alongside this promise of growth there are substantial risks. Geopolitical tensions, cybersecurity threats, and economic uncertainty remain top concerns, while supply chain volatility continues to test businesses' resilience. In this complex environment, success demands not only bold, forward-thinking strategies but also a proactive approach to mitigating risks and ensuring adaptability. NewPower's risk-mitigation solutions, supported by EMPOWER and its extensive global footprint, enable customers to stay prepared, protected, and positioned for long-term success.Strategic partnerships will play a pivotal role in overcoming these challenges. NewPower Worldwide provides the expertise, global reach, and innovative tools necessary to navigate uncertainty, maintain operational flexibility, and stay focused on long-term goals. Collaboration is no longer just an option - it's a critical component of thriving in today's dynamic landscape.NewPower Worldwide delivers tailored solutions such as inventory management, strategic sourcing, and excess material strategies that help customers strengthen their supply chains and reduce uncertainty. By combining deep market knowledge with next-generation sourcing technology, NewPower empowers businesses to not only address immediate challenges but also position themselves for sustainable growth in an ever-changing industry.For more information, please visit offcial webiste.
As AI workloads move from cloud to edge, the volume of image and sensor data across industries is rising rapidly. Edge devices that previously relied on FPGAs and off-the-shelf modules are now running into combined constraints in power, latency, and cost. As models evolve from simple classification to more complex scene understanding, compute density at the edge has increased significantly over the past two years. Many startups and SMEs in the United States and China report that existing platforms can no longer support large-scale deployment.To address this pain point, Progate Group Corporation (PGC) has launched its Design Service Turnkey Platform to help customers migrate from FPGA-based acceleration to ASIC-based architectures.While most edge AI systems ultimately ship as system-on-chip (SoC) solutions, the ability to implement a dedicated ASIC architecture on the right process node - combining high compute density, low power consumption, and long-term supply – has become a critical condition for scaling edge AI.As a member of the TSMC Design Center Alliance (DCA), PGC has more than 30 years of experience on TSMC processes, with a strong track record in ASIC design, tape-out, and mass production on 22 nm, 12 nm, and 6 nm. The company has also built front-end and back-end design capabilities that extend to 3 nm. On these complex nodes, PGC provides its PGC Design Service Turnkey Platform to help customers bring edge AI SoCs into the ASIC phase in a more controlled and predictable way. Vision Inference AI SoCs: The Earliest Edge Workloads to Move to ASICImage inference workloads, driven by high-bandwidth and continuous data streams, are rapidly pushing the limits of FPGAs and general-purpose modules. As model complexity increases, latency, throughput and memory bandwidth have become the primary performance bottlenecks.Industry research indicates that there are already more than 200 startups in the United States focused on edge computing and computer vision, while over 100 companies in China are working on smart city, community surveillance, and industrial vision applications. Global forecasts further suggest that by 2030, vision-centric workloads will account for nearly half of the edge AI market and will be among the first segments to complete the transition from FPGAs and commercial modules to ASIC-based solutions.As edge AI expands across home, retail, logistics, urban infrastructure, and industrial control, requirements for low power, millisecond-level latency, stable memory bandwidth, and long-term component availability are becoming stricter. The success of an edge AI SoC therefore depends not only on advanced process nodes, but also on whether it integrates the right memory subsystem, high-speed I/O interfaces, and security modules and IP, so that the SoC can be fully optimized as an ASIC.Within the TSMC DCA ecosystem, advanced nodes are already showing a clear division of roles. 22ULP is well suited for battery-powered and long-standby home and outdoor devices. For edge AI devices on 22 nm, TSMC also offers embedded RRAM (ReRAM) to balance cost and yield. 7 nm and 6 nm nodes provide the integration density required to combine ISP, vision DSP, RISC-V cores, AI accelerators (NPU), memory subsystems (including memory controllers and DRAM PHYs), and security modules, making them preferred nodes for high-end edge ASICs.As resolutions and model complexity increase, LPDDR4X and DDR4 remain the mainstream memory for a large portion of edge cameras, while higher-end applications are moving to LPDDR5 to secure additional bandwidth. Whether these IP blocks can be integrated into a low-latency, high-throughput data path will directly determine whether a product can move from proof of concept (PoC) to stable volume production.PGC: An Integrated ASIC Design Service Turnkey Platform for Process, IP, and Supply ChainPGC’s Design Service Turnkey Platform is built as an integrated design service environment. Through the Synopsys IP OEM Program, PGC provides more competitive IP cost and licensing models, and can deliver complete memory subsystems for LPDDR5/LPDDR4X/DDR (including memory controllers and DRAM PHYs), as well as MIPI CSI-2/D-PHY image interface IP and PCIe high-speed I/O. The platform also supports low-latency architectures and security modules required by edge AI SoCs.At the same time, PGC maintains long-term collaboration with ASE and other OSAT partners. This allows the company to support the full flow from front-end design, back-end APR, design signoff, and tape-out, through small-volume, multi-project wafer (MPW/CyberShuttle) runs, all the way to NTO and high-volume production, ensuring stable capacity across different product phases.As edge AI gradually moves from product concepts to large-scale deployment, PGC will continue to deepen its integration of TSMC wafer processes, Synopsys IP, and ASE OSAT capabilities. The goal is to help startups and small to mid-sized companies around the world implement their edge AI ASIC strategies in a more efficient and controllable way, maintain long-term competitiveness through future technology transitions, and ultimately enable customer success.
The European Union Artificial Intelligence Act (EU AI Act) is set to be fully implemented in 2026, and the Cyber ？？Resilience Act (CRA) is scheduled for 2027. Adding the Radio Equipment Directive Delegated Act (RED-DA) already took effect on August 1, 2025, those three legislative measures collectively emphasize mandatory requirements for information security and cybersecurity.These regulations strengthen the comprehensive lifecycle management mechanisms for critical applications, IT components and telecommunications, impacting corporate strategies for complying with international information security standards while providing new opportunities for next-generation technological innovation. As a globally leading standards testing and certification organization, TUV NORD combines multiple international standards to meet comprehensive regulatory requirements, helping global enterprises address major challenges in AI, cybersecurity, and information security regulations.Eric Behrendt, Global Key Account Manager of TUV Information stechnik GmbH (TUVIT), and Chia-Hung Lin, Director of the Information Security Business Division at TUV NORD Taiwan, were jointly interviewed. This interview coincided with the relocation of TUV NORD Taiwan's testing laboratory to its new address in Kaohsiung City. Taking advantage of the new facility's inauguration. In addition to inviting industry customers to celebrate together, they introduced TUVIT's global organizational developments and its comprehensive assessment and verification services, helping Taiwan customers understand new information security standards and the laboratory's development to seize new market opportunities.TUVIT is an independent subsidiary within the TUV NORD Group, dedicated to the Digital and Semiconductor Business Unit, focusing on information security and data infrastructure resilience technologies. Established in 1995, TUVIT provides cybersecurity verification, testing, and consulting services, specializing in establishing information and networking security technology, testing hardware, software and certifying information security management systems. With the global industry's growing emphasis on and attention to semiconductor chips and network equipment information security standards compliance, TUVIT has established a robust information security environment to advance technological progress and ensure digital security.In partnership with TUV NORD Taiwan, TUVIT assists Asian semiconductor, electronics manufacturing, and OEM/ODM manufacturers in obtaining certifications for various international and national information security standards. This will include Germany Federal Office for Information Security (or named BSI) IT Baseline Protection to enhance cybersecurity with a structured framework for organizations to protect their IT systems effectively.TUV NORD Taiwan laboratory offers services for CC, FIPS 140, and FIDOTUV NORD Taiwan, together with TUVIT, has collaborated to help assisted 12 semiconductor customers in the Asia-Pacific region (across more than 20 factories) achieving the German BSI Common Criteria safety certification. TUV NORD Taiwan's Kaohsiung testing laboratory is the only laboratory in Taiwan equipped to certify three major international cybersecurity standards including Common Criteria (CC), the U.S. National Institute of Standards and Technology (NIST) FIPS 140-3 standard, and the Fast Identity Online (FIDO) standard.TUV NORD Taiwan has further expanded its services to include financial and industrial PC sectors, in addition to its existing work in semiconductors and networking, to help Taiwanese electronics manufacturers meet global compliance requirements. This expansion offers a broader range of services like product safety, information technology, and vendor assessment audits to support companies in navigating complex global standards.Meanwhile, TUVIT also has expanded more actively into emerging fields such as artificial intelligence and quantum computing certification services, which are key technologies poised to redefine problem-solving, innovation, and competitive landscapes. TUVIT supports companies in implementing these new requirements and contributes to the safety and reliability of emerging technologies in the post quantum era.As AI technologies become increasingly integrated into everyday business operations, ensuring ethical, transparent, and secure AI systems is very important. The AI Act is the first legal framework on AI, which addresses the risks of AI and positions Europe to play a leading role globally. Since 2018, BSI has reacted quickly to the rapid development in the field of artificial intelligence and created a framework that keeps pace with technological developments. This also includes intensive testing and the implementation of countermeasures. TUVIT carried out these tests and began developing and applying initial testing methods for AI applications at an early stage, Behrendt highlighted. He proudly stated that TUVIT continues to work closely with BSI to ensure compliant in AI devices keeping pace with rapid technological advancements.NIST Post-Quantum Cryptography Standards become a key role in Information security certificationUsing Quantum Key Distribution (QKD) technology as an example, Behrendt noted that the threat of quantum computer attacks on classical cryptographic mechanisms must be considered to ensure future-proof protection of information. QKD offers a promising solution by harnessing the principles of quantum mechanics to establish secure keys. TUVIT assists enterprises in following NIST-adopted Post-Quantum Cryptography (PQC) standards, providing industry testing and certification services to ensure their systems can withstand future quantum computer attacks.Of course, this also involves enterprises' information systems requiring continuous assessment and upgrades to adapt to the practical operational needs of new PQC algorithms. Current cutting-edge technological developments involving data transmission and remote data exchange all require secure certification mechanisms for assurance. TUVIT is working with global technical partners to develop testing technologies and equipment, enabling related certification work and standard development to proceed in parallel.Beyond facing new challenges such as QKD technology, customers currently face multiple certification requirements including CRA and EU AI Act standards, which inevitably leaves them feeling overwhelmed. Behrendt recently participates in three or more technical consultation meetings with customers regarding CRA standards almost every week. He observes that many customers neglect preparations from the initial stages of product design planning. He especially reminds customers of the importance of a secure internal product development framework that considers information security planning.Large or middle scale manufacturers meet multiple product line launch requirements by leveraging a common product development or manufacturing platforms that incorporates information security standards from the start. This enhances the security of specific environments and allows for the reuse of verification results when certifying products manufactured in those environments, thereby simplifying subsequent product certification processes, saving time and costs.Furthermore, regarding CRA and AI Act, he provides several strategic recommendations. First, priority attention should be given to CC for IT security evaluation and IEC 62443 for industrial automation system information security standards. Currently, these fundamental cybersecurity standards have become prerequisites for new products entering international markets. Furthermore, for consumer electronics product cybersecurity requirements, all security requirement items will require to follow ETSI/EN 303 645 IoT network security standards as important cybersecurity requirement guidelines.Since Taiwan's electronics industry consists major OEM/ODM manufacturers for global brands, TUV NORD Taiwan supports Taiwan's electronics supply chain by providing premium testing, inspection, certification, and consulting services to meet the specifications requested by global branding customers. These services help ensure that products comply with safety , quality, and cybersecurity standards across various industries, and contribute to market access and customer confidence.Behrendt sincerely advises Taiwan OEM/ODM customers that from the first day of designing products under CRA, they must consider security and information security design. If these requirements are not considered, ultimately they will still need to go back to resolve these compliance challenges. Once these basic requirements are overlooked, regulatory agencies for these new standards will impose high penalty as punishment, which will cause product brand name value and enterprises to suffer significant losses. Therefore, he recommends that enterprises need to take seriously and genuinely prepare response plans early and avoid violations. Passing certification and presenting evidence of proven effectiveness is the best product compliance strategy.FIPS 140-3 Cryptographic Module and Software Testing Compliance GuidelinesGovernment agencies in the United States and Canada require FIPS 140-series certification for cryptographic products, while Taiwan's requirements align with this international standard. This certification is mandatory for products used to protect sensitive information and ensures that cryptographic modules have been independently tested and validated for security.Since cryptographic applications involving information exchange and sharing are not limited to hardware or software, as long as they participate in encryption and decryption operations, they need to pass FIPS 140-3 certification. For example, the systems including operating system software, semiconductor chips, network routers, firewalls, and other hardware devices all require to grant the requiring certification.TUV NORD Taiwan's cryptographic module testing laboratory in Kaohsiung is the only local laboratory specifically providing testing and consulting services for this standard. Teddy Tsui, Senior Manager and FIPS 140 Lab Director, introduced that TUV NORD Taiwan laboratory obtained FIPS laboratory certification in 2014. This laboratory is also the only one in Taiwan recognized by NIST, serving ASIA customers for over ten years with expertise in the cybersecurity field. Currently, the laboratory can perform FIPS 140-3 testing for three types of cryptographic validation including hardware cryptographic modules, software algorithms, and entropy sources. Meanwhile, this lab also provides customer consulting and educational training.Credit: TUV NORDTsui explained that the Cryptographic and Security Testing (CST) laboratory only conducts testing and issues test reports for a FIPS 140 standard certification. But the NIST is the authority that issues the formal certification or validation. Talking about the time consuming for hardware cryptographic modules, the process will include checking design process documentation, functional testing, and even code inspection are required.The average time for a FIPS 140-3 certification for hardware cryptographic modules is approximately from 18-month to 2-year, largely due to a backlog caused by the transition from FIPS 140-3 and the high volume of requests, which contributes to the extended waiting period. But software algorithm testing is relatively faster. The laboratory uses software verification programs, expecting to complete testing in two to three weeks. Since NIST released three PQC standards for algorithms that can resist quantum computer attacks in August 2024: FIPS 203 (for key encapsulation), FIPS 204 (for digital signatures), and FIPS 205 (for hash-based digital signatures). These algorithms are now available for certification testing.NIST estimates that quantum computers could threaten current cryptography in the next 10 years, leading to risks for long-term sensitive data through the "harvest now, decrypt later" attack. This involves attackers collecting encrypted data today and decrypting it in the future when a powerful enough quantum computer becomes available.Tsui also frankly stated, FIPS 140 standards for software algorithm testing will require re-testing when PQC algorithms are updated. Customers will face challenges in migrating their systems. The main challenges include the complexity of inventorying all cryptographic systems, integrating the new algorithms into products, and the long timeline for the transition, which requires careful management and strategic planning.TUV NORD Taiwan Leverages Localization Advantages with Rich Experience Serving Taiwanese ManufacturersFurthermore, Chia-Hung Lin, Director of the Information Security Business Division at TUV NORD Taiwan, especially emphasized the importance of information products passing CC verification. The requirement starts from the entire product development lifecycle to ensure cybersecurity every stage of the manufacturing process receives complete protection.The evaluation process of CC certification will include Site Certification where product development or manufacturing occurs. This is ensuring that the physical and procedural environment where a product is developed or manufactured meets security standards, protecting design data and products throughout their lifecycle. These audits are crucial steps in the evaluation, as it validates the developer's claims about product security and confirms the integrity of the entire supply chain, not just the final product itself. Meanwhile, Site Certification also saves time and money for re-audits by allowing a single certification to cover multiple products developed or manufactured at that site. Currently, the major semiconductor fabs and OSAT vendors in Taiwan have obtained Site Certification with TUV NORD Taiwan's assistance.Among the experience of serving Taiwanese customers for decades, most notably, Lin pointed out one real case for customer support in Taiwan. The COVID-19 pandemic induced systemic disruptions by semiconductor shortage for the auto industry during the years in 2020. At that time, Taiwan government has implemented strict border quarantine for all passengers. A Taiwanese semiconductor fab manufacturing automotive chips urgently needed certification but caused delays for the quarantine policy with TUVIT German auditors and professionals. TUV NORD Taiwan's team overcame difficulties and communicated with the government, resulting in a breakthrough that allowed German auditors perform audits on time to certify this Taiwanese customer. This case becomes an important case in TUV NORD Taiwan's customer support history.TUV NORD Taiwan maintains an important market reputation and actively maintains long-term relationships with customers. Combined with the unique and important value demonstrated by the localized laboratory - not just testing equipment, but also the extensive practical experience and know-how accumulated over the years - TUV NORD Taiwan's services have earned customer trust. With Global information security product opportunities to increase Asian manufacturing by helping companies diversify supply chains, TUV NORD Taiwan aims to partner with Taiwan clients to leverage new business opportunities that arise from information security standards. This partnership focuses on helping customers to seize the critical business opportunities on the growing importance of cybersecurity by ensuring compliance with standards, protecting sensitive data, and maintaining business resilience.Credit: TUV NORD
NEXCOM International, a global leader in rugged edge computing platforms, and Stereolabs, a pioneer in AI vision and 3D perception, announced a long-term collaboration to deliver cutting-edge AI vision solutions for B2B organizations across mobility, robotics, and industrial automation sectors. The integration of Stereolabs' ZED X series cameras with NEXCOM's ATC series Edge AI computers makes deploying intelligent visual systems faster, more reliable, and more scalable than ever.Stereolabs' latest ZED SDK 5.1, powered by TERRA AI, offers breakthrough perception capabilities, optimizing spatial awareness and system efficiency. These enhancements make the ZED X series ideal for advanced AI vision applications where precision and responsiveness are mission-critical:5x faster depth sensing and up to 300% processing load reduction on NVIDIA Jetson platformsSharper depth accuracy in challenging conditions such as low light, fog, or reflective surfacesMagellan, Stereolabs' new localization technology, delivering centimeter-level precision both indoors and outdoors NEXCOM's ATC series of Edge AI computers are built for extreme environments where ruggedization and reliability are essential. This, along with NEXCOM's expertise in designing tailored solutions for physical AI deployments, makes for a powerful integration with Stereolabs' solutions for some of the most complex needs of industrial organizations. Key features of NEXCOM's ATC series include:IP67-rated design: Resistant to dust, water, vibration, and extreme temperatures,AI acceleration: Powered by NVIDIA Jetson modules for real-time edge inference,Industry compliance: Certified with E13 and EN50155 standards for transportation and industrial applications,Vehicle integration: Built-in IGN control and smart power management,Multi-camera support: Capable of processing high-speed, low-latency video streams.Accelerating AI vision across key B2B industriesNEXCOM's and Stereolabs' collaboration empowers critical use cases for B2B organizations across industrial and mobility sectors seeking to introduce AI Vision to drive efficiency and safety:Public transit: Mobile surveillance, infotainment systems, and passenger analytics,Robotics: industrial robots, robotic arms, AMR, Quadruped, and humanoid visual sensors,Public safety: static/mobile ANPR, enforcement monitoring, civil/emergency services,Industrial automation: predictive maintenance, defect detection, blind-spot monitoring,Material handling: enhanced monitoring for ports, warehouses, and fleet operations,Earth moving & mining: rugged AI deployments in construction, agriculture, and mining environmentsBy combining NEXCOM's ruggedized hardware with Stereolabs' advanced AI vision technology, businesses can accelerate AI implementation in complex real-world environments. This collaboration reduces technical barriers and enables scalable deployment of AI vision systems tailored for industrial and commercial success."This collaboration comes at the right time," said Jay Liu, Vice President, NEXCOM. "By combining NEXCOM's ATC edge computing platform with Stereolabs' ZED AI vision stack, we're enabling robust perception solutions that transition seamlessly from prototype to large-scale deployment,""With ZED SDK 5.1 and TERRA AI, we're pushing the boundaries of physical perception: enabling cameras that not only see better in complex environments, but also understand the world with unprecedented intelligence, paving the way for new classes of smarter systems," said Cecile Schmollgruber, CEO of Stereolabs.The integration of Stereolabs' ZED X series cameras with NEXCOM's ATC series Edge AI computers makes deploying intelligent visual systems faster, more reliable, and more scalable than ever. Credit: NEXCOM
From TSMC to SK hynix, every Q3 2025 earnings call delivered the same sobering message, the AI build-out is being throttled by three physical choke points that no amount of 2025 capex can fix fast enough. Leading-edge foundry, HBM memory, and advanced packaging are all sold out, not just for next quarter, but for the next three to five years. Here’s exactly where the wall is.High-Bandwidth Memory (HBM): The New KingmakerHBM has become the single most important component in the AI hardware stack and the scarcest. It’s no longer something you buy. It is something you reserve 18–24 months in advance and hope your allocation sticks.Reading the Q3 reports, Industry leaders have been blunt:SK hynix CFO Kim Jae-joon: "We have already sold out our entire 2026 HBM supply… supply expected to remain tight compared to demand into 2027."Micron CEO Sanjay Mehrotra: "Our HBM capacity for calendar 2025 and 2026 is fully booked."Samsung Memory: "Customers' demand for next year will exceed our supply, even considering our investment and capacity expansion plan."The consequences are cascading across the industry.The ripple effects are hitting the whole industry. Next-gen platforms like Blackwell Ultra, Rubin, AMD MI400, and everything coming after are now stuck behind memory limits. GPU and AI server lead times have stretched to 12–18 months, BOM costs are climbing, and procurement teams are buried in broker spreadsheets.Even worse, HBM expansion is eating into conventional DRAM. DDR5, LPDDR5, and even older DRAM lines are getting squeezed, setting up surprise shortages in laptops, smartphones, and cars through 2026.HBM has officially become the choke point for the entire AI sector.CoWoS Advanced Packaging: The Real Limit on GPU SupplyYou can have perfect 3 nm chiplets and pristine HBM stacks but without a CoWoS slot, you're holding an extremely expensive paperweight.TSMC’s CoWoS-L/S/R processes are what bind chiplets and HBM cubes using massive interposers and through-silicon vias. That assembly step, not silicon, is now the single most critical governor on AI GPU output.TSMC CEO C.C. Wei: "Our CoWoS capacity is very tight and remains sold out through 2025 and into 2026."NVIDIA CEO Jenson Huang: "CoWoS assembly capacity is oversubscribed through at least mid-2026," directly delaying volume Blackwell Ultra ramps.TSMC is expanding CoWoS capacity by roughly 60% in 2025 and 50% in 2026, but every new cleanroom module is spoken for long before it opens. AMD, Broadcom, Google, Amazon, Meta, everyone is fighting over the same finite packaging slots.Leading-Edge Foundry (3 nm/2 nm): Locked Up Until Late 2020sIf you didn't secure N3E or N2 production capacity back in 2023, you're effectively locked out.TSMC has been explicit:TSMC CEO C.C. Wei: "Frontend and backend capacity for leading-edge nodes is extremely tight… Customers' demand for the next year will exceed our supply, even considering our investment and capacity expansion plan."Apple consumed the bulk of N3 capacity for 2024–2025. What remained was divided among NVIDIA, AMD, Broadcom, and a handful of hyperscalers. TSMC's upcoming 2 nm fabs in Arizona and Kaohsiung won't reach meaningful output until late 2026 or early 2027, and much of that is already pre-allocated.Samsung's GAA roadmap is still trailing on yield and power efficiency, leaving nearly the entire industry dependent on a single geographic region.For any AI startup or any new chip program that didn't book capacity during the 2023–2024 scramble, the earliest possible tape-out now lands around 2028–2029.The Zero-Slack Era: 2026–2027 Demand Already 30–50% Above Planned SupplyThe most chilling part? Every CEO said the same thing, almost word-for-word:TSMC: "We are working very hard to narrow the gap between demand and supply."SK hynix, Micron, Samsung, Intel, NVIDIA-all echoed that even after $200 billion+ of collective capex, supply will still fall 20–50% short of demand in 2026 and 2027.If you are tired of hearing "fully booked through 2027" and watching your roadmaps slip quarter after quarter, talk to Fusion Worldwide. We specializes in AI ICs procurement, providing real-time visibility into ICs availability across all major manufacturers. Our E-commerce platform delivers instant availability checking, automated quote management, and rapid fulfillment capabilities that help procurement teams secure critical storage components even in constrained markets.Don’t wait for the next earnings call to tell you the gap got worse. Get Out In Front, Move now.(Article Sponsored by Alan Chew, Global Director of Strategic Accounts, Fusion Worldwide, Singapore)
Global computing power is growing aggressively and pushing high-density chip power consumption. As this power density increases, traditional air cooling is reaching its physical limits, and once-fringe liquid cooling technology, boasting thermal efficiency hundreds of times greater than air cooling, is rapidly becoming core infrastructure.Driven by global sustainability targets and the need for high-performance, energy-efficient infrastructures, new large data centers must achieve their targeted PUE values, accelerating the industry towards large-scale liquid cooling. However, reliability issues stemming from insufficient mechanical tolerances at the connection points of liquid cooling systems are becoming a critical bottleneck for energy efficiency upgrades and stable operation. Southco recognizes the severity of this challenge and is committed to providing breakthrough solutions.Minor Deviations, Major CostsDuring the large-scale deployment of liquid cooling technology, the reliability of connection interfaces is vital. According to key data from the Open Compute Project (OCP) "Rack-Mounted Manifold Requirements and Verification Guidelines," a mere 1mm increase in mechanical deviation at liquid cooling interfaces can significantly raise system flow resistance by 15%, leading to a 7% increase in pump energy consumption!This is no trivial amount; in a hyperscale data center with thousands of interfaces, it translates to millions of kilowatt-hours of additional energy consumption and substantial operational costs each year. More concerning is that traditional rigid connection solutions typically offer only ±0.5mm of static tolerance, which proves inadequate in complex real-world environments like these:1. Accumulation of Multi-Dimensional Installation Deviations: In mixed deployment scenarios of widely used EIA-310-D standard racks and advanced ORV3 open architectures, rack installation tolerances can accumulate up to ±3.2mm, far exceeding the limits of traditional solutions.2. Dynamic Vibration Impacts: In ISTA 3-E vibration tests simulating real transportation and operating environments, interface displacement often exceeds 2.8mm, posing significant risks of leaks or connection failures.3. Material Thermal Expansion Effects: Under a typical temperature change of 55°C, copper alloy manifolds can expand approximately 1.2mm per meter, continuously challenging fixed interfaces.These dynamic, multi-dimensional deviations underline the urgent need for an intelligent, reliable sealing connection solution to ensure the long-term, efficient, and safe operation of liquid cooling systems.Blind Mate Quick Disconnect: A Connection for a Dynamic WorldAs a century-old expert in precision engineering, Southco confronts this challenge head-on with the launch of the revolutionary new "Blind Mate Floating Mechanism" liquid cooling connection solution. This innovation is not just a new product; it is a systematic response to profound insight into industry pain points.Current Status and Trends of Blind Mate Floating TechnologyLiquid cooling technology is rapidly gaining traction in high-performance computing (HPC), AI training clusters, and hyperscale data centers. Blind mate technology allows devices to connect without precise visual alignment, making it a core interface solution for rapid deployment and efficient maintenance in liquid cooling systems (especially cold plate systems). The development trends are clear:1. Higher Tolerance Capacity: Adapting to more complex rack environments and dynamic changes is essential.2. Increased Reliability: Zero leakage, long lifespan, and resistance to extreme conditions are basic requirements.3. Intelligent Integration: Integrating sensors for flow, temperature, pressure, etc., for real-time monitoring and predictive maintenance is a future direction.4. Standardization and Compatibility: Supporting OCP ORV3 and other open standards for seamless integration across platforms and manufacturers.Standard ISO 11926-1 threaded interface design, compatible with OCP UQD/UQDB connectors, and custom designs are available.5. Lightweight and Compact Design: Meeting the demands of higher density deployments.Southco's Blind Mate Floating Mechanism exemplifies innovative design centered around these core trends.Advantages Over Traditional SolutionsCompared to traditional fixed or simple floating heat transfer connection solutions, Southco's "Blind Mate Floating Mechanism" offers a qualitative leap with advantages evident across multiple dimensions.1. Three-Dimensional Dynamic Tolerance Control: Southco’s innovative design features a groundbreaking three-dimensional dynamic compensation mechanism: ±4mm of floating tolerance in the radial direction (2° tilt compensation) and 6mm of displacement absorption capacity in the axial direction. This far exceeds common static tolerances in the industry, effectively absorbing and adapting to all previously mentioned installation tolerances, vibration displacements, and thermal expansion deformations.2. Self-Centering Mechanism: When the liquid-cooled blind-plug connector is unplugged, the floating structure automatically resets to the center position, ensuring sufficient floating space for plugging and unplugging operations, fully meeting the strict tolerance requirements of OCP and ORV3 standards.3. Outstanding Sealing Performance for Long-Term Operation: Products endure rigorous ASME B31.3 standard 300psig burst pressure tests, ensuring over 10 years of service life, providing long-term stability for data centers, an achievement traditional solutions cannot match.4. Efficient Maintenance and Significant Cost Reduction: Featuring the Universal Quick Disconnect Blind (UQDB) interface, the design enables genuine "blind operations," allowing server maintenance without precise alignment or specialized tools. Quick disconnect capabilities make server replacement or upgrades as convenient as "hot plugging," reducing downtime and related losses by over 90%.Blind Mate Floating Mechanism. Credit: SouthcoThe Necessity of Blind Mate Floating MechanismIn AI computing clusters and next-generation data centers, adopting advanced connection solutions like Southco's "Blind Mate Floating Mechanism" is no longer optional, but essential.1. Key to Overcoming Cooling Bottlenecks: High power density is an inevitable trend; traditional cooling and rigid connections can no longer meet the demand. The Blind Mate Floating Mechanism is foundational for unleashing the full potential of liquid cooling and ensuring efficient, stable operation of cooling systems.2. Cornerstone of Business Continuity: The costs of data center downtime are immense. The rapid, reliable thermal maintenance supported by the Blind Mate Floating Mechanism is vital for ensuring uninterrupted operation of critical business activities 24/7.3. Core to Achieving Green and Low-Carbon Goals: Minor deviations in connectors leading to increased flow resistance can significantly elevate pump energy consumption. Its high-tolerance, low-flow resistance design directly contributes to lowering data center PUE values, making it an important element in energy conservation and emissions reduction goals.4. Flexibility for Future Expansion and Upgrading: Modular and standardized design enables data centers to expand capacity and upgrade equipment more flexibly, easily accommodating future increases in computing power demand and technological iterations.Continuous Innovation, Intelligent Cooling AheadAccording to the "Open Rack V3" white paper, liquid cooling penetration in hyperscale data centers is expected to exceed 40% by 2025. Southco continues to invest in R&D to iterate floating mechanism technology:1. Exploring lightweight high-performance materials (like PPSU thermoplastic) to reduce weight while maintaining strength.2. Advancing intelligent sensor integration for real-time monitoring of key parameters like flow and temperature, providing data for predictive maintenance and energy efficiency optimization.3. Deepening ecosystem collaboration and standardization to promote liquid cooling interfaces in higher density, lower TCO, and broader applications.As liquid cooling technology transitions from optional to essential, Southco's "Blind Mate" represents a precision engineering product innovation, and a profound understanding of cooling challenges in the data center industry. By integrating over a century of precision mechanical design expertise with innovative three-dimensional dynamic tolerance control technology, Southco strives to help global data centers break through cooling bottlenecks, building a more efficient, reliable, and greener foundation for computing power, empowering infinite possibilities in the digital age.For more information, please click here for more details.
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced a collaboration with VSORA to deliver turnkey ASIC design services supporting the onschedule tapeout of the Jotunn8 datacenter AI inference processor. Through this partnership, GUC showcased deep capability in complex chiplet architectures and HBM3E integration using 2.5D advanced packaging technology, reinforcing the company's strength in accelerating customer innovation with optimized performance and efficiency.Jotunn8 is VSORA's flagship AI-inference chip, engineered exclusively for inference workloads rather than training. It delivers ultra-low latency and very high throughput by overcoming the memory wall bottleneck, making large-scale, cost-efficient AI deployment viable.GUC delivered comprehensive design services for Jotunn8, managing the entire process from netlistin through manufacturing. The solution integrates GUC's Advanced Packaging Technology (APT) IP portfolio, including 17.2 Gbps GLink-2.5D die-to-die interconnect and 8.4 Gbps HBM3E PHY & Controller, leveraging 3x-reticle 2.5D advanced packaging and 5nm process technology.GUC's contributions included complex physical design, chiplet partitioning and integration, as well as cooptimization of signal, power, and thermal integrity (SI/PI/TI). The team also achieved considerable IR and power optimization, enabling superior power efficiency and overall system performance. This collaboration positions VSORA to meet the demanding compute and bandwidth requirements of hyperscale datacenter inference workloads and underscores GUC's leadership as a trusted partner for AI and HPC ASIC development."Jotunn8 is Europe's first HBM-equipped datacenter inference processor, delivering unprecedentedoptimization across speed, efficiency, and scalability," said Khaled Maalej, Founder and CEO of VSORA. "GUC's excellence in physical design, die-to-die and HBM IP performance, and advanced packaging expertise played a pivotal role in achieving this milestone tape-out. Their rigorous engineering discipline and collaborative mindset have been instrumental in turning our ambitious vision into silicon reality.""GUC is honored to help bring VSORA's advanced AI processor to market," said Patrick Wang,Vice President and Chief Sales Officer at GUC. "VSORA's 2.5D design presented significant technical complexity. By combining their groundbreaking innovations with GUC's engineering excellence in advanced process and packaging technologies, we successfully enabled the Jotunn8 tape-out milestone. We look forward to supporting VSORA's vision for high- performance inference at scale and partnering on future generations of AI processors."Building on this success, VSORA and GUC are advancing the frontiers of AI compute. By combining deep innovation with execution excellence, the partnership paves the way for a new era of scalable, energy-efficient AI solutions for global data centers.For more information about GUC, please visit.For more information about VSORA, please visit.
