D-Wave has spent 26 years building one type of quantum computer. This week it told a Taipei audience why it started building another.

India's PC market grew steadily in the second quarter of 2026, but the gain appears to reflect stocking by retailers, businesses, and distributors as much as end-user demand. The trend signals how supply pressures and pricing changes can reshape device markets far beyond India.

Taiwan's National Science and Technology Council (NSTC) has budgeted NT$3.76 billion (US$116.58 million) for a quantum computer system project, while the Industrial Technology Research Institute (ITRI) will spend NT$14.6 billion with support from the Ministry of Economic Affairs (MOEA) on a 2027 technology program that includes building a key quantum computing technology verification platform.

As Acer marks its 50th anniversary in 2026, Chairman and CEO Jason Chen said at the company's next@acer global press event during IFA in Berlin, Germany, that the PC maker's four future growth drivers are PCs, smart healthcare, smart living, and sustainability. He said the roadmap underscores Acer's stature as an international brand and its continued ambition.

Acer used its next@acer global press conference in Berlin during IFA to unveil a broad lineup of new products, highlighting its push into AI, sustainability, thin-and-light notebooks, e-paper, handheld gaming devices, electric scooters, and the Acer SFF RTX Spark desktop design powered by the NVIDIA RTX Spark superchip.

Infineon said the rapid buildout of AI data centers and emerging Physical AI applications could reshape semiconductor demand worldwide. The shift signals higher infrastructure spending, faster power technology adoption, and new competition in robotics, vehicles, and industrial systems that may influence future chip markets and supply chains.

Niching Industrial is expanding its heat-spreader capacity as AI and high-performance computing demand pushes up orders across the global semiconductor supply chain. The company said larger stamping equipment, tighter plating control, and future liquid-cooling technologies are being developed to support chips that generate more heat in data centers worldwide.

Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with 1.6T product samples already tested and volume-production equipment due from late 2026 through the first quarter of 2027. Chairman I-hsin Tung said recent optical throughput tests exceeded industry benchmarks, with revenue contribution expected in the second half of 2027.

Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift is increasing the need for metrology, inspection, and failure analysis, and Zeiss is planning a semiconductor innovation center in northern Taiwan to support validation and application development.

Solomon Technology, a Taiwanese artificial intelligence (AI) 3D vision company, is showcasing two key inspection applications that integrate its core AI vision and optical technologies at Semicon Taiwan 2026. The applications include full-wafer warpage detection inside front-opening unified pods (FOUP)/cassettes and through-glass via (TGV) aperture defect inspection technology, aimed at preventing equipment downtime during manufacturing processes and ensuring the yield and quality of next-generation advanced packaging.