At MWC 2026 in Barcelona, Taiwanese electronics companies are highlighting how AI, edge computing, and next-generation connectivity are converging to reshape telecom and enterprise networks, with a strong focus on practical deployments across industry, cloud, and public infrastructure.
Japan's PC market began 2026 with an unexpected jolt, as shipments plunged at their fastest pace in 30 months, abruptly ending a 19-month streak of year-over-year growth and catching industry players off guard.
South Korean fintech startup Softment is set to expand into Taiwan following rapid domestic growth, bringing its QR code and NFC-based ordering and payment solutions to the market. The company aims to capture the international tourism segment by offering multilingual menus, cross-border payment options, and seamless POS integration, enhancing both the customer experience and merchant efficiency.
Recent media reports suggest that Apple may finally be preparing to bring its Apple Pay service to India, marking a potentially significant shift in one of the world's largest digital payments markets.
Meta's push to design its own AI chips has reportedly hit major technical and strategic setbacks, forcing the company to scrap its most ambitious in-house training processor and lean more heavily on external suppliers, according to The Information.
As data center computing demand expands, high-speed transmission architectures are under pressure to upgrade. Scaling high-performance computing platforms is exposing bandwidth and power consumption as core bottlenecks in data transmission and switching, elevating the role of optical interconnects and silicon photonics (SiPh). With support from AI chip leader Nvidia, the notion of optics gradually replacing copper has moved to the center of industry debate.
Below are the most-read DIGITIMES Asia stories from the week of Feb 3 - Mar 1, 2026.
A trilateral semiconductor model is emerging, combining Japan's capital, Taiwan's ecosystem expertise, and India's talent. Alongside this, companies including Foxconn, Polymatech Electronics, Nvidia, AMD, Kaynes Semicon, and IBM are deepening India investments, reflecting rising localization, supply-chain ambitions, and expanding AI, packaging, and materials ecosystems despite policy and trade uncertainties.
Google has announced that robotics software company Intrinsic will join its operations as a distinct unit within the company, a move aimed at accelerating the deployment of artificial intelligence in physical systems such as industrial robotics. The integration reflects Google's effort to extend AI beyond digital applications into real-world environments and scale practical physical automation solutions.
Nvidia's next-generation Vera Rubin platform has moved from public unveiling to early customer sampling, with the company projecting a broader production ramp later this year. Both the company and its partners, however, face a complex array of engineering, supply-chain, and data center infrastructure challenges before Rubin can displace prior architectures as the industry standard for large-scale artificial intelligence.
Despite no signs of a slowdown in AI infrastructure investments by global cloud service providers (CSPs), debates about a potential AI bubble persist. BizLink CEO Felix Teng emphasized that the focus should shift from AI itself to the underlying demand for computing power and the broader infrastructure investment cycle.
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