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Jul 13, 11:25

Exclusive: China's notebook ODMs are closing in fast on Taiwan's manufacturing crown

Notebook ODMs enjoyed stronger-than-seasonal demand in the first half of 2026, but the traditional peak season is losing momentum. Shipments are expected to decline sequentially from the third quarter, while component suppliers increasingly view 2026 as a turning point in the global notebook supply chain.

Trump admin reportedly urged Apple to procure chips from Intel in exchange for dropping tariffs

Jul 13, 15:28

Tencent seeks control of Manus after China blocks Meta's US$2 billion AI deal

Jul 13, 13:58

Meta, MediaTek, TSMC push AI chips to challenge Google

Jul 13, 12:39

China's Nvidia H200 pivot reveals why CUDA still rules AI

Jul 13, 10:46

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ICT MANUFACTURINGPegatron June revenue rose 15.9% on server shipments and AI expansion

Jul 13, 14:35

Pegatron reported June revenue of NT$91.296 billion (US$28.43 billion), up 15.9% year over year and down 4.9% from May, as shipments increased on the gradual rollout of its new server business. The Taiwan-based electronics manufacturer said the business mix shift had helped deliver double-digit annual growth for two straight months, while management expects AI-related revenue to keep rising steadily in 2026.

AITSMC June 2026 revenue surges 68% as AI demand continues to fuel growth

Jul 13, 14:28

TSMC reported another month of strong revenue growth, underscoring continued demand for advanced chips used in AI applications. According to the company's June revenue report, consolidated revenue reached NT$442.68 billion (approx. US$13.8 billion) in June, up 6.2% month-over-month and 67.9% year-over-year. For the first six months of 2026, revenue totaled NT$2.4 trillion, representing a 35.6% year-over-year increase.

AIMiniMax bets US$2 billion on AI infrastructure as lock-up selloff deepens its split with Z.ai

Jul 13, 13:51

Chinese artificial-intelligence developer MiniMax is raising HK$16 billion (approx. US$2.04 billion) through a share placement and convertible bonds to accelerate spending on AI infrastructure and large-model development, pressing ahead with its most capital-intensive phase even as its Hong Kong-listed stock slides and a lock-up expiry unleashes fresh selling. The move underscores how far MiniMax's fortunes have diverged from those of rival Zhipu, the other big Chinese AI name to list in Hong Kong this year.

IT COMPONENTS, PERIPHERALSTrans-Sun Materials posts record revenue on AI server and HPC demand

Jul 13, 12:03

Trans-Sun Materials Technology posted record revenue for June, the second quarter and the first half of 2026, supported by rising demand for AI servers and high-performance computing (HPC) applications. June consolidated revenue rose 40.83% year on year to NT$163 million (US$5.43 million), second-quarter revenue increased 28.22% to NT$441 million, and first-half revenue climbed 28.43% to NT$820 million, all record highs for their respective periods.

IT COMPONENTS, PERIPHERALSApple reportedly accelerates AI chip roadmap as next-gen Macs prioritize neural processing

Jul 13, 10:54

Apple is reshaping its Mac chip roadmap to prioritize AI, accelerating development of future processors as the company seeks to strengthen its position in the AI era.

AIWeekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

Jul 13, 10:48

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at the centre of this week's tech agenda.

IT COMPONENTS, PERIPHERALSNvidia's HVDC shift could reshape data center power chains worldwide

Jul 13, 10:25

Nvidia's move toward high-voltage direct current (HVDC) power systems for artificial intelligence (AI) data centers could alter how global servers are built and powered. The shift aims to cut energy losses and improve efficiency, but it also raises questions about safety, design, and the supply chain that may determine which technologies gain the fastest adoption.

AIEurope, UK, and US financial sectors respond differently as advanced AI reshapes industry and regulation

Jul 13, 09:56

Advanced artificial intelligence (AI) is becoming a growing focus for financial regulators and technology companies across Europe, the UK, and the US, with authorities placing increasing attention on cybersecurity, consumer protection, and industry expansion.

PC, CEAcer posts 13-year second-quarter revenue high on PC and diversified growth

Jul 13, 08:06

Acer reported June consolidated revenue of NT$27.818 billion (US$864.8 million), up 6.3% from May, as the Taiwanese PC maker posted its strongest second-quarter revenue in 13 years. Second-quarter consolidated revenue reached NT$85.296 billion, rising 28.2% year on year, while first-half revenue climbed 23.3% to NT$157.727 billion.

ICT MANUFACTURINGIndia roundup: India's chip strategy tests its ability to build a competitive ecosystem

Jul 13, 07:54

India is moving from semiconductor planning to execution, using funding, tariff changes, foreign investment approvals, and regional development efforts to build a broader electronics ecosystem beyond assembly.

ICT MANUFACTURINGSuperAlloy revenue climbs on recycled aluminum and semiconductor certification progress

Jul 13, 07:53

SuperAlloy Industrial posted June consolidated revenue of NT$749 million (US$23.36 million), up 17.93% from May and 21.46% from a year earlier. The Taiwan-based materials maker said the increase helped lift second-quarter 2026 revenue to NT$1.98 billion, a 15.45% rise from a year earlier, while first-half 2026 revenue reached NT$3.852 billion, up 6.02%.

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Interview: Why Geckos bets materials, not chips, will decide the next AI performance leap

As generative AI fuels rapid growth in demand for high-performance computing (HPC), the semiconductor industry is shifting from a process race to a materials race. Geckos chairman Shen Tsung-huan says that as chip manufacturing moves to 2nm and even more advanced nodes, gains in AI computing power are no longer just a chip design issue, but are increasingly constrained by the thermal conductivity and high-frequency signal transmission capabilities of materials.

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