Winbond back on track for 0.11-micron development

Hans Wu, Taipei; Noah Sauve, DIGITIMES Asia Thursday 20 December 2001 0

Alex Wang, corporate vice-president of Winbond Electronics, said the company has reconsidered advancing to 0.11-micron DRAM processing and is now discussing a possible technology transfer with Infineon Technologies. This news comes just a few months...

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