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Amkor: Outsourced IC packaging and testing to double in three years

Amy Lee, Taipei; Steve Shen, DIGITIMES Asia Wednesday 17 September 2003 0

The global market for outsourced IC packaging and testing is likely to balloon to US$10.5 billion in 2005 from US$5.7 billion in 2002, as packaging and testing costs rise as a proportion of total production costs and demand for advanced packaging services...

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