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STMicroelectronics introduces 20A and 30A power MOSFETs in high thermal efficiency compact package

Press release; Eric Mah, DIGITIMES Asia Friday 28 April 2006 0

STMicroelectronics today announced its first power devices to be assembled in the metal topped PolarPAK package, which provides superior thermal performance and increased power density for components used in high current power supplies. The new STK800...

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