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Northbridge migration from PBGA to FC packages on hold until cost drops

Amy Lee, Hsinchu; Carrie Yu, DIGITIMES Asia Thursday 18 May 2006 0

The migration from plastic ball-grid array (PBGA) to flip-chip (FC) packaging for northbridge chips will not proceed much further this year, as VIA Technologies, ATI Technologies and Nvidia will continue using PBGA packaging for their solutions, according...

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