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PBGA substrate shortage may disrupt SiS and VIA chipset shipments

Amy Lee, Hsinchu; Jessie Shen, DIGITIMES Asia Tuesday 6 September 2005 0

Because supplies of plastic ball-grid array (PBGA) substrates will continue to be short of demand throughout the end of this year, Taiwan chipset makers Silicon Integrated Systems (SiS) and VIA Technologies may face difficulties in fulfilling large...

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