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IC packaging houses looking to copper due to high price of gold

Ingrid Lee, Singapore; Adam Hwang, DIGITIMES Asia Wednesday 7 May 2008 0

Taiwan-based IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) as well as Amkor and STATS ChipPAC are developing copper-wire bonding processes to replace conventional processes based...

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