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Kinsus gross margin hits record-low in 2Q; expects rebound in 3Q

Ingrid Lee, Taipei; Esther Lam, DIGITIMES Asia Monday 28 July 2008 0

Despite recording a record-low gross margin in the second quarter of 2008, IC substrate supplier Kinsus Interconnect Technology expects a recovery for flip-chip chip-scale packaging (FC-CSP) demand in the second half and gross margin should also enhance...

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