Taiwan-based IC substrate makers Unimcron, Na Ya PCB and Kinsus Interconnect Technology are actively proceeding with capacity expansions for ABF substrates in 2020 to meet robust...

Taiwan-based IC substrates suppliers are poised to benefit from Apple's move to adopt both TSMC's InFO_AiP (antenna in package) technology and ASE's FC_AiP process to package its...

IC substrate makers Nan Ya PCB and Kinsus Interconnect are both expected to post significant revenue and profit increases in 2020 as robust demand from segments of smartphones, servers,...

Taiwan IC substrate makers will have no time to lose in expanding their ABF substrate capacities as demand for such substrates will grow substantially in 2020 and beyond along with...

As US leading chipmakers and system vendors are gearing up to commercialize their mmWave technologies, TSMC reportedly has landed a big order from Apple for processing handset antenna...

Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen their shipments ramp up in most of fourth-quarter 2019 with...

Taiwanese PCB maker Zhen Ding Technology (ZDT) and Austrian peer AT&S are expected to together land at least 50-60% of substrate-like PCB orders for Apple's next iPhones to be...

Global shipments of TWS (true wireless stereo) earphones are expected to surge sharply to 150-200 million sets in 2020 from around 100 million sets estimated for 2019, providing strong...

Taiwan's Kinsus Interconnect Technology and Nan Ya PCB are both reportedly among SiP (system in package) substrate suppliers for Apple's just-unveiled AirPods Pro series, which adopt...

ABF substrates have seen robust demand for processing 5G networking chips and high-performance computing chips since the start of 2019, but shipments of BT substrates for mobile chips...

IC substrate suppliers are moving to allocate part of their substrate-like PCBs (SLP) capacity to support production of ABF substrates that see robust demand, according to industry...

Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand...

Flexible PCB manufacturer Fuyang Technology, a joint venture between Pegatron and Kinsus Interconnect Technology, has reportedly entered the supply chain of Apple.

Among supply chain partners for iPhones, Taiwan's PCB makers have suffered significantly from the devices' latest wave of lackluster sales, with flexible board suppliers Zhen Ding...

Taiwan IC backend service firms have seen increasing flip-chip packaging orders from China chipmaker HiSilicon now actively carrying out volume production of pre-5G chip products,...

IC substrate supplier Kinsus Interconnect Technology's net profits fell 78% on year to NT$491 million (US$16.8 million) in 2017. EPS for the year came to NT$1.10, down from NT$5.01...

As GPU suppliers AMD and Nvidia showcase their prowess at CES 2018, back-end service providers, such as Siliconware Precision Industries (SPIL) and King Yuan Electronics, are expected...

IC substrate supplier Kinsus Interconnect Technology saw its October revenues climb to a record high of NT$2.48 billion (US$82.3 million).

Apple has seen an over 50% sequential increase in Apple Watch Series 3 sales in the fiscal quarter ended September 30, and some market watchers expect that Apple is likely to add...

IC substrate supplier Kinsus Interconnect Technology has reported net profits of NT$476 million (US$15.8 million) for the first three quarters of 2017, down 72.7% on year, with EPS...

IC substrate maker Kinsus Interconnect Technology is expected to enjoy an up to 20% sequential increase in fourth-quarter 2017 revenues, driven mainly by a ramp-up of orders for substrate-like...

IC substrate maker Kinsus Interconnect Technology has reported net profits for the first half of 2017 declined 82.1% from a year earlier to NT$199 million (US$6.6 million). EPS for...

There will be no delay for the launch of the next generation iPhone devices, with the new devices to be unveiled in September, and Apple will begin selling the products in October,...

IC substrate maker Kinsus Interconnect Technology has announced net profits for 2016 fell 23.1% to NT$2.23 billion (US$71.8 million). The earnings translated into a net EPS of NT$5...

PCB and FPCB maker Zhen Ding Technology Holding has stepped into the development of substrate-like PCB (SLP) products in order to cope with demand from smartphone vendors, particularly...