CONNECT WITH US

Diamond wire saws to become mainstream in solar wafer slicing in 2 years

Nuying Huang, Taipei; Willie Teng, DIGITIMES Asia 0

With the shortage of silicon carbonide, a material for traditional solar wafer slicing, and the potential for lower costs and higher production, diamond wire saw technology could become the mainstream in silicon ingot slicing in two years, according...

The article requires paid subscription. Subscribe Now