Sematech, the global consortium of chipmakers, has announced Taiwan Semiconductor Manufacturing Company's (TSMC) decision to join it as a core member.
TSMC will join Sematech to collaborate on semiconductor R&D for IC process technologies for 20nm generation and beyond, including extreme ultra-violet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and to develop critical infrastructure vital for next-generation manufacturing, including the transition to 450 mm wafer size.
"This relationship further reflects our commitment to push the boundaries of innovation and deliver leading-edge technology to our customers," said Jack Sun, VP and CTO, Research and Development of TSMC. "This complementary cooperation leverages Sematech's collaborative approach to lead critical industry technology transitions, with TSMC's position as an industry leader in advanced technology development and manufacturing."
Sematech's other core members include Globalfoundries, Hewlett-Packard (HP), IBM, Intel, Samsung Electronics, United Microelectronics Corporation (UMC) and the College of Nanoscale Science and Engineering (CNSE).
Sematech manages an international network of world-leading collaborative partners, including foundries, IDMs, fabless, packaging and assembly companies and material and equipment suppliers, to provide industry-wide solutions to the challenges of chip manufacturing.