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Chipbond lands 8-inch gold bumping orders from Samsung, says paper

Commercial Times, June 4; Steve Shen, DIGITIMES Asia Monday 4 June 2012 0

LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third quarter of 2012, according to a Chinese-language Commercial Times...

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